IP Library Granted Patent US 10,579,271
Granted Patent B2
US 10,579,271 · App. 16/431,789 · Granted Mar 3, 2020

Nonvolatile semiconductor memory device

Inventor: Takuya Futatsuyama (Yokohama, JP)
Assignee: Toshiba Memory Corporation
G06F3/061G06F3/0619G06F3/0652G06F3/0656G06F3/0679G06F3/0688G11C11/5628G11C16/045G11C16/0408G11C16/0483G11C16/10G11C16/3418G11C2211/5648
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Quick Facts
Patent No.
US 10,579,271
App. No.
16/431,789
Granted
Mar 3, 2020
Kind
B2
Abstract

A nonvolatile semiconductor memory device comprises a cell unit including a first and a second selection gate transistor and a memory string provided between the first and second selection gate transistors and composed of a plurality of serially connected electrically erasable programmable memory cells operative to store effective data; and a data write circuit operative to write data into the memory cell, wherein the number of program stages for at least one of memory cells on both ends of the memory string is lower than the number of program stages for other memory cells, and the data write circuit executes the first stage program to the memory cell having the number of program stages lower than the number of program stages for the other memory cells after the first stage program to the other memory cells.

Claims (80)

1. A nonvolatile semiconductor memory device, comprising:

a cell unit including:

a first selection gate transistor,

a second selection gate transistor, and

a plurality of serially-connected memory cells provided between the first selection gate transistor and the second selection gate transistor; and

a data write circuit configured to execute a writing operation to write data to the memory cells;

wherein

the memory cells include:

a first memory cell connected with a first word line and capable of being programmable in D 1 stages to thereby store data of D 1 bits, D 1 being an integer of 1 or more,

a second memory cell connected with a second word line and capable of being programmable in D 2 stages to thereby store data of D 2 bits, D 2 being an integer of 3 or more and greater than D 1 , the second memory cell being closer to the first selection gate transistor than the first memory cell,

a third memory cell connected with a third word line and capable of being programmable in D 3 stages to thereby store data of D 3 bits, D 3 being an integer of 3 or more and greater than D 1 , the third memory cell being closer to the first selection gate transistor than the second memory cell, and

a fourth memory cell connected with a fourth word line and capable of being programmable in D 4 stages to thereby store data of D 4 bits, D 4 being an integer of 3 or more and greater than D 1 , the fourth memory cell being closer to the first selection gate transistor than the third memory cell; and

the data write circuit executes:

a first program on the third memory cell as a first one of the D 3 stages,

a second program on the fourth memory cell as a second or higher one of the D 4 stages, after the first program,

a third program on the second memory cell as a first one of the D 2 stages, after the second program,

a fourth program on the third memory cell as a second or higher one of the D 3 stages, after the third program,

a fifth program on the first memory cell as a first one of the D 1 stages, after the fourth program, and

a sixth program on the second memory cell as a second or higher one of the D 2 stages, after the fifth program.

2. The nonvolatile semiconductor memory device according to claim 1 , wherein

the sixth program on the second memory cell is performed as the second one of the D 2 stages, and

the data write circuit further executes

a seventh program on the second memory cell as a third or higher one of the D 2 stages, after the sixth program.

3. The nonvolatile semiconductor memory device according to claim 2 , wherein

the second program on the fourth memory cell is performed as the second one of the D 4 stages,

the fourth program on the third memory cell is performed as the second one of the D 3 stages, and

the data write circuit further executes

an eighth program on the fourth memory cell as a third or higher one of the D 4 stages, after the third program and before the fifth program, and

a ninth program on the third memory cell as a third or higher one of the D 3 stages, after the fifth program and before the seventh program.

4. The nonvolatile semiconductor memory device according to claim 1 , wherein

D 1 is 1,

D 2 is 3,

D 3 is 3, and

D 4 is 3.

5. The nonvolatile semiconductor memory device according to claim 1 , wherein

the cell unit further includes:

a first dummy cell having a structure same as one of the memory cells between the second selection gate transistor and the first memory cell, and

a second dummy cell having a structure same as one of the memory cells between the first selection gate transistor and the fourth memory cell.

6. The nonvolatile semiconductor memory device according to claim 1 , further comprising:

a source line connected to a source of the first selection gate transistor; and

a bit line connected to a drain of the second selection gate transistor.

7. A nonvolatile semiconductor memory device, comprising:

a cell unit including:

a first selection gate transistor,

a second selection gate transistor, and

a plurality of serially-connected memory cells provided between the first selection gate transistor and the second selection gate transistor, and

a data write circuit configured to execute a writing operation to write data to the memory cells;

wherein

the memory cells include:

a first memory cell connected with a first word line and capable of being programmable in D 1 stages to thereby store data of D 1 bits, D 1 being an integer of 1 or more,

a second memory cell connected with a second word line and capable of being programmable in D 2 stages to thereby store data of D 2 bits, D 2 being an integer of 3 or more and greater than D 1 , the second memory cell being closer to the first selection gate transistor than the first memory cell,

a third memory cell connected with a third word line and capable of being programmable in D 3 stages to thereby store data of D 3 bits, D 3 being an integer of 3 or more and greater than D 1 , the third memory cell being closer to the first selection gate transistor than the second memory cell, and

a fourth memory cell connected with a fourth word line and capable of being programmable in D 4 stages to thereby store data of D 4 bits, D 4 being an integer of 3 or more and greater than D 1 , the fourth memory cell being closer to the first selection gate transistor than the third memory cell; and

the data write circuit executes:

a first program on the third memory cell as a second or lower one of the D 3 stages,

a second program on the fourth memory cell as a final one of the D 4 stages, after the first program,

a third program on the second memory cell as a second or lower one of the D 2 stages, after the second program,

a fourth program on the third memory cell as a final one of the D 3 stages, after the third program,

a fifth program on the first memory cell as a first or higher one of the D 1 stages, after the fourth program, and

a sixth program on the second memory cell as a final one of the D 2 stages, after the fifth program.

8. The nonvolatile semiconductor memory device according to claim 7 , wherein

the third program on the second memory cell is performed as the second one of the D 2 stages, and

the data write circuit further executes

a seventh program on the second memory cell as a first one of the D 2 stages, before the first program.

9. The nonvolatile semiconductor memory device according to claim 8 , wherein

the first program on the third memory cell is performed as the second one of the D 3 stages, and

the data write circuit further executes

an eighth program on the third memory cell as a first one of the D 4 stages, before the seventh program.

10. The nonvolatile semiconductor memory device according to claim 7 , wherein

D 1 is 1,

D 2 is 3,

D 3 is 3, and

D 4 is 3.

11. The nonvolatile semiconductor memory device according to claim 7 , wherein

the cell unit further includes:

a first dummy cell having a structure same as one of the memory cells between the second selection gate transistor and the first memory cell, and

a second dummy cell having a structure same as one of the memory cells between the first selection gate transistor and the fourth memory cell.

12. The nonvolatile semiconductor memory device according to claim 7 , further comprising:

a source line connected to a source of the first selection gate transistor; and

a bit line connected to a drain of the second selection gate transistor.

Assignments (3)
MERGER Recorded Jan 22, 2021
From: TOSHIBA MEMORY CORPORATION
To: K.K. PANGEA
Reel/Frame 055659/0471 →
CHANGE OF NAME AND ADDRESS Recorded Jan 22, 2021
From: TOSHIBA MEMORY CORPORATION
To: KIOXIA CORPORATION
Reel/Frame 055669/0001 →
CHANGE OF NAME AND ADDRESS Recorded Jan 22, 2021
From: K.K. PANGEA
To: TOSHIBA MEMORY CORPORATION
Reel/Frame 055669/0401 →
Priority Claims (1)
JP 2009-98416 · Apr 14, 2009 · national
Continuity (8)
Continuation 15903629 · Feb 23, 2018
Continuation 15462300 · Mar 17, 2017
Continuation 15166895 · May 27, 2016
Continuation 14707908 · May 8, 2015
Continuation 14075400 · Nov 8, 2013
Continuation 13711894 · Dec 12, 2012
Continuation 12724636 · Mar 16, 2010
Related Publication 20190286323A1 · Sep 19, 2019
Cited By (1)
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