IP Library Granted Patent US 10,937,482
Granted Patent B2
US 10,937,482 · App. 16/432,250 · Granted Mar 2, 2021

Memory cells and arrays of elevationally-extending strings of memory cells

Inventors: Ankit Sharma (Boise, ID); Haitao Liu (Boise, ID); Albert Fayrushin (Boise, ID); Akira Goda (Boise, ID); Kamal M. Karda (Boise, ID)
Assignee: Micron Technology, Inc.
G11C11/22H01L27/1052H01L27/11502
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Quick Facts
Patent No.
US 10,937,482
App. No.
16/432,250
Granted
Mar 2, 2021
Kind
B2
Abstract

A memory cell comprises channel material, insulative charge-passage material, programmable material, a control gate, and charge-blocking material between the programmable material and the control gate. The charge-blocking material comprises a non-ferroelectric insulator material and a ferroelectric insulator material comprising hafnium, zirconium, and oxygen. Other embodiments are disclosed.

Claims (89)

1. A memory cell comprising:

channel material;

insulative charge-passage material;

programmable material;

a control gate; and

charge-blocking material between the programmable material and the control gate, the charge-blocking material comprising:

a non-ferroelectric insulator material;

a ferroelectric insulator material comprising hafnium, zirconium, and oxygen; and

metal material between the non-ferroelectric insulator material and the ferroelectric insulator material, the metal material being between the non-ferroelectric insulator material and the ferroelectric insulator material to everywhere preclude the non-ferroelectric insulator material and the ferroelectric insulator material from physically contacting each another.

2. A plurality of memory cells, the memory cells individually comprising:

a pair of source/drain regions having channel material extending there-between, the pair of source/drain regions and the channel material defining a current flow path that extends from one edge of one of the pair of source/drain regions through the channel material to one edge of the other of the pair of source/drain regions;

insulative charge-passage material;

programmable material;

a control gate; and

charge-blocking material between the programmable material and the control gate, the charge-blocking material comprising:

a non-ferroelectric insulator material;

a ferroelectric insulator material comprising hafnium, zirconium, and oxygen; and

the ferroelectric insulator material is discontinuous parallel the current flow path in the channel material, the non-ferroelectric insulator material is continuous parallel the current flow path in the channel material.

3. A memory cell comprising:

channel material;

insulative charge-passage material;

programmable material;

a control gate; and

charge-blocking material between the programmable material and the control gate, the charge-blocking material comprising:

a non-ferroelectric insulator material;

a ferroelectric insulator material; and

metal material between the non-ferroelectric insulator material and the ferroelectric insulator material, the metal material being between the non-ferroelectric insulator material and the ferroelectric insulator material to everywhere preclude the non-ferroelectric insulator material and the ferroelectric insulator material from physically contacting each another.

4. A memory cell comprising:

channel material extending vertically or within 10° of vertical;

insulative charge-passage material;

programmable material;

a control gate; and

charge-blocking material between the programmable material and the control gate, the charge-blocking material comprising:

a non-ferroelectric insulator material;

a ferroelectric insulator material;

metal material between the non-ferroelectric insulator material and the ferroelectric insulator material, the metal material being between the non-ferroelectric insulator material and the ferroelectric insulator material to everywhere preclude the non-ferroelectric insulator material and the ferroelectric insulator material from physically contacting each another; and

the ferroelectric insulator material being thinner than the non-ferroelectric insulator material.

5. An array of elevationally-extending strings of memory cells, comprising:

a stack comprising vertically-alternating insulative tiers and conductive tiers, the conductive tiers comprising control-gate material having terminal ends corresponding to control-gate regions of individual memory cells,

programmable material of the individual memory cells extending elevationally along individual of the control-gate regions;

charge-blocking material of the individual memory cells extending elevationally along the individual control-gate regions between the programmable material and the individual control-gate regions, the charge-blocking material comprising:

a non-ferroelectric insulator material;

a ferroelectric insulator material; and

metal material between the non-ferroelectric insulator material and the ferroelectric insulator material, the metal material being between the non-ferroelectric insulator material and the ferroelectric insulator material to everywhere preclude the non-ferroelectric insulator material and the ferroelectric insulator material from physically contacting each another;

transistor channel material of the individual memory cells extending elevationally along the programmable material; and

insulative charge-passage material extending elevationally along the programmable material between the transistor channel material and the programmable material.

6. A memory cell comprising:

channel material;

insulative charge-passage material;

programmable material;

a control gate; and

charge-blocking material between the programmable material and the control gate, the charge-blocking material comprising:

a non-ferroelectric insulator material;

a ferroelectric insulator material comprising hafnium, zirconium, and oxygen; and

the ferroelectric insulator material is discontinuous between edges of the control gate parallel a straight-line direction of current flow in the channel material; and

metal material between the non-ferroelectric insulator material and the discontinuous ferroelectric insulator material, the metal material being between the non-ferroelectric insulator material and the ferroelectric insulator material to everywhere preclude the non-ferroelectric insulator material and the discontinuous ferroelectric insulator material from physically contacting each another.

7. A plurality of memory cells, the memory cells individually comprising:

a pair of source/drain regions having channel material extending there-between, the pair of source/drain regions and the channel material defining a current flow path that extends from one edge of one of the pair of source/drain regions through the channel material to one edge of the other of the pair of source/drain regions, the current flow path being entirely straight between the one edges of the pair of source/drain regions;

insulative charge-passage material;

programmable material;

a control gate; and

charge-blocking material between the programmable material and the control gate, the charge-blocking material comprising:

a non-ferroelectric insulator material;

a ferroelectric insulator material comprising hafnium, zirconium, and oxygen; and

the ferroelectric insulator material is discontinuous parallel the entirely straight current flow path in the channel material, the non-ferroelectric insulator material is continuous parallel the current flow path in the channel material.

8. A memory cell comprising:

a pair of source/drain regions having channel material extending there-between, the pair of source/drain regions and the channel material defining a current flow path that extends from one edge of one of the pair of source/drain regions through the channel material to one edge of the other of the pair of source/drain regions;

insulative charge-passage material;

programmable material;

a control gate;

charge-blocking material between the programmable material and the control gate, the charge-blocking material comprising:

a non-ferroelectric insulator material;

a ferroelectric insulator material comprising hafnium, zirconium, and oxygen; and

the ferroelectric insulator material is discontinuous parallel the current flow path in the channel material; and

the control gate has a pair of edges that are vertical in a vertical cross-section, the discontinuous ferroelectric insulator material having at least one outermost vertical edge in the vertical cross-section that is not coincident with either of the vertical edges of the control gate in the vertical cross-section.

9. The memory cell of claim 8 wherein the discontinuous ferroelectric insulator material has only one outermost vertical edge in the vertical cross-section that is not coincident with either of the vertical edges of the control gate in the vertical cross-section.

10. The memory cell of claim 8 wherein the non-ferroelectric insulator material is continuous parallel the current flow path in the channel material.

11. A memory cell comprising:

a pair of source/drain regions having channel material extending there-between, the pair of source/drain regions and the channel material defining a current flow path that extends from one edge of one of the pair of source/drain regions through the channel material to one edge of the other of the pair of source/drain regions, the current flow path being entirely straight between the one edges of the pair of source/drain regions;

insulative charge-passage material;

programmable material;

a control gate;

charge-blocking material between the programmable material and the control gate, the charge-blocking material comprising:

a non-ferroelectric insulator material;

a ferroelectric insulator material comprising hafnium, zirconium, and oxygen;

the ferroelectric insulator material is discontinuous parallel the entirely straight current flow path in the channel material; and

the control gate has a pair of edges that are vertical in a vertical cross-section, the discontinuous ferroelectric insulator material having at least one outermost vertical edge in the vertical cross-section that is not coincident with either of the vertical edges of the control gate in the vertical cross-section.

12. The memory cell of claim 11 wherein the discontinuous ferroelectric insulator material has only one outermost vertical edge in the vertical cross-section that is not coincident with either of the vertical edges of the control gate in the vertical cross-section.

13. The memory cell of claim 11 wherein the non-ferroelectric insulator material is continuous parallel the current flow path in the channel material.

Assignments (1)
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Jun 5, 2019
From: SHARMA, ANKIT; LIU, HAITAO; FAYRUSHIN, ALBERT; GODA, AKIRA; KARDA, KAMAL M.
To: MICRON TECHNOLOGY, INC.
Reel/Frame 049380/0576 →
Cited By (8)
US 12,256,547 US 12,402,319 US 12,520,496 US 12,550,382 US 12,615,769 US 12,660,250 US 12,682,953 US 12,694,931