Compositions and methods using same for deposition of silicon-containing film
Described herein are compositions and methods using same for forming a silicon-containing film such as without limitation a silicon carbide, silicon nitride, silicon oxide, silicon oxynitride, a carbon-doped silicon nitride, a carbon-doped silicon oxide, or a carbon doped silicon oxynitride film on at least a surface of a substrate having a surface feature. In one aspect, the silicon-containing films are deposited using a compound comprising a carbon-carbon double or carbon-carbon triple bond. The plasma source employed comprises both a remote plasma source and an in-situ plasma source operating in combination.
1. A method for depositing a silicon-containing film in a flowable chemical vapor deposition process, comprising:
placing a substrate comprising a surface feature into a reactor at a first temperature ranging from −20° C. to about 100° C.;
introducing 1500 mg/min into the reactor a composition consisting of tetravinylsilane
providing a plasma source into the reactor to at least partially react the at least one compound to form a flowable liquid oligomer;
wherein the flowable liquid oligomer at least partially fills at least a portion of the surface feature; and
wherein the plasma source comprises both a 3000 W remote plasma source and a 200 W in-situ plasma source operating simultaneously during deposition, and wherein the remote plasma is an ammonia plasma, and the in-situ plasma is an ammonia plasma.
2. The method of claim 1 , further comprising treating the flowable liquid at a second temperature ranging from about 100° C. to about 1000° C. to cure the oligomer and form a hardened film.
3. The method of claim 2 , wherein the film has at least one of the following characteristics: i) a film tensile stress ranging from about 150 to about 190 MPa after a UV cure, and ii) a density ranging from about 1.35 to about 2.10 g/cm 3 .
4. The method of claim 1 , wherein a pressure of the reactor is maintained at 100 torr or less.
5. The method of claim 1 , wherein the silicon-containing film is selected from the group consisting of silicon carbide, silicon nitride, silicon oxide, carbon doped silicon nitride, carbon doped silicon oxide, silicon oxynitride, and carbon doped silicon oxynitride film.
6. The method of claim 1 , wherein the in-situ plasma source is a capacitively-coupled in-situ plasma.
7. The method of claim 1 , wherein the silicon-containing film has a surface and a bulk, wherein the surface has a first nitrogen content measured by X-ray Photoelectron Spectroscopy and the bulk has a second nitrogen content measured by X-ray Photoelectron Spectroscopy, and wherein the first nitrogen content is approximately equivalent to the second nitrogen content.
8. The method of claim 7 , wherein the surface has a first carbon content measured by X-ray Photoelectron Spectroscopy and the bulk has a second carbon content measured by X-ray Photoelectron Spectroscopy, and wherein the first carbon content is less than the second carbon content.
9. The method of claim 8 , wherein the surface has a first oxygen content measured by X-ray Photoelectron Spectroscopy and the bulk has a second oxygen content measured by X-ray Photoelectron Spectroscopy, and wherein the first oxygen content is greater than the second oxygen content.
10. The method of claim 9 , wherein the surface has a first silicon content measured by X-ray Photoelectron Spectroscopy and the bulk has a second silicon content measured by X-ray Photoelectron Spectroscopy, and wherein the first silicon content is approximately equivalent to the second silicon content.
11. The method of claim 10 , wherein the first silicon content is less than the second silicon content.
12. A film obtained by the method of claim 1 .