IP Library Granted Patent US 11,447,677
Granted Patent B2
US 11,447,677 · App. 16/437,411 · Granted Sep 20, 2022

Thermal interface material with mixed aspect ratio particle dispersions

Inventors: John Timmerman (Minneapolis, MN); Sanjay Misra (Shoreview, MN)
Assignee: Henkel AG & Co. KGaA
C09K5/14C08K3/042C08K3/22C08K3/38H01L23/3737C08K7/04C08K7/18C08K2003/2227C08K2003/382C08K2003/385C08K2201/001C08K2201/016H01L2924/0002
View Patent ↗
Loading inventors, assignments & file history…
Monitor This Case
Get email alerts when status or documents change.
Order Certified Copies
Most orders are placed with the USPTO same day — all within 24 business hours.
Order via The Patent Place →
Pre-filled with this patent's details
Quick Facts
Patent No.
US 11,447,677
App. No.
16/437,411
Granted
Sep 20, 2022
Kind
B2
Abstract

An electron package includes an interface member between an electronic component and a thermal dissipation member. The interface member is highly efficient in transmitting thermal energy and/or suppressing electromagnetic radiation, with a particle filler dispersion including a combination of substantially spherical particles and substantially platelet-shaped particles within dispersion attribute ranges.

Claims (28)

1. A method for shielding electromagnetic interference in an electronic package, said method comprising:

(a) providing:

(i) a heat-generating electronic component;

(ii) a heat dissipation member; and

(iii) an interference member comprising a polymer matrix and a heterogeneous particulate filler effective to suppress electromagnetic interference, the heterogeneous particulate filler being dispersed in said polymer matrix at 40-50% by volume, said heterogeneous particulate filler including substantially spherical alumina particles having an aspect ratio of between 0.8-1.2 and a median spherical particle diameter, and boron nitride platelet particles having a length, a width, a thickness, and a median platelet particle diameter, wherein said platelet length and platelet width are each greater than said platelet thickness, said boron nitride platelet particles having an aspect ratio of at least 10, a volumetric loading ratio of said boron nitride platelet particles to said substantially spherical alumina particles being between 0.1:1 and 0.2:1, and a particle diameter ratio of said medium platelet particle diameter to said medium spherical diameter between 1:1 and 10:1; and

(b) arranging said interface member between said heat-generating electronic component and said heat dissipation member along a thermal dissipation pathway from said heat-generating electronic component to said heat dissipation member, wherein said interface member exhibits a thermal conductivity of at least 0.5 W/m·K, a bulk hardness of between 10-70 Shore 00 at 20° C., and an electromagnetic interference suppression of at least 10% along said thermal dissipation pathway.

2. The method for shielding electromagnetic interference as in claim 1 , including arranging said interface member in contact with at least one of said heat-generating electronic component and said heat-dissipation member.

3. The method for shielding electromagnetic interference as in claim 2 , including arranging said interface member in contact with both of said heat-generating electronic component and said heat-dissipation member.

4. The method for shielding electromagnetic interference as in claim 1 , including operating said electronic component to emit electromagnetic radiation in a range of 1-10 GHz.

5. The method for shielding electromagnetic interference as in claim 4 wherein said interface member exhibits an electromagnetic radiation absorption of at least one dB/in at 2.4 GHz.

6. The method for shielding electromagnetic interference as in claim 5 wherein said interface member exhibits an electromagnetic radiation absorption of at least 10 db/in at 2.4 GHz.

7. The method for shielding electromagnetic interference as in claim 1 wherein boron nitride platelet particles have an aspect ratio of at least 100.

8. The method for shielding electromagnetic interference as in claim 7 wherein said length and said width of boron nitride platelet particles are about equal.

9. The method for shielding electromagnetic interference as in claim 1 wherein said polymer matrix is a thermoplastic elastomer.

10. A method for shielding electromagnetic interference in an electronic package, said method comprising:

(a) providing:

(i) a heat-generating electronic component;

(ii) a heat dissipation member; and

(iii) an interference member comprising a polymer matrix and a heterogeneous particulate filler effective to suppress electromagnetic interference, the heterogeneous particulate filler being dispersed in said polymer matrix at 25-45% by volume, said heterogeneous particulate filler including substantially spherical alumina particles having an aspect ratio of between 0.8-1.2 and a median spherical particle diameter, and graphene platelet particles having a length, a width, a thickness, and a median platelet particle diameter, wherein said platelet length and platelet width are each greater than said platelet thickness, said graphene platelet particles having an aspect ratio of at least 10, a volumetric loading ratio of said graphene platelet particles to said substantially spherical alumina particles being between 0.1:1 and 0.2:1, and a particle diameter ratio of said medium platelet particle diameter to said medium spherical diameter between 1:1 and 10:1; and

(b) arranging said interface member between said heat-generating electronic component and said heat dissipation member along a thermal dissipation pathway from said heat-generating electronic component to said heat dissipation member, wherein said interface member exhibits a thermal conductivity of at least 0.5 W/m·K, a bulk hardness of between 10-70 Shore 00 at 20° C., and an electromagnetic interference suppression of at least 10% along said thermal dissipation pathway.

11. The method for shielding electromagnetic interference as in claim 10 , including arranging said interface member in contact with at least one of said heat-generating electronic component and said heat-dissipation member.

12. The method for shielding electromagnetic interference as in claim 11 , including arranging said interface member in contact with both of said heat-generating electronic component and said heat-dissipation member.

13. The method for shielding electromagnetic interference as in claim 10 , including operating said electronic component to emit electromagnetic radiation in a range of 1-10 GHz.

14. The method for shielding electromagnetic interference as in claim 13 wherein said interface member exhibits an electromagnetic radiation absorption of at least one dB/in at 2.4 GHz.

15. The method for shielding electromagnetic interference as in claim 14 wherein said interface member exhibits an electromagnetic radiation absorption of at least 10 db/in at 2.4 GHz.

16. The method for shielding electromagnetic interference as in claim 10 wherein said graphene platelet particles have an aspect ratio of at least 100.

17. The method for shielding electromagnetic interference as in claim 16 wherein said length and said width of said graphene platelet particles are about equal.

18. The method for shielding electromagnetic interference as in claim 10 wherein said polymer matrix is a thermoplastic elastomer.

Assignments (3)
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Aug 15, 2022
From: TIMMERMAN, JOHN; MISRA, SANJAY
To: THE BERGQUIST COMPANY
Reel/Frame 060809/0018 →
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Aug 15, 2022
From: THE BERGQUIST COMPANY
To: HENKEL IP & HOLDING GMBH
Reel/Frame 060809/0084 →
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Feb 22, 2022
From: HENKEL IP & HOLDING GMBH
To: HENKEL AG & CO. KGAA
Reel/Frame 059207/0627 →