METHOD FOR PREPARING BATTERY PLATES
A method for producing a battery plate including: a) adhering a current collector to one or more surfaces of a substrate of the battery plate; b) ablating a pasting surface of the current collector with a non-contact energy source; c) pasting the current collector with an active material; and d) curing and drying the active material on the current collector to form an electrode as part of the battery plate.
1 . A method for producing a battery plate comprising:
a) adhering a current collector to one or more surfaces of a substrate of the battery plate;
b) ablating a pasting surface of the current collector with an energy source which is a non-contact energy source;
c) pasting an active material onto the pasting surface of the current collector; and
d) curing, drying, or both the active material on the current collector to form an electrode as part of the battery plate.
2 . The method according to claim 1 , wherein the energy source utilizes energy in a form of a laser, infrared energy, microwave energy, radiofrequency, plasma, or any combination thereof.
3 . The method according to claim 1 , wherein the energy source is in a form of one or more lasers which perform the ablating with a pulsed laser, a continuous wave laser, or both.
4 . The method according to claim 2 , wherein the pasting surface of the current collector is opposite a substrate surface of the current collector, and the substrate surface faces and is in contact with the substrate.
5 . The method according to claim 2 , wherein the ablating removes about 1 micron or greater of material on the pasting surface.
6 . The method according to claim 5 , wherein the ablating removes about 3 microns or greater to about 50 microns or less of material on the pasting surface.
7 . The method according to claim 2 , wherein the ablating removes about 0.05% or greater to about 30% or less of an overall thickness of the current collector before the ablating.
8 . The method according to claim 2 , wherein the ablating increases a surface area of the current collector by 10% or more.
9 . The method according to claim 2 , wherein the adhering occurs before or after the ablating.
10 . The method of claim 2 , wherein the current collector is comprised of one or more metals.
11 . The method of claim 10 , wherein the one or more metals include: silver, tin, copper, aluminum, lead, alloys thereof, or any combination thereof.
12 . The method of claim 11 wherein the one or more metals includes the lead or a lead alloy.
13 . The method according to claim 10 , wherein the current collector is in the form of a sheet, a foil, a grid, a screen, a mesh, or any combination thereof.
14 . The method according to claim 13 , wherein the active material is a positive active material or a negative active material
15 . The method according to claim 14 , wherein the active material is the positive active material, and the current collector with the positive active material forms a cathode.
16 . The method according to claim 14 , wherein the active material is the negative active material, and the current collector with the negative active material forms an anode.
17 . The method according to claim 2 , wherein the ablating leaves one or more patterns on the pasting surface, a substrate surface opposite the pasting surface, or both of the current collector.
18 . The method according to claim 17 , wherein the one or more patterns includes one or more identifiers.
19 . The method according to claim 18 , wherein the one or more identifiers include one or more part numbers, corporate identifiers, manufacturing sequence identifiers, or a combination thereof.
20 . A battery plate formed by the method of claim 1 , wherein the battery plate is a grid, a monopolar plate, a bipolar plate, a dual polar plate, or a combination thereof.