Metal contact free photodetector with sidewall doping
A metal-contact-free photodetector includes an optically absorbing material, e.g. germanium, mounted on a device layer of a photonic integrated circuit, which includes a p-type contact and an n-type contact on opposite sides of a waveguide. The contacts are comprise of a plurality of independently doped regions ranging from lowest doped adjacent the waveguide to highest doped remote from the waveguide. An additional element is to add p and/or n doping on one or more of the sidewalls of the optically absorbing material, e.g Germanium. The advantage compared to the previously disclosed metal-contact-free photodetectors is that the bandwidth is much higher, and full speed is attained at lower voltage.
1. A photodetector comprising:
a waveguide absorption region for mounting in a device layer of a photonic integrated circuit (PIC) for transmitting an optical signal;
a p-type contact in the device layer on one side of the waveguide absorption region, the p-type contact comprising a first p-type portion including a first p-type doping concentration and a second p-type portion including a second higher p-type doping concentration adjacent to the first p-type portion;
an n-type contact in the device layer on an opposite side of the waveguide absorption region, the n-type contact comprising a first n-type portion including a first n-type doping concentration adjacent to the waveguide absorption region, and a second n-type portion including a second higher n-type doping concentration adjacent to the first n-type portion;
an absorbing body on top of the waveguide absorption region for converting the optical signal to an electrical signal, the absorbing body including a first sidewall portion including a p-type dopant at least partially overlapping the first p-type portion and not in contact with the second p-type portion, and a second sidewall portion including an n-type dopant at least partially overlapping the first n-type portion not in contact with the second n-type portion;
a first terminal extending from the second p-type portion for transmitting the electrical signal to external circuitry; and
a second terminal extending from the second n-type portion for transmitting the electrical signal to the external circuitry.
2. The photodetector according to claim 1 , wherein the first sidewall portion includes a p-type doping concentration substantially the same as the first p-type portion of the p-type contact.
3. The photodetector according to claim 1 , wherein the first sidewall portion includes a depth that is about 20% to 35% of a width of the absorbing body.
4. The photodetector according to claim 1 , wherein the first sidewall portion includes a depth that is about 25% to 30% of a width of the absorbing body.
5. The photodetector according to claim 1 , wherein the absorbing body includes an upper undoped region between the p-doped first side wall portion and the n-doped second side wall portion, which forms a lateral pin junction.
6. The photodetector according to claim 5 , wherein the upper undoped region includes a width that is about 30% to 60% of a width of the absorbing body.
7. The photodetector according to claim 5 , wherein the upper undoped region includes a width that is about 40% to 50% of a width of the absorbing body.
8. The photodetector according to claim 1 , wherein the absorbing body comprises a triangular shaped structure, a pyramidal-shaped structure or a frustum-shaped structure with sidewall surfaces extending at an acute angle from the device layer.
9. The photodetector according to claim 8 , wherein the sidewall surfaces extending at an acute angle of 20° to 60° from the device layer.
10. The photodetector according to claim 1 , wherein the second p-type portion includes a doping concentration 5× to 20× more than the first p-type portion.
11. The photodetector according to claim 1 , wherein the second p-type portion includes a doping concentration at least 10× more than the first p-type portion.
12. The photodetector according to claim 1 , wherein the second p-type portion includes a doping concentration of 5×10 18 cm −3 to 1×10 20 cm −3 .
13. The photodetector according to claim 1 , wherein the second p-type portion includes a doping concentration of substantially 1×10 19 cm −3 .
14. The photodetector according to claim 1 , wherein the first p-type contact also includes a third p-type portion between the first and second p-type portions.
15. The photodetector according to claim 14 , wherein the third p-type portion includes a doping concentration between doping concentrations of the first and second p-type portions.
16. The photodetector according to claim 14 , wherein the third p-type portion includes a doping concentration substantially the same as the doping concentration of the second p-type portion.
17. The photodetector according to claim 14 , wherein the third p-type portion includes a depth shorter than the first and second p-type portions.
18. The photodetector according to claim 1 , wherein the absorbing body comprises germanium.
19. A photodetector comprising:
a waveguide absorption region in a device layer of a photonic integrated circuit (PIC) for transmitting an optical signal;
a p-type contact in the device layer on one side of the waveguide absorption region, the p-type contact comprising a first p-type portion including a first p-type doping concentration;
a charge region in the device layer on an opposite side of the waveguide absorption region including a second lower p-type doping concentration;
an avalanche region in the device layer adjacent to the charge region;
a n-type contact in the device layer adjacent to the charge region, the n-type contact comprising a first n-type portion including a first n-type doping concentration;
an absorbing body on top of the waveguide absorption region for converting the optical signal to an electrical signal, the absorbing body including a first sidewall portion including a p-type dopant at least partially overlapping the first p-type portion;
a first terminal extending from the p-type contact for transmitting the electrical signal to external circuitry; and
a second terminal extending from the n-type contact for transmitting the electrical signal to external circuitry.
20. The photodetector according to claim 19 , wherein the first sidewall portion includes a depth that is about 20% to 35% of a width of the absorbing body.