Multimodal brain sensing lead
A medical lead with at least a distal portion thereof implantable in the brain of a patient is described, together with methods and systems for using the lead. The lead is provided with at least two sensing modalities (e.g., two or more sensing modalities for measurements of field potential measurements, neuronal single unit activity, neuronal multi unit activity, optical blood volume, optical blood oxygenation, voltammetry and rheoencephalography). Acquisition of measurements and the lead components and other components for accomplishing a measurement in each modality are also described as are various applications for the multimodal brain sensing lead.
1. An implantable medical lead for use with a host device configured to output host control signals, provide a host power supply, receive a first measurement, and receive unprocessed signals for processing by the host device to obtain a second measurement corresponding to a neuronal field potential measurement or a rheoncephalography measurement, the lead comprising:
a body having a distal portion and a proximal portion;
a plurality of lead components at the distal portion, wherein the plurality of lead components includes a plurality of macroelectrodes, a plurality of microelectrodes, and at least one optical assembly;
an electronics module comprising a lead signal processor comprising an amplifier and an analog-to-digital converter, the lead signal processor configured to process signals from one or more of the plurality of lead components to obtain one of a plurality of different types of first measurements corresponding to a single unit activity measurement, a multi unit activity measurement, or an optical measurement; and
a connector at the proximal portion of the body, the connector configured to provide an electrical interface between the host device and the electronics module,
wherein the electronics module is configured to selectively enable, based on the host control signals:
a) a first sensing modality that provides one of the different types of first measurements by:
electrically coupling at least one of the plurality of lead components to an input to the lead signal processor, and
electrically coupling an output of the lead signal processor to the connector, and
b) a second sensing modality that provides one or more unprocessed signals by electrically coupling at least one of the plurality of lead components to the connector while bypassing the lead signal processor.
2. The lead of claim 1 , wherein:
the electronics module is configured to electrically couple a first microelectrode to a first input of the lead signal processor, a second microelectrode to a second input of the lead signal processor, and an output of lead signal processor to the connector; and
the first measurement corresponds to one of a single unit activity measurement and a multi unit activity measurement.
3. The lead of claim 2 , wherein the lead signal processor comprises an amplifier and the first input corresponds to a first input of the amplifier, and the second input corresponds to a second input of the amplifier.
4. The lead of claim 1 , wherein:
the electronics module is configured to electrically couple a microelectrode to a first input of the lead signal processor, a macroelectrode to a second input of the lead signal processor, and an output of the lead signal processor to the connector; and
the first measurement corresponds to one of a single unit activity measurement and a multi unit activity measurement.
5. The lead of claim 4 , wherein the lead signal processor comprises an amplifier and the first input corresponds to a first input of the amplifier, and the second input corresponds to a second input of the amplifier.
6. The lead of claim 1 , wherein:
the at least one optical assembly comprises at least one light emitting diode (LED) and at least one photodetector,
the electronics module is configured to:
illuminate the LED,
electrically couple a photodetector to an input of the lead signal processor, and
electrically couple an output of the lead signal processor to the connector, and
the first measurement corresponds to an optical measurement.
7. The lead of claim 6 , wherein:
the lead signal processor comprises an amplifier and an analog-to-digital convertor, wherein an output of the amplifier is coupled to an input of an analog-to-digital convertor, and
the input of the lead signal processor corresponds to an input of the amplifier, and the output of the lead signal processor corresponds to an output of the analog-to-digital convertor.
8. The lead of claim 1 , wherein the electronics module is configured to electrically couple a first macroelectrode to the connector while bypassing the lead signal processor, and to electrically couple a second macroelectrode to the connector while bypassing the lead signal processor.
9. The lead of claim 1 , wherein:
the electronics module is configured to electrically couple each of a first macroelectrode, a second macroelectrode, a third macroelectrode, and a fourth macroelectrode to the connector while bypassing the lead signal processor.
10. The lead of claim 1 , wherein the host device is further configured to output an electrical stimulation signal, and the electronics module is configured to electrically couple one or more of the plurality of lead components to the electrical stimulation signal.