Structure having circuit board disposed on upper face of shield can disposed on circuit board, and electronic device including same

1. An electronic device comprising:

a first communication module comprising communication circuitry configured to process a communication signal in a first frequency band among multiple frequency bands corresponding to a specified communication method;

a second communication module comprising communication circuitry configured to process a communication signal in a second frequency band among the multiple frequency bands;

a first circuit board on which the first communication module and a first connector electrically connected to the first communication module are mounted;

a shield can including an upper face including at least one opening, the shield can further including a side face surrounding the upper face, the shield can being disposed on the first circuit board to accommodate the first communication module in an inner space defined by the upper face and the side face, the side face being electrically connected to a first ground portion of the first circuit board;

a second circuit board on which the second communication module and a second connector electrically connected to the second communication module are mounted, the second circuit board being disposed on the upper face of the shield can wherein the second communication module corresponds to the first communication module and/or at least one component mounted on the first circuit board in the inner space through a corresponding opening among the at least one opening where the second connector is electrically coupled to the first connector; and

an adhesive disposed between the upper face and the second circuit board.

2. The electronic device of claim 1 , wherein the first connector and the second connector are disposed in the inner space defined by the shield can.

3. The electronic device of claim 1 , wherein the first connector and the second connector are disposed adjacent to the shield can.

4. The electronic device of claim 1 , wherein the first connector and the second connector are electrically connected to each other to provide a line that connects at least one of a power signal, a control signal or transmits the communication signal between the first circuit board and the second circuit board.

5. The electronic device of claim 1 , wherein the adhesive includes at least one opening based on a shape of the upper face of the shield can.

6. The electronic device of claim 1 , wherein the adhesive comprises conductive adhesive tape, and the conductive adhesive tape is configured to electrically connect the upper face of the shield can to a second ground portion of the second circuit board.

7. The electronic device of claim 1 , wherein the adhesive comprises a conductive clip, wherein one end of the conductive clip is coupled to enclose at least a part of the side face of the shield and another end of the conductive clip is electrically connected to a second ground portion of the second circuit board.

8. The electronic device of claim 1 , wherein the second printed circuit board further includes multiple radiation conductors arranged in an array.

9. The electronic device of claim 8 , wherein the multiple radiation conductors are disposed on a face of the second circuit board opposite a face of the second circuit board on which the second communication module is mounted.

10. The electronic device of claim 8 , wherein the multiple radiation conductors have a conductor size corresponding to a wavelength in a frequency band in a range of 6 GHz to 300 GHz included in the second designated frequency.

11. The electronic device of claim 10 , further comprising:

a processor mounted on the first circuit board,

wherein the processor is configured to:

provide a control signal to the first communication module to process a communication signal of the first frequency band and deliver the communication signal of the first frequency band to the second communication module; and

provide a control signal to the second communication module to process a communication signal of the second frequency band.

12. The electronic device of claim 1 , wherein the second communication module is disposed to overlap at least a part of the first communication module and/or a part of at least one component mounted on the first circuit board.

13. The electronic device of claim 1 , wherein the first frequency band has a range smaller than a range of the second frequency band.

14. The electronic device of claim 1 , wherein the first circuit board and the second circuit board are spaced apart from each other by a predetermined distance, and

the second circuit board is stacked on at least a part of the first circuit board.

15. The electronic device of claim 14 , further comprising:

a processor mounted on the first circuit board;

an RF transceiver mounted on the first circuit board; and

an RF communication circuit mounted on at least one of the first communication module or the second communication module,

wherein the RF communication circuit is configured to receive a designated control signal from the processor and to receive a communication signal from the RF transceiver.

16. An electronic device comprising:

at least one first circuit component;

at least one second circuit component;

a first circuit board on which the at least one first circuit component and a first connector electrically connected to the at least one circuit component are mounted;

a shield can including an upper face including at least one opening, the shield can further comprising a side face surrounding the upper face of the shield can, the shield can being disposed on the first circuit board to accommodate the at least one first circuit component in an inner space of the shield can defined by the upper face and the side face, the side face being electrically connected to a first ground portion of the first circuit board;

a second circuit board on which the at least one second circuit component and a second connector electrically connected to the at least one second circuit component are mounted, the second circuit board being disposed on the upper face of the shield can such that the at least one second circuit component is stacked on the at least one circuit component in the inner space through the at least one opening wherein the second connector is electrically coupled to the first connector; and

a conductive adhesive disposed between the upper face and the second circuit board.

17. The electronic device of claim 16 , wherein the first connector and the second connector are disposed in the inner space defined by the shield can.

18. The electronic device of claim 16 , wherein the adhesive includes at least one opening based on a shape of the upper face of the shield can.

19. The electronic device of claim 16 , wherein the adhesive comprises a conductive adhesive tape, and the conductive adhesive tape electrically connects the upper face of the shield can to a second ground portion of the second circuit board.

20. An electronic device comprising:

a housing including a first plate oriented in a first direction, a second plate oriented in a second direction opposite the first direction, and a side face surrounding a space between the first plate and the second plate;

a display exposed through at least a part of the first plate;

a first circuit board disposed in the space and including a first communication module comprising communication circuitry configured to process a communication signal of a first frequency band and a first connector electrically connected to the first communication module;

a second circuit board disposed to face at least a partial area of the first circuit board and including a second communication module comprising communication circuitry configured to process a communication signal of a second frequency band and a second connector electrically connected to the second communication module;

a shield can disposed between the first circuit board and the second circuit board and including at least one opening; and

a conductive adhesive bonding the second circuit board and the shield can to each other,

wherein the second communication module is disposed in an inner space defined by the shield can through the at least one opening to be stacked on the first communication module and/or at least one component mounted on the first circuit board, and the first connector and the second connector are stacked to be electrically connected to each other.