IP Library Granted Patent US 12,548,715
Granted Patent B2
US 12,548,715 · App. 16/445,288 · Granted Feb 10, 2026

Solid electrolytic capacitor containing an interfacial coating

Inventors: Jan Petrzilek (Usti nad Orlici, CZ); Lotfi Djebara (Paris, FR)
Assignee: KYOCERA AVX Components Corporation
H01G9/15H01G9/012H01G9/028H01G9/042H01G9/0425H01G9/0525H01G9/10C08G61/122C08G2261/11C08G2261/3247C08G2261/90
View Patent ↗
Loading inventors, assignments & file history…
Monitor This Case
Get email alerts when status or documents change.
Order Certified Copies
Most orders are placed with the USPTO same day — all within 24 business hours.
Order via The Patent Place →
Pre-filled with this patent's details
Quick Facts
Patent No.
US 12,548,715
App. No.
16/445,288
Granted
Feb 10, 2026
Kind
B2
Abstract

A solid electrolytic capacitor containing a capacitor element is provided. The capacitor element contains a sintered porous anode body, a dielectric that overlies the anode body, and a solid electrolyte that overlies the dielectric. An anode lead extends from the front surface of the capacitor element in the longitudinal direction. An anode termination is in contact with the anode lead at a connection region, wherein the ratio of the distance between the connection region and the front surface of the capacitor element to the length of the capacitor is 0.13 or more. A cathode termination is in electrical connection with the solid electrolyte and a casing material encapsulates the capacitor element and anode lead. Further, an interfacial coating that is disposed on at least a portion of the anode termination and/or cathode termination and is in contact with the casing material.

Claims (25)

1 . A solid electrolytic capacitor having a length in a longitudinal direction, comprising:

a capacitor element having opposing front and rear surfaces, opposing upper and lower surfaces, and opposing side surfaces, wherein the capacitor element contains a sintered porous anode body that includes tantalum, a dielectric that includes tantalum pentoxide and that overlies the anode, a solid electrolyte that overlies the dielectric, and an external coating that overlies the solid electrolyte, wherein the solid electrolyte includes one or more inner layers containing an intrinsically conductive thiophene polymer and one or more outer layers containing pre-polymerized extrinsically conductive thiophene polymer particles and a polymeric counterion, and further wherein the external coating contains an extrinsically conductive thiophene polymer, a polymeric cation, and a cross-linking agent;

an anode lead extending from the front surface of the capacitor element in the longitudinal direction, wherein the anode lead is a wire, wherein at least a portion of the wire that is adjacent to the front surface of the capacitor element is free of any thiophene polymer from the solid electrolyte or the external coating;

an anode termination that is in contact with the anode lead at a connection region, wherein a distance between the connection region and the front surface of the capacitor element is from about 1 to about 2 millimeters, and further wherein the ratio of the distance between the connection region and the front surface of the capacitor element to the length of the capacitor is about 0.15 to about 0.5;

a cathode termination that is in electrical connection with the solid electrolyte;

a casing material containing a resinous matrix that includes an epoxy resin and an inorganic oxide filler, wherein the casing material encapsulates the capacitor element and anode lead and leaves exposed at least a portion of the anode termination and cathode termination for external contact; and

an interfacial coating that includes a fluoropolymer formed from a fluoroalkyl (meth)acrylate, wherein the interfacial coating is in contact with the casing material;

wherein the solid electrolytic capacitor demonstrates an initial equivalent series resistance of about 200 mohms or less when measured at a frequency of 100 kHz and a temperature of about 23° C. and an initial capacitance of about 30 nanoFarads per square centimeter or more when measured at a frequency of 120 Hz and a temperature of about 23° C., further wherein the solid electrolytic capacitor has a ratio of an equivalent series resistance and a capacitance after being exposed to a temperature of about 125° C. for 240 hours to the initial equivalent series resistance and the initial capacitance of about 2.0 or less.

2 . The solid electrolytic capacitor of claim 1 , wherein the length of the capacitor is from about 2 to about 15 millimeters.

3 . The solid electrolytic capacitor of claim 1 , wherein the resinous matrix contains a polycyanate containing at least two cyanate ester groups.

4 . The solid electrolytic capacitor of claim 1 , wherein the capacitor element further comprises a cathode coating that contains a metal particle layer that overlies the solid electrolyte, wherein the metal particle layer includes a plurality of conductive metal particles.

5 . The solid electrolytic capacitor of claim 4 , wherein the metal particles include silver.

6 . The solid electrolytic capacitor of claim 1 , wherein the extrinsically conductive thiophene polymer of the outer layers, the external coating, or both have repeating units of the following formula:

wherein,

R 7 is a linear or branched, C 1 to C 18 alkyl radical, C 5 to C 12 cycloalkyl radical, C 6 to C 14 aryl radical, C 7 to C 18 aralkyl radical, or a combination thereof; and

q is an integer from 0 to 8.

7 . The solid electrolytic capacitor of claim 6 , wherein the extrinsically conductive thiophene polymer is poly(3,4-ethylenedioxythiophene) or a derivative thereof.

8 . The solid electrolytic capacitor of claim 1 , wherein the intrinsically conductive thiophene polymer has repeating units of the following formula:

wherein,

R is (CH 2 ) n —O—(CH 2 ) b -L, where L is a bond or HC([CH 2 ] c (H);

a is from 1 to 4;

b is from 2 to 6;

c is from 0 to 10; and

X is a cation.

9 . The solid electrolytic capacitor of claim 1 , wherein the capacitor is formed by a process that includes subjecting the wire to a laser cleaning process to remove any conductive polymer from the solid electrolyte or the external coating from at least a portion of the wire.

Assignments (2)
CHANGE OF NAME Recorded Dec 22, 2021
From: AVX CORPORATION
To: KYOCERA AVX COMPONENTS CORPORATION
Reel/Frame 058563/0762 →
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Jun 26, 2019
From: PETRZILEK, JAN; DJEBARA, LOTFI
To: AVX CORPORATION
Reel/Frame 049595/0766 →
Continuity (2)
Provisional Application 62687974 · Jun 21, 2018
Related Publication 20190392998A1 · Dec 26, 2019
References Cited (144)
US 2803615A · Brown · 1957 [cited by examiner]
US 5111327A · Blohm et al. · 1992 [cited by applicant]
US 5135297A · Valint, Jr. · 1992 [cited by examiner]
US 5187650A · Kudoh et al. · 1993 [cited by applicant]
US 5424907A · Kojima et al. · 1995 [cited by applicant]
US 5454147A · Kobayashi · 1995 [cited by examiner]
US 5457862A · Sakata et al. · 1995 [cited by applicant]
US 5473503A · Sakata et al. · 1995 [cited by applicant]
US 5698904A · Tsuji · 1997 [cited by examiner]
US 5729428A · Sakata et al. · 1998 [cited by applicant]
US 5812367A · Kudoh et al. · 1998 [cited by applicant]
US 6072694A · Hahn et al. · 2000 [cited by applicant]
US 6191013B1 · Hahn et al. · 2001 [cited by applicant]
US 6197252B1 · Parks et al. · 2001 [cited by applicant]
US 6229688B1 · Kobayashi et al. · 2001 [cited by applicant]
US 6426866B2 · Shoji et al. · 2002 [cited by applicant]
US 6519135B2 · Sano et al. · 2003 [cited by applicant]
US 6635729B1 · Groenendaal et al. · 2003 [cited by applicant]
US 6674635B1 · Fife et al. · 2004 [cited by applicant]
US 6733545B2 · Shoji et al. · 2004 [cited by applicant]
US 6785124B2 · Nakamura et al. · 2004 [cited by applicant]
US 6798645B2 · Melody · 2004 [cited by examiner]
US 6845004B2 · Melody et al. · 2005 [cited by applicant]
US 6853540B2 · Kudoh et al. · 2005 [cited by applicant]
US 6870727B2 · Edson · 2005 [cited by examiner]
US 6987663B2 · Merker et al. · 2006 [cited by applicant]
US 7180728B2 · Kobayashi · 2007 [cited by applicant]
US 7262511B2 · Osako et al. · 2007 [cited by applicant]
US 7292432B2 · Furuzawa et al. · 2007 [cited by applicant]
US 7377947B2 · Merker et al. · 2008 [cited by applicant]
US 7379290B2 · Toida et al. · 2008 [cited by applicant]
US 7471503B2 · Bruner et al. · 2008 [cited by applicant]
US 7489498B2 · Izu et al. · 2009 [cited by applicant]
US 7515394B2 · Nabeshima · 2009 [cited by applicant]
US 7515396B2 · Biler · 2009 [cited by applicant]
US 7525791B2 · Sakata et al. · 2009 [cited by applicant]
US 7643269B2 · Kirschbaum · 2010 [cited by applicant]
US 7800887B2 · Iida et al. · 2010 [cited by applicant]
US 7903392B2 · Yoshimitsu · 2011 [cited by applicant]
US 7990683B2 · Qiu et al. · 2011 [cited by applicant]
US 8125768B2 · Horacek et al. · 2012 [cited by applicant]
US 8134827B2 · Umemoto et al. · 2012 [cited by applicant]
US 8206467B2 · Hayashi et al. · 2012 [cited by applicant]
US 8228664B2 · Yamaguchi et al. · 2012 [cited by applicant]
US 8273135B2 · Furukawa et al. · 2012 [cited by applicant]
US 8310816B2 · Chacko · 2012 [cited by applicant]
US 8313538B2 · Merker et al. · 2012 [cited by applicant]
US 8379372B2 · Zednicek et al. · 2013 [cited by applicant]
US 8390990B2 · Furuzawa et al. · 2013 [cited by applicant]
US 8432665B2 · Umemoto et al. · 2013 [cited by applicant]
US 8437117B2 · Umemoto et al. · 2013 [cited by applicant]
US 8470389B2 · Furukawa et al. · 2013 [cited by applicant]
US 8480762B2 · Yoshimitsu · 2013 [cited by applicant]
US 8569852B2 · Morise et al. · 2013 [cited by applicant]
US 8576543B2 · Biler et al. · 2013 [cited by applicant]
US 8644005B2 · Kosuge et al. · 2014 [cited by applicant]
US 8691327B2 · Furukawa et al. · 2014 [cited by applicant]
US 8699208B2 · Merker et al. · 2014 [cited by applicant]
US 8724294B2 · Abe et al. · 2014 [cited by applicant]
US 8747607B2 · Huck et al. · 2014 [cited by applicant]
US 8808403B2 · Qiu et al. · 2014 [cited by applicant]
US 8810997B2 · Yamaguchi et al. · 2014 [cited by applicant]
US 8947857B2 · Biler et al. · 2015 [cited by applicant]
US 8971020B2 · Biler et al. · 2015 [cited by applicant]
US 9030807B2 · Chacko et al. · 2015 [cited by applicant]
US 9142356B2 · Furukawa et al. · 2015 [cited by applicant]
US 9236191B2 · Chacko et al. · 2016 [cited by applicant]
US 9236192B2 · Biler et al. · 2016 [cited by applicant]
US 9236193B2 · Tatsuno et al. · 2016 [cited by applicant]
US 9293263B2 · Liu et al. · 2016 [cited by applicant]
US 9312074B2 · Chacko et al. · 2016 [cited by applicant]
US 9371587B2 · Isogai · 2016 [cited by applicant]
US 9406445B2 · Petrzilek et al. · 2016 [cited by applicant]
US 9502183B2 · Saulter et al. · 2016 [cited by applicant]
US 9589733B2 · Vilc et al. · 2017 [cited by applicant]
US 9653215B2 · Kosuge · 2017 [cited by applicant]
US 9728338B2 · Nagashima et al. · 2017 [cited by applicant]
US 9793058B2 · Chacko et al. · 2017 [cited by applicant]
US 9818549B2 · Chacko · 2017 [cited by applicant]
US 9824826B2 · Petrzilek et al. · 2017 [cited by applicant]
US 9875852B2 · Asteman et al. · 2018 [cited by applicant]
US 10014116B2 · Shi et al. · 2018 [cited by applicant]
US 10128054B2 · Chacko et al. · 2018 [cited by applicant]
US 10186382B2 · Uher et al. · 2019 [cited by applicant]
US 10224150B2 · Ning et al. · 2019 [cited by applicant]
US 10224151B2 · Biler et al. · 2019 [cited by applicant]
US 10643797B2 · Vilc et al. · 2020 [cited by applicant]
US 20040217489A1 · Umeno et al. · 2004 [cited by applicant]
US 20060038304A1 · Osako · 2006 [cited by examiner]
US 20060098393A1 · Sawano · 2006 [cited by examiner]
US 20060181836A1 · Furuzawa · 2006 [cited by examiner]
US 20070285876A1 · Takatani · 2007 [cited by examiner]
US 20080170354A1 · Dvorak · 2008 [cited by examiner]
US 20100165547A1 · Kuranuki et al. · 2010 [cited by applicant]
US 20100238609A1 · Ibata · 2010 [cited by examiner]
US 20100246100A1 · Umemoto · 2010 [cited by examiner]
US 20110019341A1 · Umemoto · 2011 [cited by examiner]
US 20110233450A1 · Nobuta et al. · 2011 [cited by applicant]
US 20130078366A1 · Abe · 2013 [cited by applicant]
US 20130279077A1 · Djebara · 2013 [cited by examiner]
US 20130321985A1 · Djebara · 2013 [cited by examiner]
US 20130321986A1 · Djebara · 2013 [cited by examiner]
US 20150213961A1 · Liu · 2015 [cited by examiner]
US 20160104580A1 · Maeshima et al. · 2016 [cited by applicant]
US 20160181022A1 · Djebara · 2016 [cited by examiner]
US 20160225532A1 · Shi et al. · 2016 [cited by applicant]
US 20160351339A1 · Uher · 2016 [cited by examiner]
US 20180075975A1 · Petrzilek et al. · 2018 [cited by applicant]
US 20180108478A1 · Petrzilek et al. · 2018 [cited by applicant]
US 20180108487A1 · Petrzilek et al. · 2018 [cited by applicant]
US 20180108489A1 · Nakata et al. · 2018 [cited by applicant]
US 20180254151A1 · Weaver et al. · 2018 [cited by applicant]
CN 103467651 · 2013 [cited by applicant]
CN 105408418A · 2016 [cited by examiner]
JP H0399423U · 1991 [cited by applicant]
JP H0579937U · 1993 [cited by examiner]
JP 10101742A · 1998 [cited by examiner]
JP H11251189 · 1999 [cited by applicant]
JP 11288848A · 1999 [cited by examiner]
JP H11288848A · 1999 [cited by applicant]
JP 2000208367A · 2000 [cited by applicant]
JP 2001274040 · 2001 [cited by applicant]
JP 2006077216A · 2006 [cited by examiner]
JP 2001089654 · 2011 [cited by applicant]
JP 2011222709 · 2011 [cited by applicant]
JP 2012174948A · 2012 [cited by applicant]
JP 5620047B2 · 2014 [cited by examiner]
JP 2014216231A · 2014 [cited by examiner]
JP 6293318 · 2018 [cited by applicant]
KR 100513343B1 · 2005 [cited by applicant]
KR 20080095485A · 2008 [cited by examiner]
WO WO8701712A1 · 1987 [cited by examiner]
WO WO2015037370 · 2015 [cited by applicant]
WO WO2015194657A1 · 2015 [cited by applicant]
WO WO2016102129A1 · 2016 [cited by applicant]
Manufacturer's Cross Reference and Tantalum Chip Capacitor Part Numbering Systems, Nov. 2004, Kemet (Year: 2004). [cited by examiner]
AVX, AVX Surface Mount Tantalum Capacitors, printed in 2022 (Year: 2022). [cited by examiner]
International Search Report and Written Opinion for PCT/US2019/038257 dated Oct. 8, 2019, 11 pages. [cited by applicant]
Article from Wacker Chemie AG (Genosil®) entitled “Silanes/Organofunctional for Powerful Connections,” Sep. 2013, 20 pages. [cited by applicant]
Gelest, “Silane Coupling Agents: Connecting Across Boundaries”, 2006, 60 pages. [cited by applicant]
Material Safety Data Sheet for Dow Corning(R) JCR 6115 Clear A, Apr. 24, 2012, 7 pages. [cited by applicant]
Material Safety Data Sheet for Dow Corning(R) JCR 6115 Clear B, Dec. 22, 2008, 6 pages. [cited by applicant]
Product Information—3M™ Novec™ 2708 Electronic Grade Coating from 3M, Electronics Materials Solutions Division, May 2016, 2 pages. [cited by applicant]
Related Application Form. [cited by applicant]