Semiconductor device and method of manufacturing semiconductor device
In one example, an electronic device includes a semiconductor sensor device having a cavity extending partially inward from one surface to provide a diaphragm adjacent an opposite surface. A barrier is disposed adjacent to the one surface and extends across the cavity, the barrier has membrane with a barrier body and first barrier strands bounded by the barrier body to define first through-holes. The electronic device further comprises one or more of a protrusion pattern disposed adjacent to the barrier structure, which can include a plurality of protrusion portions separated by a plurality of recess portions; one or more conformal membrane layers disposed over the first barrier strands; or second barrier strands disposed on and at least partially overlapping the first barrier strands. The second barrier strands define second through-holes laterally offset from the first through-holes. Other examples and related methods are also disclosed herein.
1. A method of forming an electronic device, comprising:
providing a first electronic device comprising a first surface and a second surface opposite to the first surface, and a cavity extending partially inward from the second surface to provide a diaphragm adjacent to the first surface; and
providing a barrier coupled to the second surface of the first electronic device, the barrier comprising:
a membrane including:
a first barrier body; and
first barrier strands defining first through-holes;
a second barrier body over the first barrier body;
second barrier strands on the first barrier strands that define second through-holes laterally offset with respect to the first through-holes, wherein the second barrier strands partially cover the first through-holes; and
a stiffener over the second barrier body.
2. The method of claim 1 , wherein providing the barrier comprises:
providing the first electronic device among a plurality of electronic devices as part of semiconductor wafer, the first electronic device including the cavity extending partially inward from the second surface;
providing a first layer of material adjacent to the second surface to close-off the cavity;
forming the first through-holes within the first layer of material to establish the first barrier body and the first barrier strands;
attaching the semiconductor wafer to a carrier substrate; and
singulating the semiconductor wafer to provide the first electronic device, wherein the step of singulating includes singulating through the first layer of material.
3. The method of claim 1 , wherein:
providing the first electronic device comprises providing a Micro-Electro-Mechanical System (MEMS) sensor; and
providing the barrier comprises providing one or more dielectric materials.
4. A method of forming an electronic device, comprising:
providing a first electronic device comprising a first surface and a second surface opposite to the first surface, and a cavity extending partially inward from the second surface to provide a diaphragm adjacent to the first surface; and
providing a barrier connected to the second surface of the first electronic device, the barrier comprising:
a membrane including:
a first barrier body; and
first barrier strands defining first through-holes; and
second barrier strands attached to the first barrier strands that define second through-holes that are laterally offset with respect to the first through-holes, wherein outer edges of the second barrier strands are projected partially over the first through-holes;
wherein:
providing the barrier further comprises:
providing a second barrier body over the first barrier body; and
providing a stiffener over the second barrier body.
5. The method of claim 4 , wherein:
providing the barrier comprises:
providing the membrane over a base;
providing a first dielectric structure over the membrane; and
patterning the first dielectric structure to provide the second barrier strands that define the second through-holes.
6. The method of claim 5 , wherein:
providing the barrier further comprises:
providing a second dielectric structure covering the second barrier strands and the membrane; and
patterning the second dielectric structure to provide a stiffener.
7. The method of claim 6 , further comprising:
attaching a mounting film to the stiffener; and
removing the base;
wherein:
the step of connecting the barrier to the second surface of the first electronic device occurs after removing the base.
8. The method of claim 7 , wherein:
the step of connecting the barrier comprises:
using a pick-and-place apparatus to remove the barrier from the mounting film; and
attaching the barrier to the second surface of the first electronic device.
9. The method of claim 6 , wherein:
providing the second dielectric comprises providing an inorganic dielectric.
10. The method of claim 6 , wherein:
providing the second dielectric comprises providing an organic dielectric.
11. The method of claim 4 , wherein:
providing the barrier comprises providing the membrane comprising an inorganic dielectric.
12. The method of claim 4 , wherein:
providing the barrier comprises providing the membrane comprising an organic dielectric.