IP Library Granted Patent US 11,026,353
Granted Patent B2
US 11,026,353 · App. 16/449,734 · Granted Jun 1, 2021

Arrangement having a housing and a power electronics circuit arranged on a housing base in the housing

Inventors: Mircea Birdeanu (Timisoara, RO); Sorin Andrei (Timisoara, RO); Andrei-Radu Negrila (Timisoara, RO); Sebastian Taubert (Timisoara, RO); Eduard Iosif Trif (Timisoara, RO)
Assignee: Vitesco Technologies GmbH
H05K7/20927H05K7/20172H05K7/20263H05K7/20272H05K7/20909
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Quick Facts
Patent No.
US 11,026,353
App. No.
16/449,734
Granted
Jun 1, 2021
Kind
B2
Abstract

An arrangement has a housing and a power electronics circuit arranged on a housing base in the housing. A cavity with connections, which lead to the housing exterior, for supplying and discharging a cooling liquid is formed in the housing base. Cooling coils through which the cooling liquid can flow are formed on that side of the housing base which is averted from the cavity. A fan which is driven by an electric motor is arranged in the housing in such a way that the air flow of the fan is cooled by the cooling coils and then draws heat from the power electronics circuit.

Claims (9)

1. An arrangement, comprising:

a housing having a housing base;

a power electronics circuit disposed on said housing base in said housing;

said housing base being formed with a cavity and with inlet and outlet connections fluidically connecting said cavity in said housing base with a housing exterior, for supplying a cooling liquid to said cavity and discharging the cooling liquid from said cavity, said cavity being disposed to cool said power electronics circuit from below and to withdraw heat from said power electronics circuit;

cooling coils through which the cooling liquid can flow being formed on a side of said housing base that is averted from said cavity, said cooling coils being fluidically connected to said cavity to enable the cooling liquid to flow from said cavity through said cooling coils; and

a fan, to be driven by an electric motor, arranged in said housing and disposed to generate an air flow that flows in direct contact over said cooling coils, and thus draws heat from said power electronics circuit,

said cooling coils being formed by an undulated pipe disposed to be exposed in the air flow generated by said fan,

said undulated pipe projecting vertically from said base and conducting the cooling liquid of said cavity; and

said cooling coils being located between said fan and the components of said power electronics circuit.

Assignments (2)
CHANGE OF NAME Recorded Jan 22, 2020
From: CPT GROUP GMBH
To: VITESCO TECHNOLOGIES GMBH
Reel/Frame 052160/0431 →
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Sep 16, 2019
From: BIRDEANU, MIRCEA; ANDREI, SORIN; NEGRILA, ANDREI-RADU; TAUBERT, SEBASTIAN; TRIF, EDUARD IOSIF
To: CPT GROUP GMBH
Reel/Frame 050390/0869 →