Magnet wire with insulation including an organometallic compound
Magnet wire with corona resistant enamel insulation is described. A magnet wire may include a conductor, and at least one layer of polymeric enamel insulation may be formed around the conductor. The polymeric enamel insulation may include a filler dispersed in a base polymeric material, such as polyimide. Additionally, the filler may include an organometallic compound.
1. A magnet wire comprising:
a conductor; and
at least one layer of polymeric enamel insulation formed around the conductor, the polymeric enamel insulation comprising a filler dispersed in a base polymeric material,
wherein the filler comprises an organometallic compound formed from a transition metal, the organic compound comprising one of carbamate salt, thiocarbamate salt, thiophosphate salt, or an amine salt of a metal oxide acid, and
wherein the filler comprises less than 5.0 percent by weight of the polymeric enamel insulation.
2. The magnet wire of claim 1 , wherein the organometallic compound is a fully soluble compound.
3. The magnet wire of claim 1 , wherein the organometallic compound comprises an amine salt of a metal oxide acid, and wherein the metal oxide acid comprises one of molybdic acid, tungstic acid, or chromic acid.
4. The magnet wire of claim 1 , wherein the base polymeric material comprises one of polyimide or polyamideimide.
5. The magnet wire of claim 1 , wherein the at least one layer of polymeric enamel insulation comprises a plurality of layers of polymeric enamel insulation.
6. The magnet wire of claim 1 , wherein the filled polymeric enamel insulation has a partial discharge inception voltage that is at least five percent greater than that of the base polymeric material.
7. A magnet wire comprising:
a conductor; and
filled polymeric enamel insulation formed around the conductor, the filled polymeric enamel insulation comprising a base polymeric material and a fully soluble organometallic compound formed from a transition metal,
wherein the filled polymeric enamel insulation has a partial discharge inception voltage that is at least five percent greater than that of the base polymeric material.
8. The magnet wire of claim 7 , wherein the organometallic compound comprises an amine salt of a metal oxide acid.
9. The magnet wire of claim 8 , wherein the metal oxide acid comprises one of molybdic acid, tungstic acid, or chromic acid.
10. The magnet wire of claim 7 , wherein the organometallic compound comprises one of carbamate salt, thiocarbamate salt, or thiophosphate salt.
11. The magnet wire of claim 7 , wherein the organometallic compound comprises less than 5.0 percent by weight of the polymeric enamel insulation.
12. The magnet wire of claim 7 , wherein the base polymeric material comprises one of polyamideimide or polyimide.
13. The magnet wire of claim 7 , wherein the filled polymeric enamel insulation comprises a first layer of insulation, and further comprising:
a second layer of insulation formed around the conductor.
14. A magnet wire comprising:
a conductor; and
filled polymeric enamel insulation formed around the conductor, the filled polymeric enamel insulation comprising polyimide filled with a fully soluble organometallic compound comprising a transition metal,
wherein the filled polymeric enamel insulation has a partial discharge inception voltage that is at least five percent greater than the polyimide.
15. The magnet wire of claim 14 , wherein the organometallic compound comprises an amine salt of one of molybdic acid, tungstic acid, or chromic acid.
16. The magnet wire of claim 14 , wherein the organometallic compound comprises less than five percent by weight of the filled polymeric enamel insulation.
17. The magnet wire of claim 14 , wherein the organometallic compound comprises an amine salt of a metal oxide acid.
18. The magnet wire of claim 14 , wherein the organometallic compound comprises one of carbamate salt, thiocarbamate salt, or thiophosphate salt.