Wireless communication with dielectric medium
An electronic device may include a dielectric substrate, an electronic circuit supported by the substrate, for processing data, and a communication unit having an antenna. The communication unit may be mounted to the substrate in communication with the electronic circuit for converting between a first EHF electromagnetic signal containing digital information and a data signal conducted by the electronic circuit. The electromagnetic signal may be transmitted or received along a signal path by the antenna. An electromagnetic signal guide assembly may include a dielectric element made of a dielectric material disposed proximate the antenna in the signal path. The electromagnetic signal guide may have sides extending along the signal path. A sleeve element may extend around the dielectric element along sides of the dielectric element. The sleeve element may impede transmission of the electromagnetic signal through the sides of the dielectric element.
1. An adapter device, comprising:
a housing enclosing a first integrated circuit (IC) package, the housing configured to attach with an external device, the external device including a second IC package;
the first integrated circuit (IC) package configured to communicate wirelessly with the second IC package of the external device responsive to the external device being attached with the housing; and
a connector interface connected to the first IC package, the connector interface configured to receive a wired connector and transfer signals between the first IC package and the wired connector.
2. The adapter device of claim 1 , wherein the housing includes a sleeve that fits around at least a portion of the external device.
3. The adapter device of claim 2 , wherein the first IC package is aligned with the second IC package when the at least a portion of the external device is within the sleeve.
4. The adapter device of claim 1 , further comprising:
a first dielectric material at least partially surrounding the first IC package; and
a second dielectric material at least partially surrounding the first dielectric material, the first dielectric material having a first dielectric constant that is higher than a second dielectric constant of the second dielectric material.
5. The adapter device of claim 4 , further comprising a shielding material at least partially surrounding the first dielectric material and the second dielectric material.
6. The adapter device of claim 4 , wherein the second dielectric material includes one of foam or air.
7. The adapter device of claim 4 , wherein the first dielectric material spans a region defined between the first IC package to a mating surface of the adapter device.
8. The adapter device of claim 7 , wherein:
the mating surface contacts a target connection region of the external device when the external device is attached with the housing; and
the external device includes a third dielectric material that spans a region defined between the second IC package and the target connection region of the external device, the third dielectric material having a third dielectric constant that is higher than the second dielectric constant of the second dielectric material, the first dielectric material and the third dielectric material forming a path to propagate an extremely high frequency (EHF) signal between the first IC package and the second IC package when the external device is attached with the housing.
9. The adapter device of claim 1 , wherein the connector interface includes a female connector and the wired connector includes a plug-type connector.
10. The adapter device of claim 1 , further comprising a printed circuit board (PCB) within the housing, the first IC package being on the PCB and connected to the connector interface via the PCB.
11. The adapter device of claim 10 , further comprising a third IC package on the PCB.
12. The adapter device of claim 11 , wherein the first IC package includes a first antenna positioned orthogonally to a second antenna of the third IC package.
13. The adapter device of claim 11 , wherein the first IC package and the third IC package are configured to communicate with the external device in parallel.
14. The adapter device of claim 1 , further comprising a magnet configured to hold the external device to the adapter device such that the first IC package is aligned with the second IC package.
15. The adapter device of claim 14 , wherein the magnet includes one of:
a permanent magnet; or
an electromagnet.
16. The adapter device of claim 1 , wherein the housing includes a mating surface to provide a physical coupling surface with a target connection region of the external device.
17. The adapter device of claim 16 , wherein the mating surface is planar or curved.
18. The adapter device of claim 16 , wherein the mating surface includes an alignment portion including at least one of:
a protrusion;
a ridge;
a knob;
a bevel;
a pin; or
a recess.
19. The adapter device of claim 1 , wherein the first IC package is configured to receive power from the connector interface and wirelessly provide at least a portion of the power to the external device.
20. The adapter device of claim 1 , further comprising a shielding material at least partially surrounding the first IC package, the shielding material providing an electrical circuit ground for the first IC package.