ELECTROPLATING ASSEMBLY

1 . An electroplating assembly for holding a workpiece through a thermodynamic cycle of electroplating, the electroplating assembly comprising:

a plating rack that supports the workpiece;

an electric bus bar on the plating rack;

at least one connector joining the workpiece with the plating rack; and

at least one flexible support joining the workpiece with the plating rack.

2 . The electroplating assembly of claim 1 further comprising:

a segment on the at least one flexible support that permits limited movement of the workpiece through a thermodynamic cycle of electroplating, wherein the segment has a first dimension and a second dimension, and the first dimension is larger than the second dimension.

3 . The electroplating assembly of claim 2 wherein movement of the segment due to exposure of the segment to the thermodynamic cycle of the electroplating process in a first direction substantially orthogonal to a plane defined by the first dimension is favored over movement of the flexible support 18 in a second direction substantially orthogonal to a second plane defined by the second dimension.

4 . The electroplating assembly of claim 2 further comprising:

a conductive core on the at least one flexible support.

5 . The electroplating assembly of claim 4 wherein the conductive core comprises beryllium copper wire.

6 . The electroplating assembly of claim 2 further comprising:

a plating rack contact disposed on an end of the at least one flexible connector opposite to an end thereof connected to the electrical bus bar.

7 . The electroplating assembly of claim 1 further comprising:

a conductor for conveying electric current from the electric bus bar on the plating rack to the workpiece disposed on the at least one connector.

8 . The electroplating assembly of claim 1 further comprising:

a plating rack contact disposed on an end of the conductor opposite to an end thereof connected to the electrical bus bar.