Mitigating defects in an electrochromic device under a bus bar
Methods are provided for fabricating electrochromic devices that mitigate formation of short circuits under a top bus bar without predetermining where top bus bars will be applied on the device. Devices fabricated using such methods may be deactivated under the top bus bar, or may include active material under the top bus bar. Methods of fabricating devices with active material under a top bus bar include depositing a modified top bus bar, fabricating self-healing layers in the electrochromic device, and modifying a top transparent conductive layer of the device prior to applying bus bars.
1. A method of manufacturing electrochromic devices, the method of manufacturing comprising:
(a) fabricating an electrochromic device comprising an electrochromic stack between a first and a second transparent electrically conductive layer on a glass substrate without pre-patterning in a first facility, wherein pre-patterning comprises determining a location of one or more bus bars to be applied to the first and second transparent electrically conductive layer or cutting the glass substrate into multiple electrochromic lites;
(b) providing a hermetic top coat on the electrochromic device;
(c) after providing the hermetic top coat, shipping the glass substrate to a second facility; and
(d) performing post-processing in the second facility,
wherein (d) comprises performing a process selected from the group consisting of cutting the glass substrate into multiple electrochromic lites, laser patterning of the electrochromic device, and applying one or more bus bars to the electrochromic device, and
wherein the hermetic top coat is applied to the second transparent electrically conductive layer.
2. The method of claim 1 , wherein the cutting is performed either before or after applying one or more bus bars to the electrochromic device.
3. The method of claim 1 , further comprising applying one or more bus bars to the electrochromic device.
4. The method of claim 1 , further comprising applying a bus bar to the electrochromic device in the first facility.
5. The method of claim 1 , wherein the one or more bus bars is applied in the second facility.
6. The method of claim 1 , wherein the hermetic top coat is made of material selected from the group consisting of parylenes, silicon-based encapsulants, epoxy-based encapsulants, oxide-polymer multilayers, and combinations thereof.
7. The method of claim 1 , further comprising removing the hermetic top coat at the second facility.
8. The method of claim 1 , further comprising providing the glass substrate including the electrochromic device in an environment protected from atmospheric moisture.
9. The method of claim 8 , wherein the environment is an argon environment.
10. The method of claim 1 , further comprising providing the glass substrate including the electrochromic device with at least one other glass substrate with a second electrochromic device interleaved with a protective material.
11. The method of claim 10 , wherein the protective material comprises a powder and/or an interleaving sheet.
12. The method of claim 11 , wherein the interleaving sheet is rice paper.
13. The method of claim 1 , wherein the shipped glass substrate including the electrochromic device is not tempered.
14. The method of claim 13 , wherein the shipped glass substrate including the electrochromic device comprises an electrochromic precursor.
15. The method of claim 13 , further comprising tempering the glass substrate including the electrochromic device after cutting during the post-processing at the second facility.
16. The method of claim 14 , further comprising annealing the glass substrate including the electrochromic device after cutting during the post-processing at the second facility.