Method of manufacturing light emitting module
A method of manufacturing a light emitting module including a substrate; a light emitting element having an electrode formation surface comprising a positive and negative pair of element electrodes, and a light emitting surface on the side opposite to the electrode formation surface; a wiring electrode connected to the element electrode; and a light reflective resin layer, the method of manufacturing a light emitting module including: placing the light emitting element on a support member, in a state with the electrode formation surface facing upward, and the light emitting surface facing downward; forming a coating layer on the support member, surrounding the light emitting element; forming the wiring electrode extending from the element electrode over the coating layer; forming the light reflective resin layer on the wiring electrode and the coating layer; joining the substrate on top of the light reflective resin layer; removing the support member; and removing the coating layer.
1. A method of manufacturing a light emitting module including
a substrate,
a light emitting element having an electrode formation surface comprising a positive and negative pair of element electrodes, and a light emitting surface on a side opposite to the electrode formation surface,
a pair of wiring electrodes respectively connected to the element electrodes, and
a light reflective resin layer, wherein
the method of manufacturing the light emitting module comprising:
placing the light emitting element on a support member, in a state with the electrode formation surface facing upward, and the light emitting surface facing downward;
forming a coating layer on the support member, surrounding the light emitting element;
forming the wiring electrodes extending respectively from the element electrodes over the coating layer;
forming the light reflective resin layer on the wiring electrodes and the coating layer;
joining the substrate on top of the light reflective resin layer,
removing the support member; and
removing the coating layer.
2. The method of manufacturing a light emitting module of claim 1 , wherein
the removing of the coating layer includes removing the coating layer using dry etching.
3. The method of manufacturing a light emitting module of claim 2 , wherein
the coating layer is configured using an organic substance.
4. The method of manufacturing a light emitting module of claim 1 , wherein
the removing of the support member includes removing the support member by irradiating laser of a wavelength that is transmitted through the support member.
5. The method of manufacturing a light emitting module of claim 1 , wherein
with each of the wiring electrodes, the surface of the substrate side is configured by a material containing at least one item selected from the group consisting of Al, Ag, Pt, and Rh.
6. The method of manufacturing a light emitting module of claim 1 , wherein
in the placing of the light emitting element, a plurality of the light emitting elements are placed with being spaced apart from each other, and
in the forming of the wiring electrodes, the wiring electrodes are formed so that the element electrodes of the plurality of light emitting elements are connected to each other.
7. The method of manufacturing a light emitting module of claim 1 , wherein
the forming of the wiring electrodes includes forming the wiring electrodes to be in contact with the element electrodes and the coating layer.
8. The method of manufacturing a light emitting module of claim 1 , wherein
in the placing of the light emitting element, a plurality of the light emitting elements are placed with being spaced apart from each other, and
in the forming of the wiring electrodes, the wiring electrodes are formed so that each of the electrodes of the plurality of light emitting elements is connected to a corresponding one of the wiring electrodes.