Image sensor packages and related methods
Implementations of image sensor packages may include a plurality of microlenses coupled over a color filter array (CFA), a low refractive index layer directly coupled to and over the plurality of microlenses, an adhesive directly coupled to and over the low refractive index layer, and an optically transmissive cover directly coupled to and over the adhesive. Implementations may include no gap present between the optically transmissive cover and the plurality of microlenses.
1. An image sensor package comprising:
a die coupled to a color filter array (CFA);
a plurality of microlenses coupled over the CFA;
a low refractive index layer directly coupled to and over the plurality of microlenses;
a mask layer directly coupled to and between the low refractive index layer and the die;
an adhesive directly coupled to and over the low refractive index layer; and
an optically transmissive cover directly coupled to and over the adhesive;
wherein the mask layer extends to an outer perimeter of the low refractive index layer; and
wherein the low refractive index layer separates the mask layer from the plurality of microlenses.
2. The image sensor package of claim 1 , wherein the low refractive index layer comprises one of an acrylic resin, polymer resins, an inorganic filler, inorganic fillers, an aerogel material, or any combination thereof.
3. The image sensor package of claim 1 , wherein the low refractive index layer comprises a refractive index of 1.2.
4. The image sensor package of claim 1 , wherein the low refractive index layer comprises a thickness less than 5 micrometers.
5. The image sensor package of claim 1 , wherein the adhesive is directly coupled to an entire surface of the optically transmissive cover.
6. The image sensor package of claim 1 , wherein the mask layer is embedded within the low refractive index layer.
7. An image sensor package comprising:
a first side of a substrate coupled to an oxide layer through a plurality of electrical contacts, wherein the plurality of electrical contacts are directly coupled to and are entirely between the substrate and the oxide layer;
a digital signal processor directly coupled to the oxide layer;
a plurality of through silicon vias (TSVs) formed in the digital signal processor;
an image sensor coupled over the digital signal processor;
an underfill layer coupled between the substrate and the oxide layer;
a plurality of microlenses coupled over the image sensor;
an optically transmissive cover coupled over the plurality of microlenses; and
a mold compound directly coupled to the first side of the substrate and to two or more sides of each of the optically transmissive cover, the image sensor, the digital signal processor, and the underfill layer;
wherein each electrical contact of the plurality of electrical contacts is formed directly under a TSV of the plurality of TSVs.
8. The image sensor package of claim 7 , further comprising an adhesive and a low refractive index layer coupled between the optically transmissive cover and the plurality of microlenses.
9. The image sensor package of claim 8 , wherein the low refractive index layer comprises an acrylic resin, polymer resins, an inorganic filler, inorganic fillers, an aerogel material, or any combination thereof.
10. The image sensor package of claim 7 , wherein a perimeter of the optically transmissive cover is smaller than a perimeter of the substrate.
11. The image sensor package of claim 8 , wherein the low refractive index layer comprises a refractive index of 1.2.
12. The image sensor package of claim 7 , wherein the image sensor is stacked over the digital signal processor and the digital signal processor is stacked over the substrate.
13. The image sensor package of claim 7 , wherein the mold compound is a continuous mold compound.
14. The image sensor package of claim 7 , wherein the mold compound is directly coupled to two or more entire sides of the optically transmissive cover.
15. An image sensor package comprising:
a first side of a substrate coupled to an oxide layer through a plurality of electrical contacts, wherein the plurality of electrical contacts are directly coupled to and are entirely between the substrate and the oxide layer;
a digital signal processor directly coupled to the oxide layer;
a plurality of through silicon vias (TSVs) formed in the digital signal processor;
an image sensor coupled over the digital signal processor;
an underfill layer coupled directly to and between the substrate and the oxide layer;
a color filter array (CFA) coupled over the image sensor;
a plurality of microlenses coupled over the CFA;
a low refractive index layer directly coupled to and over the plurality of microlenses;
an adhesive directly coupled to and over the low refractive index layer; and
an optically transmissive cover directly coupled to and over the adhesive;
wherein the digital signal processor and the image sensor are coupled over the first side of the substrate;
wherein the image sensor is stacked over the digital signal processor and the digital signal processor is stacked over the substrate;
wherein a width of the substrate is greater than a width of the digital signal processor; and
wherein each electrical contact of the plurality of electrical contacts is electrically coupled to and directly under a TSV of the plurality of TSVs.
16. The image sensor package of claim 15 , further comprising a mold compound directly coupled to the first side of the substrate and to two or more sides of each of the optically transmissive cover, the image sensor, the digital signal processor, and the underfill layer.