IP Library Granted Patent US 10,817,111
Granted Patent B1
US 10,817,111 · App. 16/455,218 · Granted Oct 27, 2020

Methods and apparatus for a capacitive touch sensor

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Quick Facts
Patent No.
US 10,817,111
App. No.
16/455,218
Granted
Oct 27, 2020
Kind
B1
Abstract

Various embodiments of the present technology may provide methods and apparatus for a touch sensor. The touch sensor may include a plurality of horizontally-positioned electrode chains and a plurality of vertically-positioned electrode chains overlapping the plurality of horizontally-positioned electrode chains. Each electrode chain from the plurality of horizontally-positioned electrode chains and the plurality of vertically-positioned electrode chains may operate as a drive electrode and a reception electrode.

Claims (58)

1. A mutual capacitance touch sensor, comprising:

a plurality of horizontally-positioned electrode chains, wherein each electrode chain from the plurality of horizontally-positioned electrode chains:

comprises a first plurality of electrically-connected electrode pads; and

is configured to operate as a drive electrode and a transmission electrode; and

a plurality of vertically-positioned electrode chains partially overlapping the plurality of horizontally-positioned electrode chains, wherein each electrode chain from the plurality of vertically-positioned electrode chains:

comprises a second plurality of electrically-connected electrode pads; and

is configured to operate as the drive electrode and the transmission electrode.

2. The mutual capacitance touch sensor according to claim 1 , wherein the first plurality of electrode pads are electrically connected to each other via a first plurality of connectors, wherein a first electrode pad from the first plurality of electrode pads is connected to a second electrode pad from the first plurality of electrode pads via a first connector.

3. The mutual capacitance touch sensor according to claim 2 , wherein the second plurality of electrode pads are electrically connected to each other via a second plurality of connectors, wherein a third electrode pad from the second plurality of electrode pads is connected to a fourth electrode pad from the second plurality of electrode pads via a second connector.

4. The mutual capacitance touch sensor according to claim 3 , wherein:

the second connector overlaps the first connector; and

the first, second, third, and fourth electrodes pads are non-overlapping.

5. The mutual capacitance touch sensor according to claim 1 , wherein the first plurality of electrode pads are:

evenly-spaced with respect to each other; and

arranged in an alternating diagonal pattern.

6. The mutual capacitance touch sensor according to claim 1 , wherein the second plurality of electrode pads are:

evenly-spaced with respect to each other; and

arranged in an alternating diagonal pattern.

7. The mutual capacitance touch sensor according to claim 1 , wherein:

the plurality of horizontally-positioned electrode chains are formed in a first substrate layer; and

the plurality of vertically-positioned electrode chains are formed in a second substrate layer; and

the first and second substrate layers are bonded together.

8. The mutual capacitance touch sensor according to claim 1 , wherein:

at least one electrode pad, from the plurality of horizontally-positioned electrodes chains, is evenly-spaced between at least four directly-adjacent electrode pads; and

at least one electrode pad, from the plurality of vertically-positioned electrode chains, is evenly-spaced between at least four directly-adjacent electrode pads.

9. The mutual capacitance touch sensor according to claim 8 , wherein the directly-adjacent electrode pads comprise a directly-above electrode pad, a directly-below electrode pad, a directly-to-the-right electrode pad, and a directly-to-the-left electrode pad.

10. A method for operating a mutual capacitance touch sensor, comprising:

activating a first phase comprising:

operating a first electrode chain from a plurality of horizontally-positioned electrode chains as a reception electrode and operating all remaining electrode chains from the plurality of horizontally-positioned electrode chains as a drive electrode;

operating a plurality of vertically-positioned electrode chains as the drive electrode; and

forming a first capacitance between the first electrode chain and directly-adjacent drive electrodes from the plurality of horizontally-positioned electrode chains and the plurality of vertically-positioned electrode chains; and

activating a second phase comprising:

operating a second electrode chain from the plurality of vertically-positioned electrode chains as a reception electrode and operating all remaining electrode chains from the plurality of vertically-positioned electrode chains as the drive electrode;

operating the plurality of horizontally-positioned electrode chains as the drive electrode; and

forming a second capacitance between the second electrode chain and directly-adjacent drive electrodes from the plurality of horizontally-positioned electrode chains and the plurality of vertically-positioned electrode chains.

11. The method according to claim 10 , wherein the first phase further comprises operating a next electrode chain from the plurality of horizontally-positioned electrode chains as the reception electrode, wherein the next electrode chain is directly-adjacent to the first electrode chain.

12. The method according to claim 10 , wherein the second phase further comprises operating a next electrode chain from a plurality of horizontally-positioned electrode chains as the reception electrode, wherein the next electrode chain is directly-adjacent to the second electrode chain.

13. The method according to claim 10 , wherein operating the plurality of vertically-positioned electrode chains as the drive electrode comprises applying a drive signal to each of the vertically-positioned electrode chains.

14. The method according to claim 10 , wherein operating the plurality of horizontally-positioned electrode chains as the drive electrode comprises applying a drive signal to each of the horizontally-positioned electrode chains.

15. A mutual capacitance touch sensor system, comprising:

a touch sensor array comprising:

a plurality of electrode chains, comprising:

a first set of electrode chains arranged in a first direction, wherein each electrode chain from the first set of electrode chains is arranged in a zigzag pattern; and

a second set of electrode chains arranged in a second direction, perpendicular to the first direction, wherein each electrode chain from the second set of electrode chains is arranged in a zigzag pattern;

wherein each electrode chain, from the plurality of electrode chains, is configured to:

receive a drive signal and operate as a drive electrode; and

operate as a reception electrode; and

a microprocessor coupled to the touch sensor array, wherein the microprocessor is configured to generate the drive signal and apply the drive signal to the electrode chains according to a predetermined sequence.

16. The mutual capacitance touch sensor system according to claim 15 , wherein each electrode chain comprises:

a plurality of electrode pads; and

a plurality of connectors to electrically connect directly-adjacent electrodes pads.

17. The mutual capacitance touch sensor system according to claim 16 , wherein the electrode pads are evenly-spaced relative to each other.

18. The mutual capacitance touch sensor system according to claim 16 , wherein at least one electrode pad is evenly-spaced between at least four directly-adjacent electrode pads.

19. The mutual capacitance touch sensor system according to claim 18 , wherein the directly-adjacent electrode pads comprise a directly-above electrode pad, a directly-below electrode pad, a directly-to-the-right electrode pad, and a directly-to-the-left electrode pad.

20. The mutual capacitance touch sensor system according to claim 15 , wherein:

the first set of electrode chains are formed on a first substrate,

the second set of electrode chains are formed on second substrate; and

the second substrate overlaps the first substrate.

Assignments (3)
RELEASE OF SECURITY INTEREST IN PATENTS PREVIOUSLY RECORDED AT REEL 050156, FRAME 0421 Recorded Aug 16, 2023
From: DEUTSCHE BANK AG NEW YORK BRANCH, AS COLLATERAL AGENT
To: SEMICONDUCTOR COMPONENTS INDUSTRIES, LLC
Reel/Frame 064615/0639 →
SECURITY INTEREST Recorded Aug 23, 2019
From: SEMICONDUCTOR COMPONENTS INDUSTRIES, LLC
To: DEUTSCHE BANK AG NEW YORK BRANCH, AS COLLATERAL AGENT
Reel/Frame 050156/0421 →
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Jun 27, 2019
From: OTAGAKI, TAKAYASU; ISHIKAWA, KAZUYOSHI
To: SEMICONDUCTOR COMPONENTS INDUSTRIES, LLC
Reel/Frame 049616/0281 →