Housing, electronic device, and method for manufacturing housing
View Patent ↗A housing is formed by bending a metal plate including a molded plastic part. The molded plastic part includes a perimeter portion formed along an outer peripheral edge of the metal plate, and a bent part formed in a bending area in which the metal plate is bent. The bent part is provided with a notch formed along the bending area.
1. A housing comprising a metal plate including a molded plastic part, the housing being formed by bending the metal plate including the molded plastic part,
wherein the molded plastic part includes:
a perimeter portion located along an outer peripheral edge of the metal plate; and
a bent part located in a region including a bending area at which the metal plate is bent, and
the bent part is provided with a notch located along the bending area,
wherein the metal plate includes:
a printed circuit board (PCB) contact part to be contactable with a substrate on which electronic components are mounted;
a main part; and
a biasing portion extending from the main part to the PCB contact part, the biasing portion being configured to exert a biasing force toward the substrate to the PCB contact part; and
the molded plastic part includes:
a first portion disposed on a first surface of the biasing portion and extending from an intermediate portion of the biasing portion toward the PCB contact part; and
a second portion disposed on a second surface of the biasing portion and extending from the intermediate portion toward the metal plate.
2. The housing according to claim 1 ,
wherein the metal plate is exposed along the bending area in the bent part.
3. The housing according to claim 1 ,
wherein the notch has a V-shape of which width increases away from the metal plate.
4. The housing according to claim 1 ,
wherein the molded plastic part includes a substrate-securing portion to secure the substrate on which the electronic components are mounted; and
the metal plate includes the printed circuit board (PCB) contact part to be contact with the substrate secured to the substrate-securing portion.
5. The housing according to claim 1 ,
wherein the molded plastic part includes a pair of fastening pieces engaged with each other in a state where the metal plate is bent.
6. An electronic device comprising:
the housing according to claim 1 ; and
a circuit board secured to the housing.
7. A method for manufacturing the housing according to claim 1 , the method comprising:
disposing a metal plate material into a metal mold, the metal plate material including the PCB contact part and the biasing portion;
bending the biasing portion by closing the metal mold; and
in the metal mold, supplying a resin material to a region around the biasing portion that has been bent, to mold the first portion and the second portion.