IP Library Granted Patent US 10,633,537
Granted Patent B2
US 10,633,537 · App. 16/458,579 · Granted Apr 28, 2020

Thermoplastic compositions having good dielectric and ductility properties

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Quick Facts
Patent No.
US 10,633,537
App. No.
16/458,579
Granted
Apr 28, 2020
Kind
B2
Abstract

A thermoplastic composition includes from 29.9 wt % to 84.9 wt % of a base resin including poly(p-phenylene oxide) (PPO), polystyrene (PS) and an impact modifier; from 15 wt % to 70 wt % of a dielectric filler; and from 0.1 wt % to 10 wt % of an impact promoter including a polycarbonate-siloxane copolymer, a polyolefin-siloxane copolymer, or a combination thereof. The thermoplastic composition has a dielectric constant (Dk) of from 3.0-8.0 between 1 and 5 gigahertz (GHz) and a dissipation factor (Df) of less than 0.003 between 1 and 5 GHz. Articles including the thermoplastic composition, and in particular telecommunications devices, are also described.

Claims (22)

1. A thermoplastic composition comprising:

from 29.9 wt % to 84.9 wt % of a base resin comprising poly(p-phenylene oxide) (PPO), polystyrene (PS) and an impact modifier;

from 15 wt % to 70 wt % of a dielectric filler; and

from 0.1 wt % to 10 wt % of an impact promoter comprising a polycarbonate-siloxane copolymer, a polyolefin-siloxane copolymer, or a combination thereof,

wherein

the thermoplastic composition has a dielectric constant (Dk) of from 3.0-8.0 between 1 and 5 gigahertz (GHz) and a dissipation factor (Df) of less than 0.003 between 1 and 5 GHz,

the combined weight percent value of all components does not exceed 100 wt %, and

all weight percent values are based on the total weight of the thermoplastic composition.

2. The thermoplastic composition according to claim 1 , wherein the base resin comprises from 20 wt % to 85 wt % PPO, from 10 wt % to 50 wt % PS and from 5 wt % to 30 wt % impact modifier.

3. The thermoplastic composition according to claim 1 , wherein the PS comprises general purpose PS, high impact PS or a combination thereof.

4. The thermoplastic composition according to claim 1 , wherein the impact modifier comprises styrene-ethylene/butylene-styrene (SEBS), syndiotactic polystyrene (SPS), styrene-ethylene-propylene-styrene (SEPS), or a combination thereof.

5. The thermoplastic composition according to claim 1 , wherein the dielectric filler comprises a ceramic filler.

6. The thermoplastic composition according to claim 5 , wherein the ceramic filler comprises TiO 2 , BaTiO 3 , or a combination thereof.

7. The thermoplastic composition according to claim 1 , wherein the thermoplastic composition comprises from 0.5 wt % to 5 wt % of the impact promoter.

8. The thermoplastic composition according to claim 1 , wherein the impact promoter comprises from 40 wt % to 80 wt % siloxane units.

9. The thermoplastic composition according to claim 1 , wherein the thermoplastic composition has a 100% ductility at 23° C. as determined in accordance with ASTM D256 or ISO 180.

10. The thermoplastic composition according to claim 1 , wherein the thermoplastic composition has a notched Izod impact strength at 23 degrees Celsius (° C.) that is from 10% to 400% greater than that of a substantially identical reference composition that does not include the impact promoter, and wherein notched Izod impact strength is determined in accordance with ASTM D256 or ISO 180.

11. The thermoplastic composition according to claim 1 , wherein the thermoplastic composition has a notched Izod impact strength at 23° C. that is from 20% to 250% greater than that of a substantially identical reference composition that does not include the impact promoter, and wherein notched Izod impact strength is determined in accordance with ASTM D256 or ISO 180.

12. The thermoplastic composition according to claim 1 , wherein the thermoplastic composition has a notched Izod impact strength at 23° C. that is from 50% to 250% greater than that of a substantially identical reference composition that does not include the impact promoter, and wherein notched Izod impact strength is determined in accordance with ASTM D256 or ISO 180.

13. The thermoplastic composition according to claim 1 , wherein the thermoplastic composition comprises one or more additional additives.

14. The thermoplastic composition according to claim 13 , wherein the one or more additional additives comprises an antioxidant, a colorant, a de-molding agent, a dye, a flow promoter, a flow modifier, a light stabilizer, a lubricant, a mold release agent, a pigment, a quenching agent, a thermal stabilizer, a UV absorbant, a UV reflectant, a UV stabilizer, an epoxy chain extender, a flame retardant, or a combination thereof.

15. An article comprising the thermoplastic composition according to claim 1 , wherein the article is a telecommunications device.

Assignments (3)
CORRECTIVE ASSIGNMENT TO CORRECT THE REMOVE THE APPLICATION NUMBER 15039474 PREVIOUSLY RECORDED AT REEL: 054528 FRAME: 0467. ASSIGNOR(S) HEREBY CONFIRMS THE ASSIGNMENT. Recorded Mar 23, 2021
From: SABIC GLOBAL TECHNOLOGIES B.V.
To: SHPP GLOBAL TECHNOLOGIES B.V.
Reel/Frame 057453/0680 →
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Nov 26, 2020
From: SABIC GLOBAL TECHNOLOGIES B.V.
To: SHPP GLOBAL TECHNOLOGIES B.V.
Reel/Frame 054528/0467 →
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Jul 1, 2019
From: WANG, JIAN; SHAN, WEI; LIU, XING
To: SABIC GLOBAL TECHNOLOGIES B.V.
Reel/Frame 049642/0071 →