IP Library Granted Patent US 11,099,424
Granted Patent B2
US 11,099,424 · App. 16/459,979 · Granted Aug 24, 2021

High color gamut LED bar with side illumination LED package

Inventors: Yong Gu Kang (Singapore, SG); Guentaek Oh (Singapore, SG)
Assignee: Dell Products L.P.
G02F1/133603H01L33/06
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Quick Facts
Patent No.
US 11,099,424
App. No.
16/459,979
Granted
Aug 24, 2021
Kind
B2
Abstract

An illumination device provides illumination as backlight to a liquid crystal display by disposing plural light emitting diode packages on a circuit board having green quantum dot material integrated with a photoresist ink. Each package includes one or more blue light emitting diode integrated circuits enclosed in a silicon filling material that integrates a red phosphor extending above one or more sidewalls of the package so that at least some illumination from the blue light emitting diode is directed towards the green quantum dot material, resulting in generation of high color gamut backlight illumination.

Claims (48)

1. An information handling system comprising:

a housing;

a processor disposed in the housing and operable to execute instructions that process information;

a memory disposed in the housing and interfaced with the processor to store the instructions and information;

a display panel integrated in the housing and interfaced with the processor to present the information as visual images; and

a backlight disposed at the display panel to illuminate the visual images, the backlight including plural light emitting diode packages coupled to a circuit board having a support surface, each light emitting diode packages including one or more light emitting diode integrated circuits, the light emitting diode integrated circuits having a first color illumination, each of the light emitting diode integrated circuits including a second color material disposed in a silicon filling material over each of the light emitting diode integrated circuits, and the circuit board having a third color illumination material disposed on the circuit board support surface.

2. The information handling system of claim 1 wherein:

the light emitting diode integrated circuits have only a blue color illumination;

the silicon filing material has only a red illumination; and

the third color illumination material has only a green illumination.

3. The information handling system of claim 2 wherein the third color illumination material comprises green quantum dots integrated with a photo resist ink disposed over the circuit board.

4. The information handling system of claim 2 wherein the silicon filing material comprises a red phosphor.

5. The information handling system of claim 1 wherein:

each of the plural light emitting diode packages encloses the one or more light emitting diode integrated circuits and the silicon filing material in a housing coupled to the circuit board and having an open upper surface; and

the silicon filling material extends out of the opening at a greater height over the circuit board than the housing so that illumination from the silicon filling material is directed towards the third color illumination material.

6. The information handling system of claim 5 wherein the one or more light emitting diode integrated circuits comprise plural light emitting diode integrated circuits having a linear configuration between opposing ends of the housing.

7. The information handling system of claim 6 wherein the housing at both opposing ends has a height of less than a height of the plural light emitting diodes.

8. The information handling system of claim 1 wherein the backlight further comprises a linear circuit board having the light emitting diode packages in a linear configuration and a light guide configured to accept illumination from the linear circuit board for distribution at the display.

9. The information handling system of claim 8 wherein the display comprises a liquid crystal display panel.

10. A method for generating illumination, the method comprising:

generating blue light with a blue light emitting diode disposed in a package and coupled to a circuit board;

generating red light with a passive red material disposed in silicon filling material, the silicon filling material disposed in the package, the passive red material energized by the blue light to illuminate red light; and

generating green light with a passive green material disposed on the circuit board outside the package, passive green material energized by the blue light to illuminate green light.

11. The method of claim 10 further comprising:

forming the package to have at least a part of a sidewall with a height not greater than a height of the blue light emitting diode relative to the circuit board; and

illuminating the passive green material through the at least part of a sidewall.

12. The method of claim 11 wherein the passive green material comprises quantum dot material.

13. The method of claim 12 wherein the passive red material comprises red phosphor.

14. The method of claim 13 further comprising:

coupling plural of the packages on the circuit board in a linear configuration; and

coupling the circuit board to a planar light guide to distribute the illumination.

15. The method of claim 14 further comprising:

coupling the light guide to a liquid crystal display panel; and

directing the illumination from the light guide through the liquid crystal panel.

16. The method of claim 15 further comprising:

disposing a photoresist ink over the circuit board; and

coupling the quantum material to the photoresist ink.

17. An illumination device comprising:

a circuit board;

a package having plural sidewalls defining an interior and an opening, the package coupled to the circuit board;

a blue light emitting diode integrated circuit coupled to the package in the interior;

a filling material disposed in the package interior and integrating red phosphor material operable to illuminate red light when energized by the blue light emitting diode integrated circuit; and

a green quantum dot material disposed on the circuit board external to the package.

18. The illumination device of claim 17 further comprising:

a photoresist ink disposed on the circuit board;

wherein the green quantum dot material integrates in the photoresist ink.

19. The illumination device of claim 17 wherein the opening forms with at least one of the plural sidewalls having a height of less than a height of the blue light emitting diode relative to the circuit board.

20. The illumination device of claim 19 further comprising plural of the packages disposed in a linear configuration on the circuit board.

Assignments (9)
RELEASE OF SECURITY INTEREST IN PATENTS PREVIOUSLY RECORDED AT REEL/FRAME (053546/0001) Recorded Jun 23, 2022
From: THE BANK OF NEW YORK MELLON TRUST COMPANY, N.A., AS NOTES COLLATERAL AGENT
To: DELL MARKETING L.P. (ON BEHALF OF ITSELF AND AS SUCCESSOR-IN-INTEREST TO CREDANT TECHNOLOGIES, INC.); DELL INTERNATIONAL L.L.C.; DELL PRODUCTS L.P.; DELL USA L.P.; EMC CORPORATION; DELL MARKETING CORPORATION (SUCCESSOR-IN-INTEREST TO FORCE10 NETWORKS, INC. AND WYSE TECHNOLOGY L.L.C.); EMC IP HOLDING COMPANY LLC
Reel/Frame 071642/0001 →
RELEASE OF SECURITY INTEREST IN PATENTS PREVIOUSLY RECORDED AT REEL/FRAME (053311/0169) Recorded Jun 23, 2022
From: THE BANK OF NEW YORK MELLON TRUST COMPANY, N.A., AS NOTES COLLATERAL AGENT
To: DELL PRODUCTS L.P.; EMC CORPORATION; EMC IP HOLDING COMPANY LLC
Reel/Frame 060438/0742 →
RELEASE OF SECURITY INTEREST IN PATENTS PREVIOUSLY RECORDED AT REEL/FRAME (050724/0571) Recorded Jun 23, 2022
From: THE BANK OF NEW YORK MELLON TRUST COMPANY, N.A., AS NOTES COLLATERAL AGENT
To: DELL PRODUCTS L.P.; EMC CORPORATION; EMC IP HOLDING COMPANY LLC
Reel/Frame 060436/0088 →
RELEASE OF SECURITY INTEREST AT REEL 050406 FRAME 421 Recorded Nov 2, 2021
From: CREDIT SUISSE AG, CAYMAN ISLANDS BRANCH
To: DELL PRODUCTS L.P.; EMC CORPORATION; EMC IP HOLDING COMPANY LLC
Reel/Frame 058213/0825 →
SECURITY INTEREST Recorded Jun 5, 2020
From: DELL PRODUCTS L.P.; EMC CORPORATION; EMC IP HOLDING COMPANY LLC
To: THE BANK OF NEW YORK MELLON TRUST COMPANY, N.A., AS COLLATERAL AGENT
Reel/Frame 053311/0169 →
SECURITY AGREEMENT Recorded Apr 22, 2020
From: CREDANT TECHNOLOGIES INC.; DELL INTERNATIONAL L.L.C.; DELL MARKETING L.P.; DELL PRODUCTS L.P.; DELL USA L.P.; EMC CORPORATION; FORCE10 NETWORKS, INC.; WYSE TECHNOLOGY L.L.C.; EMC IP HOLDING COMPANY LLC
To: THE BANK OF NEW YORK MELLON TRUST COMPANY, N.A.
Reel/Frame 053546/0001 →
PATENT SECURITY AGREEMENT (NOTES) Recorded Oct 15, 2019
From: DELL PRODUCTS L.P.; EMC CORPORATION; EMC IP HOLDING COMPANY LLC
To: THE BANK OF NEW YORK MELLON TRUST COMPANY, N.A., AS COLLATERAL AGENT
Reel/Frame 050724/0571 →
SECURITY AGREEMENT Recorded Sep 17, 2019
From: DELL PRODUCTS L.P.; EMC CORPORATION; EMC IP HOLDING COMPANY LLC
To: CREDIT SUISSE AG, CAYMAN ISLANDS BRANCH
Reel/Frame 050406/0421 →
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Jul 2, 2019
From: KANG, YONG GU; OH, GUENTAEK
To: DELL PRODUCTS L.P.
Reel/Frame 049653/0602 →