Flexible optoelectronic devices
An optoelectronic device comprising a unit, which unit comprises: a plurality of resiliently flexible sheet components bonded together, the resiliently flexible sheet components comprising: (i) a first sheet component comprising at least a stack of layers defining an array of pixel electrodes and electrical circuitry for independently addressing each pixel electrodes via addressing conductors outside the array of pixel electrodes; and (ii) a second sheet component bonded to a top surface of the first sheet component; wherein the device further comprises one or more driver chips bonded to the first sheet component in a location underlying the second component and for electrical contact between said addressing conductors and terminals of said one or more driver chips; and wherein the thickness of material in the unit in the region of the one or more driver chips is substantially the same as the thickness of material in the unit in the region of the array.
1. An optoelectronic device comprising a unit, which unit comprises: a plurality of resiliently flexible sheet components bonded together, the resiliently flexible sheet components comprising: (i) a first sheet component comprising at least a stack of layers defining an array of pixel electrodes and electrical circuitry for independently addressing each pixel electrode via addressing conductors outside the array of pixel electrodes; and (ii) a second sheet component bonded to a top surface of the first sheet component; wherein the device further comprises one or more driver chips bonded to the first sheet component in a location underlying the second sheet component and for electrical contact between said addressing conductors and terminals of said one or more driver chips; and wherein the thickness of material in the unit in a region of the one or more driver chips is substantially the same as the thickness of material in the unit in a region of the array.
2. The device according to claim 1 , wherein the one or more driver chips are also bonded to the second sheet component other than via the first sheet component.
3. The device according to claim 1 , wherein the unit has a neutral axis passing through the one or more driver chips, or closely above or closely below the one or more driver chips.
4. The device according to claim 1 , wherein the one or more driver chips are bonded to the second sheet component via material filling a space around the one or more driver chips between the first and second sheet components.
5. The device according to claim 1 , wherein the first sheet component comprises a resiliently flexible support film supporting at least said stack of layers.
6. The device according to claim 1 , wherein the first sheet component comprises a second resiliently flexible support film bonded to the stack, and liquid crystal material contained between the second resiliently flexible support film and the stack.
7. The device according to claim 1 , wherein the second sheet component comprises a polarising filter component.
8. The device according to claim 1 , wherein the plurality of resiliently flexible sheet components further comprises a third sheet component on the opposite side of the first sheet component to the second sheet component.
9. The device according to claim 8 , wherein the third sheet component comprises a polarising filter component.
10. A method of producing a device according claim 1 , the method comprising: applying the one or more driver chips to the first sheet component; bonding the second sheet component to the first sheet component so as to overlie the one or more driver chips; and filling a space between the first and second sheet components and around the one or more driver chips with a material.