IP Library Granted Patent US 10,727,944
Granted Patent B2
US 10,727,944 · App. 16/460,479 · Granted Jul 28, 2020

Method and system for optoelectronics transceivers integrated on a CMOS chip

Inventors: Thierry Pinguet (Cardiff-by-the-Sea, CA); Steffen Gloeckner (San Diego, CA); Sherif Abdalla (Carlsbad, CA); Sina Mirsaidi (San Diego, CA); Peter De Dobbelaere (San Diego, CA); Lawrence C. Gunn, III (Encinitas, CA)
Assignee: Luxtera LLC.
H04B10/25G02B6/124G02B6/1228G02B6/43G02B6/4214
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Quick Facts
Patent No.
US 10,727,944
App. No.
16/460,479
Granted
Jul 28, 2020
Kind
B2
Abstract

Methods and systems for optoelectronics transceivers of a CMOS chip are disclosed and may include receiving optical signals from optical fibers via grating couplers, which may include a guard ring. A CW optical signal may be received from a laser source via optical couplers, and may be modulated using optical modulators, which may be Mach-Zehnder and/or ring modulators. Circuitry in the CMOS chip may drive the optical modulators. The modulated optical signal may be communicated out of the CMOS chip into optical fibers via grating couplers. The received optical signals may be communicated between devices via waveguides. The photodetectors may include germanium waveguide photodiodes, avalanche photodiodes, and/or heterojunction diodes. The CW optical signal may be generated using an edge-emitting and/or a vertical-cavity surface emitting semiconductor laser.

Claims (39)

1. A method for processing signals, the method comprising:

in a CMOS chip comprising photonics devices and electronics devices:

receiving optical signals from one or more optical fibers via optical couplers;

receiving a continuous-wave (CW) optical signal from a laser source via optical couplers;

modulating said received CW optical signal using one or more optical modulators;

receiving electrical signals from circuitry in said CMOS chip;

driving said one or more optical modulators using said received electrical signals; and

communicating said modulated optical signal out of said CMOS chip into one or more optical fibers via one or more optical couplers.

2. The method according to claim 1 , comprising modulating said received CW optical signal using Mach-Zehnder modulators.

3. The method according to claim 1 , comprising modulating said received CW optical signal using ring modulators.

4. The method according to claim 1 , wherein said CMOS chip comprises a CMOS guard ring.

5. The method according to claim 1 , comprising communicating said received optical signals between devices on said CMOS chip via waveguides.

6. The method according to claim 1 , wherein the CMOS chip comprises one or more photodetectors comprising germanium waveguide photodiodes.

7. The method according to claim 6 , wherein said one or more photodetectors comprise germanium waveguide avalanche photodiodes.

8. The method according to claim 1 , wherein the CMOS chip comprises one or more photodetectors comprising heterojunction diodes.

9. The method according to claim 1 , comprising generating said CW optical signal using an edge-emitting semiconductor laser.

10. The method according to claim 1 , comprising generating said CW optical signal using a vertical-cavity surface emitting semiconductor laser.

11. The method according to claim 1 , wherein said laser source is coupled to said CMOS chip.

12. The method according to claim 1 , wherein said photonics devices comprise said one or more optical couplers, one or more photodetectors, and said one or more optical modulators.

13. The method according to claim 1 , wherein said one or more optical couplers comprise grating couplers.

14. A system for processing signals, the system comprising:

a CMOS chip comprising photonics devices and electronics devices, wherein said CMOS chip comprises:

one or more optical couplers enabled to receive optical signals from one or more optical fibers;

one or more optical couplers enabled to receive a continuous-wave (CW) optical signal from a laser source;

one or more optical modulators enabled to modulate said received CW optical signal;

one or more circuits enabled to receive electrical signals and drive said one or more optical modulators using said received electrical signals; and

one or more optical couplers enabled to communicate said modulated optical signal out of said CMOS chip into one or more optical fibers.

15. The system according to claim 14 , wherein said optical modulators comprise Mach-Zehnder modulators.

16. The system according to claim 14 , wherein said optical modulators comprise ring modulators.

17. The system according to claim 14 , wherein said CMOS chip comprises a CMOS guard ring.

18. The system according to claim 14 , wherein said received optical signals are communicated between devices on said CMOS chip using waveguides.

19. The system according to claim 14 , wherein said CMOS chip comprises one or more photodetectors comprising germanium waveguide photodiodes.

20. The system according to claim 19 , wherein said one or more photodetectors comprise germanium waveguide avalanche photodiodes.

21. The system according to claim 14 , wherein said CMOS chip comprises one or more photodetectors comprising heterojunction diodes.

22. The system according to claim 14 , wherein said laser source is an edge-emitting semiconductor laser.

23. The system according to claim 14 , wherein said laser source is a vertical-cavity surface emitting semiconductor laser.

24. The system according to claim 14 , wherein said laser source is coupled to said CMOS chip.

25. The system according to claim 14 , wherein said photonics devices comprise said one or more optical couplers, one or more photodetectors, and said one or more optical modulators.

26. The system according to claim 14 , wherein said one or more optical couplers comprise grating couplers.

Assignments (3)
CORRECTIVE ASSIGNMENT TO CORRECT THE THE ASSIGNOR'S NAME PREVIOUSLY RECORDED AT REEL: 058979 FRAME: 0027. ASSIGNOR(S) HEREBY CONFIRMS THE ASSIGNMENT. Recorded Mar 24, 2022
From: LUXTERA LLC
To: CISCO TECHNOLOGY, INC.
Reel/Frame 059496/0803 →
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Feb 8, 2022
From: CISCO SYSTEMS, INC.
To: CISCO TECHNOLOGY, INC.
Reel/Frame 058979/0027 →
CHANGE OF NAME Recorded Feb 6, 2020
From: LUXTERA, INC.
To: LUXTERA LLC
Reel/Frame 052019/0811 →