IP Library Granted Patent US 11,370,853
Granted Patent B2
US 11,370,853 · App. 16/461,839 · Granted Jun 28, 2022

Resin beads and use in processing of aqueous solutions

Inventors: Chang-Soo Lee (Seoul, KR); Collin H. Martin (Collegeville, PA); Daryl J. Gisch (Midland, MI); Christopher R. Eicher (Midland, MI)
C08F8/42B01D15/10B01J20/265B01J20/28004B01J20/289B01J20/28016B01J20/3085C07H1/06C13B20/126B01D15/1821B01J2220/52
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Quick Facts
Patent No.
US 11,370,853
App. No.
16/461,839
Granted
Jun 28, 2022
Kind
B2
Abstract

A method of processing an aqueous solution, wherein the aqueous solution comprises one or more dissolved sugar, one or more dissolved sugar alcohol, or a mixture thereof, wherein the method comprises bringing the aqueous solution into contact with a collection of resin beads, wherein the resin beads comprise functional groups of structure (S1).

Claims (10)

1. A method of processing an aqueous solution,

wherein the aqueous solution comprises one or more dissolved sugar,

one or more dissolved sugar alcohol, or a mixture thereof,

wherein the method comprises bringing the aqueous solution into contact with a collection of resin beads, wherein the resin beads comprise functional groups of structure (S1)

wherein —X— is a bivalent linking group, wherein —Y is a monovalent group having structure (S2)

wherein the circular structure in structure (S2) has four or more atoms.

2. The method of claim 1 , wherein the aqueous solution has pH less than 6.

3. The method of claim 1 , wherein the dissolved sugar is present in an amount, by weight based on the weight of the aqueous solution, of 5% to 60%.

4. The method of claim 1 , wherein the collection of resin beads has harmonic mean diameter of 200 μm or higher.

5. The method of claim 1 , wherein the collection of resin beads has uniformity coefficient of 1.02 or greater.

Assignments (6)
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Sep 10, 2024
From: DOW GLOBAL TECHNOLOGIES LLC
To: THE DOW CHEMICAL COMPANY
Reel/Frame 069923/0030 →
CHANGE OF LEGAL ENTITY Recorded Sep 10, 2024
From: DDP SPECIALTY ELECTRONIC MATERIALS US, INC
To: DDP SPECIALTY ELECTRONIC MATERIALS US, LLC
Reel/Frame 068907/0881 →
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Sep 10, 2024
From: ROHM AND HAAS COMPANY
To: DDP SPECIALTY ELECTRONIC MATERIALS US 8, LLC
Reel/Frame 068908/0001 →
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Sep 10, 2024
From: THE DOW CHEMICAL COMPANY
To: DDP SPECIALTY ELECTRONIC MATERIALS US, INC
Reel/Frame 068922/0001 →
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Jun 14, 2019
From: LEE, CHANG-SOO; MARTIN, COLLIN H.
To: ROHM AND HAAS COMPANY
Reel/Frame 049467/0367 →
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Jun 14, 2019
From: GISCH, DARYL J.; EICHER, CHRISTOPHER R.
To: DOW GLOBAL TECHNOLOGIES LLC
Reel/Frame 049476/0228 →