Electronic control device
Provided is an electronic control device that can be reduced in size and weight and can maintain high reliability even under a severe environment. The electronic control device includes: a control substrate; a connector having one end connected to the control substrate and the other end connected to an external terminal; and a housing that covers at least the control substrate and a connecting portion on the connector with the control substrate, in which the housing includes a resin and a metal plate, the metal plate includes a bend part at its outer peripheral portion, and the bend part is covered with the resin.
1. An electronic control device comprising:
a control substrate;
a connector having one end connected to the control substrate and the other end connected to an external terminal; and
a housing that covers at least the control substrate and a connecting portion on the connector with the control substrate,
wherein the housing includes a resin and a metal plate,
the metal plate includes a bend part at its outer peripheral portion, and
the bend part is covered with the resin,
wherein the bend part is alternately provided in both directions of the outer and inner sides of the electronic control device along the outer periphery of the metal plate.
2. The electronic control device according to claim 1 ,
wherein the bend part has a through hole.
3. The electronic control device according claim 1 ,
wherein the bend part is inclined with respect to the metal plate.
4. The electronic control device according to claim 1 ,
wherein the height of the bend part is a thickness of the metal plate or more.
5. The electronic control device according to claim 1 ,
wherein a resin thickness of a region not covering the metal plate is smaller than a resin thickness of a region covering the metal plate.
6. The electronic control device according to claim 1 ,
wherein the metal plate is formed of any of materials of aluminum, aluminum alloy, iron, or iron alloy.
7. The electronic control device according to claim 1 ,
wherein the resin contains glass fiber.
8. The electronic control device according to claim 1 ,
wherein anisotropy of a linear expansion coefficient of the resin is lower in the region covering the metal plate than in the region not covering the metal plate.
9. The electronic control device according to claim 1 ,
wherein an electronic component including a heat generating component is mounted on the control substrate.
10. The electronic control device according to claim 1 ,
wherein the metal plate is disposed on at least one of a housing case or a housing base constituting the housing.