IP Library Granted Patent US 11,043,619
Granted Patent B2
US 11,043,619 · App. 16/469,913 · Granted Jun 22, 2021

LED module with high near field contrast ratio

Inventors: Grigoriy Basin (San Francisco, CA); Anton Belyaev (Milpitas, CA); Lex Kosowsky (San Jose, CA); Yi Shyan Goh (Bayan Lepas, MY)
Assignee: Lumileds LLC
H01L33/56H01L25/0753H01L33/483H01L33/50H01L33/60H01L2933/005H01L2933/0041H01L2933/0058H01L2933/0091
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Quick Facts
Patent No.
US 11,043,619
App. No.
16/469,913
Granted
Jun 22, 2021
Kind
B2
Abstract

A light emitting diode module comprising: at least one light emitting diode structure, an integrated reflector arrangement that comprises a reflector surface for reflecting light from a light emitting area of the light emitting diode structure. The integrated reflector arrangement further comprises a back reflection surface for diffusely reflecting light emitted via a side surface of the light emitting diode structure back to the light emitting diode structure. The back reflection surface is directly attached to at least a part of the side surface such that during operation of the light emitting diode module an emission of stray light by means of the side surface is reduced. The invention finally describes a flash module, an automotive front lighting or a projection light emitting diode system comprising at least one light emitting diode module.

Claims (27)

1. A light emitting diode module comprising:

at least one light emitting diode structure comprising a light emitting diode die, a wavelength conversion structure attached to the light emitting diode die, a top surface formed by a surface of the wavelength conversion structure and comprising a light emitting area of the light emitting diode structure; an oppositely positioned bottom surface, and at least one side surface connecting the top surface and the bottom surface; and

an integrated reflector arrangement comprising a reflector surface arranged to reflect light emitted via the light emitting area of the light emitting diode structure and a back reflection surface, the back reflection surface directly attached to at least a part of the side surface of the light emitting diode structure, arranged to diffusely reflect light emitted via the side surface of the light emitting diode structure back to the light emitting diode structure, and extending along the side surface of the light emitting diode structure at least to a level of the light emitting area, the light emitting area of the light emitting diode structure and a part of the integrated reflector arrangement directly around the light emitting area forming one common flat surface.

2. The light emitting diode module according to claim 1 , wherein the integrated reflector arrangement is arranged to provide a sharp luminance cut-off outside of the light emitting area of the light emitting diode structure such that during operation of the light emitting diode module a near field contrast is at least 150.

3. The light emitting diode module according to claim 1 , wherein the back reflection surface is characterized by a reflectivity of at least 95%.

4. The light emitting diode module according to claim 1 , wherein the integrated reflector arrangement comprises a material comprising silicone resin loaded with oxide particles, the oxide particles comprising at least one oxide chosen out of the group SiO 2 , TiO 2 , Zr 2 O 3 , Y 2 O 3 , Al 2 O 3 .

5. The light emitting diode module according to claim 4 , wherein the silicone resin is loaded with a mixture of SiO 2 and TiO 2 .

6. The light emitting diode module according to claim 4 , wherein the content of the oxide particles within the silicone resin is at least 60%.

7. The light emitting diode module according to claim 1 , wherein the reflector surface is arranged such that an opening surrounded by the reflector surface at a distance of 100 μm with respect to the level of the light emitting area of the light emitting diode structure is smaller than 2 times the light emitting area of the light emitting diode structure.

8. The light emitting diode module according to claim 1 , wherein the reflector surface comprises at least one reflecting area arranged perpendicular to the light emitting area of the light emitting diode structure.

9. The light emitting diode module according to claim 1 , wherein the light emitting diode module comprises at least two light emitting diode structures arranged on a submount, wherein the integrated reflector arrangement embeds at least a part of the submount.

10. A system comprising:

a flash module; and

at least one light emitting diode module according to claim 1 disposed in the flash module.

11. A system comprising:

an automotive front lighting system; and

at least one light emitting diode module according to claim 1 disposed in the automotive front lighting module.

12. A system comprising:

a projection light system; and

at least one light emitting diode module according to claim 1 disposed in the projection light system.

13. The light emitting diode module according to claim 1 , wherein:

the integrated reflector arrangement is arranged to provide a sharp luminance cut-off outside of the light emitting area of the light emitting diode structure such that during operation of the light emitting diode module a near field contrast is at least 150; and

the back reflection surface is characterized by a reflectivity of at least 95%.

14. The light emitting diode module according to claim 13 , wherein the integrated reflector arrangement comprises a material comprising silicone resin loaded a mixture of SiO 2 and TiO 2 .

15. The light emitting diode module according to claim 14 , wherein the content of the oxide particles within the silicon silicone resin is at least 60%.

16. The light emitting diode module according to claim 15 , wherein the reflector surface is arranged such that an opening surrounded by the reflector surface at a distance of 100 μm with respect to the level of the light emitting area of the light emitting diode structure is smaller than 2 times the light emitting area of the light emitting diode structure.

17. The light emitting diode module according to claim 13 , wherein the reflector surface is arranged such that an opening surrounded by the reflector surface at a distance of 100 μm with respect to the level of the light emitting area of the light emitting diode structure is smaller than 2 times the light emitting area of the light emitting diode structure.

Assignments (5)
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Jul 10, 2025
From: LUMILEDS LLC
To: LUMILEDS SINGAPORE PTE. LTD.
Reel/Frame 071888/0086 →
RELEASE OF SECURITY INTEREST Recorded Jan 29, 2025
From: SOUND POINT AGENCY LLC
To: LUMILEDS LLC; LUMILEDS HOLDING B.V.
Reel/Frame 070046/0001 →
SECURITY INTEREST Recorded Jan 5, 2023
From: LUMILEDS LLC; LUMILEDS HOLDING B.V.
To: SOUND POINT AGENCY LLC
Reel/Frame 062299/0338 →
PATENT SECURITY AGREEMENT Recorded Dec 9, 2022
From: LUMILEDS, LLC
To: DEUTSCHE BANK AG NEW YORK BRANCH
Reel/Frame 062114/0001 →
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Mar 17, 2020
From: BASIN, GRIGORIY; BELYAEV, ANTON; KOSOWSKY, LEX; GOH, YI SHYAN
To: LUMILEDS LLC
Reel/Frame 052143/0092 →