IP Library Granted Patent US 10,944,332
Granted Patent B2
US 10,944,332 · App. 16/470,650 · Granted Mar 9, 2021

Power converter with shield plate and resin support member

Inventors: Yoichiro Furuta (Hitachinaka, JP); Kenichirou Nakajima (Hitachinaka, JP); Yuta Numakura (Hitachinaka, JP)
Assignee: HITACHI AUTOMOTIVE SYSTEMS, LTD.
H02M7/003H02M1/08H02M7/48H02M7/797H05K5/03H05K7/1432
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Quick Facts
Patent No.
US 10,944,332
App. No.
16/470,650
Granted
Mar 9, 2021
Kind
B2
Abstract

Provided is a power converter capable of being miniaturized while securing noise resistance and insulation between a power semiconductor module and a drive circuit board. The power converter according to the present invention includes a power semiconductor module that converts DC power into AC power, a driving signal circuit board that outputs a driving signal for driving the power semiconductor module, and a resin support member that supports the driving signal circuit board, in which the power semiconductor module has a signal terminal that transmits the driving signal and a main terminal that transmits an input of the DC power and an output of the AC power, the support member is disposed between the driving signal circuit board and the power semiconductor module, the signal terminal and the main terminal are provided on a side of the power semiconductor module that faces the support member, and a metal shielding plate is embedded in a region between the driving signal circuit board in the support member and the main terminal.

Claims (20)

1. A power converter comprising:

a power semiconductor module that converts DC power into AC power;

a driving signal circuit board that outputs a driving signal for driving the power semiconductor module; and

a resin support member that supports the driving signal circuit board,

wherein the power semiconductor module comprises a signal terminal that transmits the driving signal and a main terminal that transmits an input of the DC power and an output of the AC power,

the resin support member is disposed between the driving signal circuit board and the power semiconductor module,

the signal terminal and the main terminal are provided on a side of the power semiconductor module that faces the resin support member,

a metal shielding plate is embedded in a region between the driving signal circuit board in the resin support member and the main terminal, and

a bus bar that transmits a DC current is embedded in the support member.

2. The power converter according to claim 1 , further comprising a metal case forming an accommodating space of the power semiconductor module, wherein

the support member comprises a fixing portion that fixes the resin support member to the case and an extended portion in which the shielding plate extends to the fixing portion, and

the shielding plate is grounded to the case via the extended portion.

3. The power converter according to claim 1 ,

wherein the resin support member comprises a locking portion for locking a harness.

4. The power converter according to claim 3 ,

wherein the harness connects a control signal circuit board sharing a control signal for controlling the power semiconductor module and a current sensor for measuring a current flowing through an AC current bus bar that transmits an AC current from the power semiconductor module.

5. The power converter according to claim 1 ,

wherein the bus bar is a fuse blowing detection bus bar arranged to detect fuse blowing.

6. The power converter according to claim 1 ,

wherein the bus bar is a voltage bus bar arranged to transmit current.

Assignments (2)
CHANGE OF NAME Recorded Sep 2, 2021
From: HITACHI AUTOMOTIVE SYSTEMS, LTD.
To: HITACHI ASTEMO, LTD.
Reel/Frame 057655/0824 →
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Jun 18, 2019
From: FURUTA, YOICHIRO; NAKAJIMA, KENICHIROU; NUMAKURA, YUTA
To: HITACHI AUTOMOTIVE SYSTEMS, LTD.
Reel/Frame 049500/0259 →
Priority Claims (1)
JP JP2017-004039 · Jan 13, 2017 · national
Continuity (1)
Related Publication 20190326827A1 · Oct 24, 2019