IP Library Granted Patent US 10,673,349
Granted Patent B2
US 10,673,349 · App. 16/472,062 · Granted Jun 2, 2020

Power conversion device with efficient cooling structure

Inventors: Youhei Nishizawa (Hitachinaka, JP); Ayumu Hatanaka (Hitachinaka, JP); Takeshi Seki (Hitachinaka, JP)
Assignee: Hitachi, Ltd.
H02M7/003H01G17/00H05K7/02H05K7/209
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Quick Facts
Patent No.
US 10,673,349
App. No.
16/472,062
Granted
Jun 2, 2020
Kind
B2
Abstract

To improve reliability of a power conversion device with an efficient cooling structure. A power conversion device according to the present invention includes a power semiconductor module configured to convert power, a first capacitor configured to smooth the power, a conductor section forming a first power path between a power terminal and the first capacitor and a second power path between the first capacitor and the power semiconductor module, a noise filter section including a second capacitor that smooths power having a higher frequency than a frequency of the power smoothed by the first capacitor, and a cooling section forming a cooling surface, and the noise filter section is connected to the conductor section forming the first power path, and the conductor section forming the first power path is arranged in a space between the cooling surface and the noise filter section.

Claims (38)

1. A power conversion device comprising:

a power semiconductor module configured to convert power;

a first capacitor configured to smooth the power;

a conductor section forming a first power path between a power terminal and the first capacitor and a second power path between the first capacitor and the power semiconductor module;

a noise filter section including a second capacitor that smooths power having a higher frequency than a frequency of the power smoothed by the first capacitor; and

a cooling section forming a cooling surface, wherein

the noise filter section is connected to the conductor section forming the first power path, and

the conductor section forming the first power path is arranged in a space between the cooling surface and the noise filter section,

wherein, in a cross section of the power conversion device:

a line section connecting a substantially central portion of the first capacitor and a substantially central portion of the noise filter section is defined as a first line segment,

a connection section between the first power path and the noise filter section is arranged on one side with respect to the first line segment, and

the second power path is arranged on the other side with respect to the first line segment, and

wherein

the first power path is formed such that a face of the first power path where the connection section between the first power path and the noise filter section is provided becomes substantially parallel to the first line segment, and

the second power path is formed such that a face of the second power path where a connection section between the second power path and the first capacitor is provided becomes substantially parallel to the first line segment.

2. The power conversion device according to claim 1 , wherein

a cross-sectional area of the first power path of the conductor section is smaller than a cross-sectional area of the second power path.

3. The power conversion device according to claim 1 , wherein

an end portion of the first power path, the end portion being closest to the second power path, is defined as a first end portion, and

the noise filter section is arranged at a position in a direction away from the second power path and separated from the first end portion.

4. The power conversion device according to claim 1 , further comprising:

a heat dissipating member arranged between the conductor section forming the first power path and the cooling surface and being in contact with the conductor section and the cooling surface.

5. A power conversion device comprising:

a power semiconductor module configured to convert power;

a first capacitor configured to smooth the power;

a conductor section forming a first power path between a power terminal and the first capacitor and a second power path between the first capacitor and the power semiconductor module;

a noise filter section including a second capacitor that smooths power having a higher frequency than a frequency of the power smoothed by the first capacitor; and

a cooling section forming a cooling surface,

wherein

the noise filter section is connected to the conductor section forming the first power path, and

the conductor section forming the first power path is arranged in a space between the cooling surface and the noise filter section,

wherein, in a cross section of the power conversion device:

a line section connecting a substantially central portion of the first capacitor and a substantially central portion of the noise filter section is defined as a first line segment,

a connection section between the first power path and the noise filter section is arranged on one side with respect to the first line segment, and

the second power path is arranged on the other side with respect to the first line segment, and

wherein

an end portion of the first power path, the end portion being closest to the second power path, is defined as a first end portion, and

the noise filter section is arranged at a position in a direction away from the second power path and separated from the first end portion.

Assignments (2)
CHANGE OF NAME Recorded Nov 30, 2021
From: HITACHI AUTOMOTIVE SYSTEMS, LTD.
To: HITACHI ASTEMO, LTD.
Reel/Frame 058481/0935 →
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Jun 21, 2019
From: NISHIZAWA, YOUHEI; HATANAKA, AYUMU; SEKI, TAKESHI
To: HITACHI AUTOMOTIVE SYSTEMS, LTD.
Reel/Frame 049547/0831 →
Cited By (1)
US 12,500,525