Wireless communication technology, apparatuses, and methods

Inventors: Erkan Alpman (Portland, OR); Arnaud Lucres Amadjikpe (Beaverton, OR); Omer Asaf (M, IL); Kameran Azadet (San Ramon, CA); Rotem Banin (Even-Yehuda, IL); Miroslav Baryakh (Petach Tikva, IL); Anat Bazov (M, IL); Stefano Brenna (Hillsboro, OR); Bryan K. Casper (Portland, OR); Anandaroop Chakrabarti (Hillsboro, OR); Gregory Chance (Chandler, AZ); Debabani Choudhury (Thousand Oaks, CA); Emanuel Cohen (Z, IL); Claudio Da Silva (San Jose, CA); Sidharth Dalmia (Fair Oaks, CA); Saeid Daneshgar Asl (Portland, OR); Kaushik Dasgupta (Hillsboro, OR); Kunal Datta (Los Angeles, CA); Brandon Davis (Phoenix, AZ); Ofir Degani (Haifa, IL); Amr M. Fahim (Portland, OR); Amit Freiman (Haifa, IL); Michael Genossar (Modiin, IL); Eran Gerson (Pardes Hana, IL); Eyal Goldberger (Moshav Beherotaim, IL); Eshel Gordon (Aloney Aba, IL); Meir Gordon (Holon, IL); Josef Hagn (Neubiberg, DE); Shinwon Kang (San Francisco, CA); Te Yu Kao (Milpitas, CA); Noam Kogan (Tel-Aviv, IL); Mikko S. Komulainen (Oulu, FI); Igal Yehuda Kushnir (Hod-Hasharon, IL); Saku Lahti (Tampere, FI); Mikko M. Lampinen (Nokia, FI); Naftali Landsberg (Ramat Gan, IL); Wook Bong Lee (San Jose, CA); Run Levinger (Tel Aviv, IL); Albert Molina (Alcobendas, ES); Resti Montoya Moreno (Helsinki, FI); Tawfiq Musah (Hillsboro, OR); Nathan G. Narevsky (Portland, OR); Hosein Nikopour (San Jose, CA); Oner Orhan (San Jose, CA); Georgios Palaskas (Portland, OR); Stefano Pellerano (Beaverton, OR); Ron Pongratz (Tel Aviv, IL); Ashoke Ravi (Portland, OR); Shmuel Ravid (Haifa, IL); Peter Andrew Sagazio (Portland, OR); Eren Sasoglu (Mountain View, CA); Lior Shakedd (Kfar Bilu, IL); Gadi Shor (Tel Aviv, IL); Baljit Singh (San Jose, CA); Menashe Soffer (Katzir, IL); Ra'anan Sover (Haifa, IL); Shilpa Talwar (Cupertino, CA); Nebil Tanzi (Hoffman Estates, IL); Moshe Teplitsky (Tel-Aviv, IL); Chintan S. Thakkar (Portland, OR); Jayprakash Thakur (Bangalore, IN); Avi Tsarfati (Rishon le Zion, IL); Yossi Tsfati (Rishon le Zion, IL); Marian Verhelst (Portland, OR); Nir Weisman (Hod Hasharon, IL); Shuhei Yamada (Hillsboro, OR); Ana M. Yepes (Portland, OR); Duncan Kitchin (Beaverton, OR)

Assignee: Intel Corporation

H01Q9/0414 H01Q1/243 H01Q1/38 H01Q1/48 H01Q3/24 H01Q5/47 H01Q21/24 H03L7/145 H04B1/3827 H04B7/0482 H04B7/0639 H04B15/04

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Quick Facts

Patent No.: US 11,424,539
App. No.: 16/472,830
Granted: Aug 23, 2022
Kind: B2

External Links

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Abstract

Millimeter wave (mmWave) technology, apparatuses, and methods that relate to transceivers, receivers, and antenna structures for wireless communications are described. The various aspects include co-located millimeter wave (mmWave) and near-field communication (NFC) antennas, scalable phased array radio transceiver architecture (SPARTA), phased array distributed communication system with MIMO support and phase noise synchronization over a single coax cable, communicating RF signals over cable (RFoC) in a distributed phased array communication system, clock noise leakage reduction, IF-to-RF companion chip for backwards and forwards compatibility and modularity, on-package matching networks, 5G scalable receiver (Rx) architecture, among others.

Claims (10)

1. An apparatus for a mobile device, the apparatus comprising:

a printed circuit board (PCB) that comprises a first layer and a second layer;

an integrated circuit (IC) chip that comprises a top level and a bottom level, wherein the IC chip comprises a transceiver and the IC chip is connected to the first layer of the PCB;

an antenna array that comprises a plurality of antenna elements configured within the first layer of the PCB and fed by feed transmission lines coupled to the transceiver; and

an IC shield, separated from the antenna array, that covers the IC to shield the antenna array from interference generated by the IC, and is connected to the PCB, wherein the IC shield is configured to act as a reflector and a ground reference for the antenna array.

2. The apparatus of claim 1 , further comprising a clearance volume between the PCB and the antenna array to prevent at least one antenna element from contacting the PCB.

3. The apparatus of claim 1 , wherein the transmission feed lines comprise metal traces.

4. The apparatus of claim 1 , wherein the PCB comprises a mother board.

5. The apparatus of claim 1 , wherein the IC chip further comprises at least one power amplifier (PA).

6. The apparatus of claim 5 , wherein the IC chip further comprises at least one low noise amplifier (LNA).