Patch antennas stitched to systems in packages and methods of assembling same
A patch antenna array is fabricated with a package-on-package setup that contains a transceiver. The patch antenna array has a footprint that intersects the transceiver footprint. The package-on-package setup includes through-mold vias that couple to a redistribution layer disposed between the patch antennas and the package-on-package setup.
1. A patch antenna and transceiver module, comprising:
a transceiver disposed in a molding mass, the transceiver including an active surface and a backside surface, wherein the active surface and the molding mass share a surface level;
a through-mold via that communicates through the molding mass including one end thereof emerging at the active surface level and the other end thereof emerging at a land side of the molding mass;
a redistribution layer (RDL) disposed on the active surface of the transceiver and the through-mold via, wherein the RDL couples one of signal and ground traces to the active surface and through-mold via;
a signal pad disposed in the RDL;
a bond wire contacting the signal pad; and
a patch antenna and ground plane assembly, wherein the bond wire contacts the patch antenna, and wherein the ground plane is coupled to a ground trace, and wherein the patch antenna and the ground plane are an integral structure including at least one fold.
2. The patch antenna and transceiver module of claim 1 , wherein the ground plane is grounded through the RDL by a ball-grid array disposed on the RDL.
3. The patch antenna and transceiver module of claim 1 , wherein the ground plane is grounded through the RDL by a ball-grid array disposed on the RDL, and wherein the ball-grid array includes some copper-core balls that create a standoff height that is higher than the patch antenna.
4. The patch antenna and transceiver module of claim 1 , wherein the patch antenna and the ground plane are an integral structure, and wherein the patch antenna and the ground plane are set apart by a spacer.
5. The patch antenna and transceiver module of claim 1 , wherein the patch antenna and the ground plane are set apart by a spacer.
6. The patch antenna and transceiver module of claim 1 , wherein the patch antenna and the ground plane are set apart by a spacer, wherein the spacer is one of a plurality of spacers.
7. The patch antenna and transceiver module of claim 1 , wherein the RDL has a thickness in a range from 20 micrometer to 60 micrometer.
8. The patch antenna and transceiver module of claim 1 , wherein the RDL has a thickness in a range from 20 micrometer to 60 micrometer, and wherein the patch antenna and the ground plane are spaced apart in a range from 100 micrometer to 300 micrometer.
9. The patch antenna and transceiver module of claim 1 , wherein the transceiver occupies a transceiver footprint in the module, and wherein the patch antenna occupies a patch antenna footprint, and wherein the patch antenna footprint intersects the transceiver footprint.
10. The patch antenna and transceiver module of claim 1 , wherein the transceiver occupies a transceiver footprint in the module, and wherein the patch antenna is one of four patch antennas and each of the four patch antennas occupies a patch antenna footprint, and wherein each patch antenna footprint intersects the transceiver footprint.
11. The patch antenna and transceiver module of claim 1 , wherein the transceiver occupies a transceiver footprint in the module, and wherein the patch antenna is one of four patch antennas and each of the four patch antennas occupies a patch antenna footprint, wherein each patch antenna footprint intersects the transceiver footprint, and wherein each patch antenna and corresponding ground plane are an integral structure.
12. The patch antenna and transceiver module of claim 1 , further including:
a land side ball grid array coupled to the through-mold via; and
a board coupled to the land side ball grid array.
13. A computing system, comprising:
a logic processor,
a patch antenna and transceiver module coupled to the logic processor, the module including:
a transceiver disposed in a molding mass, the transceiver including an active surface and a backside surface, wherein the active surface and the molding mass share a surface level;
a through-mold via that communicates through the molding mass including one end thereof emerging at the active surface level and the other end thereof emerging at a land side of the molding mass;
a redistribution layer (RDL) disposed on the active surface of the transceiver and the through-mold via, wherein the RDL couples signal and ground traces to the active surface and through-mold via;
a signal pad disposed in the RDL;
a bond wire contacting the signal pad; and
a patch antenna and ground plane assembly, wherein the bond wire contacts the patch antenna, and wherein the ground plane is coupled to a ground trace, and wherein the patch antenna and the ground plane are an integral structure including at least one fold.
14. The computing system of claim 13 , wherein the patch antenna and ground plane are an integral folded structure, further including:
a land side ball grid array coupled to the through-mold via;
a board coupled to the land side ball grid array, and wherein the board is a motherboard and a motherboard with an external shell.
15. The computing system of claim 13 , further including:
a land side ball grid array coupled to the through-mold via;
a board coupled to the land side ball grid array, and wherein the board includes a motherboard with an external shell.