IP Library Granted Patent US 11,434,335
Granted Patent B2
US 11,434,335 · App. 16/477,664 · Granted Sep 6, 2022

Polyamide-imide film and method for producing same

Inventors: Dae Seong Oh (Seoul, KR); Dawoo Jeong (Gyeonggi-do, KR); Sunhwan Kim (Incheon, KR); Jin Woo Lee (Gyeonggi-do, KR); Dong Jin Lim (Gyeonggi-do, KR); Kyungeun Oh (Gyeonggi-do, KR)
Assignee: SKC CO., LTD.
C08J5/18B29C39/24B29C39/38B29C39/42B29C39/44C08G73/1039C08G73/14C08L79/08B29C41/003B29K2077/00B29K2105/0094C08J2379/08C08L2201/10C08L2203/16
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Quick Facts
Patent No.
US 11,434,335
App. No.
16/477,664
Granted
Sep 6, 2022
Kind
B2
Abstract

An embodiment can provide a polyamide-imide film and a method for producing same, the film comprising a polyamide-imide polymer formed by polymerizing an aromatic diamine compound, an aromatic dianhydride compound and a dicarbonyl compound, wherein, in an XRD graph with a section in which 2θ=8° to 32° as a baseline, the film shows a peak area of 50% or above around 2θ=23° with respect to a peak area seen around 2θ=15°.

Claims (11)

1. A polyamide-imide film, which comprises a polyamide-imide polymer formed by polymerizing an aromatic diamine compound, an aromatic dianhydride compound, and a dicarbonyl compound, wherein the peak area in the vicinity of 2θ=23° is 65% or more based on the peak area in the vicinity of 2θ=15° when a base line is taken in the region between 2θ=8° and 32° in an XRD graph of the polyamide-imide film.

2. The polyamide-imide film of claim 1 , which has a modulus of 5.0 GPa or more based on a thickness of 50 μm.

3. The polyamide-imide film of claim 1 , which has a surface hardness of HB or higher.

4. The polyamide-imide film of claim 1 , which has a yellow index (YI) of 5 or less based on a thickness of 50 μm.

5. The polyamide-imide film of claim 1 , which has a haze of 2% or less based on a thickness of 50 μm.

6. The polyamide-imide film of claim 1 , which has a light transmittance measured at 550 nm of 85% or more based on a thickness of 50 μm.

7. The polyamide-imide film of claim 1 , wherein the aromatic dianhydride compound is composed of a compound having a fluorine-containing substituent.

8. The polyamide-imide film of claim 1 , wherein the aromatic diamine compound comprises 2,2′-bis(trifluoromethyl)-4,4′-diaminobiphenyl (TFDB), and the aromatic dianhydride compound comprises 2,2′-bis(3,4-dicarboxyphenyl) hexafluoropropane dianhydride (6-FDA).

9. The polyamide-imide film of claim 1 , wherein the molar ratio of the aromatic diamine compound to the aromatic dianhydride compound is 10:2 to 10:4.

10. The polyamide-imide film of claim 1 , wherein the dicarbonyl compound comprises at least two dicarbonyl compounds different from each other.

11. The polyamide-imide film of claim 1 , wherein the dicarbonyl compound comprises terephthaloyl chloride (TPC), 1,1′-biphenyl-4,4′-dicarbonyl dichloride (BPDC), or a combination thereof.

Assignments (5)
CHANGE OF NAME Recorded Jan 15, 2026
From: SK MICROWORKS SOLUTIONS CO., LTD.
To: MICROWORKS SOLUTIONS CO., LTD.
Reel/Frame 074078/0923 →
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Apr 24, 2025
From: SK MICROWORKS CO., LTD.
To: SK MICROWORKS SOLUTIONS CO., LTD.
Reel/Frame 070929/0875 →
CORRECTIVE ASSIGNMENT TO CORRECT THE THE ASSIGNMENT DOCUMENT PREVIOUSLY RECORDED AT REEL: 063240 FRAME: 0192. ASSIGNOR(S) HEREBY CONFIRMS THE ASSIGNMENT. Recorded Dec 8, 2023
From: SKC CO., LTD.
To: SK MICROWORKS CO., LTD.
Reel/Frame 065841/0822 →
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Apr 3, 2023
From: SKC CO., LTD.
To: SK MICROWORKS CO., LTD.
Reel/Frame 063240/0192 →
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Jul 12, 2019
From: OH, DAE SEONG; JEONG, DAWOO; KIM, SUNHWAN; LEE, JIN WOO; LIM, DONG JIN; OH, KYUNGEUN
To: SKC CO., LTD.
Reel/Frame 049736/0758 →