Polyamide-imide film and method for preparing same
An embodiment can provide a polyamide-imide film, which has particular punching properties, is colorless and transparent and has excellent mechanical properties and optical properties, and a method for preparing same. The polyamide-imide film comprises a polyamide-imide polymer, which is formed by means of polymerizing an aromatic diamine compound, an aromatic dianhydride compound and a dicarbonyl compound, and satisfies the condition of general formula (1) below. General formula (1) 4≤X/Y≤12 X: the maximum hole diameter (mm) comprising cracks when the film is punched at 10 mm/min using a 2.5 mm spherical tip by means of a UTM compression mode Y: the modulus (GPa) of the film.
1. A polyamide-imide film, which comprises a polyamide-imide polymer formed by polymerizing an aromatic diamine compound, an aromatic dianhydride compound, and a dicarbonyl compound,
wherein the polyamide-imide film has a compressive strength of 0.4 kgf/μm or more based on a thickness of 50 μm and a modulus of 5.0 GPa or more based on a thickness of 50 μm,
and wherein the polyamide-imide film satisfies the following Relationship 1:
4≤ X/Y≤ 12 [Relationship 1]
wherein X is the maximum diameter (mm) of perforation including a crack when the film is perforated at a rate of 10 mm/min using a 2.5 mm spherical tip in a UTM compression mode; and
Y is the modulus (GPa) of the film.
2. The polyamide-imide film of claim 1 , wherein the maximum diameter of perforation (X) of the polyamide-imide film is 60 mm or less based on a thickness of 50 μm.
3. The polyamide-imide film of claim 1 , which has a surface hardness of HB or higher.
4. The polyamide-imide film of claim 1 , which has a yellow index (YI) of 5 or less based on a thickness of 50 μm.
5. The polyamide-imide film of claim 1 , which has a haze of 2% or less based on a thickness of 50 μm.
6. The polyamide-imide film of claim 1 , which has a light transmittance measured at 550 nm of 85% or more based on a thickness of 50 μm.
7. The polyamide-imide film of claim 1 , wherein the aromatic dianhydride compound is composed of a compound having a fluorine-containing substituent.
8. The polyamide-imide film of claim 1 , wherein the aromatic diamine compound comprises 2,2′-bis(trifluoromethyl)-4,4′-diaminobiphenyl (TFDB), and the aromatic dianhydride compound comprises 2,2′-bis(3,4-dicarboxyphenyl) hexafluoropropane dianhydride (6-FDA).
9. The polyamide-imide film of claim 1 , wherein the molar ratio of the aromatic diamine compound to the aromatic dianhydride compound is 10:2 to 10:4.
10. The polyamide-imide film of claim 1 , wherein the dicarbonyl compound comprises at least two dicarbonyl compounds different from each other.
11. The polyamide-imide film of claim 1 , wherein the dicarbonyl compound comprises terephthaloyl chloride (TPC), 1,1′-biphenyl-4,4′-dicarbonyl dichloride (BPDC), or a combination thereof.