IP Library Granted Patent US 11,543,621
Granted Patent B2
US 11,543,621 · App. 16/478,090 · Granted Jan 3, 2023

AF module, camera module, and electronic apparatus

Inventors: Munekatsu Fukuyama (Tokyo, JP); Hiroyasu Matsugai (Kanagawa, JP); Hiroyuki Itou (Kanagawa, JP); Suguru Saito (Kanagawa, JP); Keiji Ohshima (Tokyo, JP); Masanori Iwasaki (Kanagawa, JP); Toshihiko Hayashi (Kanagawa, JP); Shuzo Sato (Kanagawa, JP); Nobutoshi Fujii (Kanagawa, JP); Hiroshi Tazawa (Kanagawa, JP); Toshiaki Shiraiwa (Kanagawa, JP); Yusuke Moriya (Nagasaki, JP); Minoru Ishida (Tokyo, JP)
Assignee: SONY SEMICONDUCTOR SOLUTIONS CORPORATION
G02B7/09G02B3/0068G02B7/023G02B13/0085G03B3/10H01L27/146H04N5/2254H04N5/2257G03B2205/0069
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Quick Facts
Patent No.
US 11,543,621
App. No.
16/478,090
Granted
Jan 3, 2023
Kind
B2
Abstract

There is provided a camera module including a stacked lens structure including a plurality of lens substrates. The plurality of lens substrates includes a first lens substrate including a first lens that is disposed at an inner side of a through-hole formed in the first lens substrate, and a second lens substrate including a second lens that is disposed at an inner side of a through-hole formed in the second lens substrate, wherein the first lens substrate is directly bonded to the second lens substrate. The camera module further includes an electromagnetic drive unit configured to adjust a distance between the stacked lens structure and a light-receiving element.

Claims (41)

1. A camera module, comprising:

a stacked lens structure including a plurality of lens substrates, the plurality of lens substrates including:

a first lens substrate including a first lens that is disposed at an inner side of a through-hole formed in the first lens substrate, and

a second lens substrate including a second lens that is disposed at an inner side of a through-hole formed in the second lens substrate, wherein the first lens substrate is directly bonded to the second lens substrate;

an electromagnetic drive unit configured to adjust a distance between the stacked lens structure and a light-receiving element; and

one of a diaphragm plate and a cover glass provided at an upper surface of an uppermost lens substrate of the plurality of lens substrates of the stacked lens structure, wherein the electromagnetic drive unit includes an autofocus (AF) coil and an AF magnet,

wherein the stacked lens structure includes the AF coil, and

wherein the electromagnetic drive unit is configured to adjust the distance between the stacked lens structure and the light-receiving element by moving the stacked lens structure in an optical axis direction, and

wherein the AF coil is configured to be brought into contact with the one of the diaphragm plate and the cover glass.

2. The camera module according to claim 1 , wherein the AF coil is bonded to the stacked lens structure.

3. The camera module according to claim 1 , wherein

the AF coil is wound around an outer periphery of the stacked lens structure, and

each of the plurality of lens substrates forming the stacked lens structure have a substantially octagonal shape in a plan view.

4. The camera module according to claim 1 , wherein

the AF coil is wound around an outer periphery of the stacked lens structure, and

each of the plurality of lens substrates forming the stacked lens structure have a rounded substantially-quadrangular shape in a plan view.

5. A camera module, comprising:

a stacked lens structure including a plurality of lens substrates, the plurality of lens substrates including:

a first lens substrate including a first lens that is disposed at an inner side of a through-hole formed in the first lens substrate, and

a second lens substrate including a second lens that is disposed at an inner side of a through-hole formed in the second lens substrate, wherein the first lens substrate is directly bonded to the second lens substrate; and

an electromagnetic drive unit configured to adjust a distance between the stacked lens structure and a light-receiving element,

wherein the electromagnetic drive unit includes an autofocus (AF) coil and an AF magnet,

wherein the stacked lens structure includes the AF coil,

wherein the electromagnetic drive unit is configured to adjust the distance between the stacked lens structure and the light-receiving element by moving the stacked lens structure in an optical axis direction,

wherein an uppermost lens substrate of the plurality of lens substrates of the stacked lens structure is larger in a plan view than other lens substrates of the plurality of lens substrates, and

wherein the AF coil is configured to be brought into contact with the uppermost lens substrate.

6. A camera module, comprising:

a stacked lens structure including a plurality of lens substrates, the plurality of lens substrates including:

a first lens substrate including a first lens that is disposed at an inner side of a through-hole formed in the first lens substrate, and

a second lens substrate including a second lens that is disposed at an inner side of a through-hole formed in the second lens substrate, wherein the first lens substrate is directly bonded to the second lens substrate; and

an electromagnetic drive unit configured to adjust a distance between the stacked lens structure and a light-receiving element,

wherein the electromagnetic drive unit includes an autofocus (AF) coil and an AF magnet,

wherein the stacked lens structure includes the AF magnet,

wherein the electromagnetic drive unit is configured to adjust the distance between the stacked lens structure and the light-receiving element by moving the stacked lens structure in an optical axis direction,

wherein the AF magnet is bonded to the stacked lens structure, and

wherein a portion of the AF magnet is disposed in the plurality of lens substrates forming the stacked lens structure.

7. The camera module according to claim 1 , further comprising a second electromechanical drive unit configured to move the stacked lens structure in a direction orthogonal to an optical axis direction.

8. The camera module according to claim 1 , wherein an uppermost lens substrate of the plurality of lens substrates of the stacked lens structure is larger in a plan view than other lens substrates of the plurality of lens substrates, and

wherein the AF coil is configured to be brought into contact with the uppermost lens substrate.

9. The camera module according to claim 5 , further comprising a second electromechanical drive unit configured to move the stacked lens structure in a direction orthogonal to an optical axis direction.

10. The camera module according to claim 6 , further comprising a second electromechanical drive unit configured to move the stacked lens structure in a direction orthogonal to an optical axis direction.

Assignments (1)
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Sep 19, 2019
From: FUKUYAMA, MUNEKATSU; MATSUGAI, HIROYASU; ITOU, HIROYUKI; SAITO, SUGURU; OHSHIMA, KEIJI; IWASAKI, MASANORI; HAYASHI, TOSHIHIKO; SATO, SHUZO; FUJII, NOBUTOSHI; TAZAWA, HIROSHI; SHIRAIWA, TOSHIAKI; MORIYA, YUSUKE; ISHIDA, MINORU
To: SONY SEMICONDUCTOR SOLUTIONS CORPORATION
Reel/Frame 050435/0397 →
Priority Claims (1)
JP JP2017-011993 · Jan 26, 2017 · national
Continuity (1)
Related Publication 20190369355A1 · Dec 5, 2019
Cited By (1)
US 12,466,525