Adhesive film having adhesive resin layers and method of manufacturing electronic apparatus using the adhesive film
An adhesive film used when sealing an electronic component to temporarily fix the electronic component, the adhesive film including a base material layer, an adhesive resin layer which is provided on a first surface side of the base material layer and which is for temporarily fixing the electronic component, and an adhesive resin layer which is provided on a second surface side of the base material layer and of which the adhesive strength decreases according to an external stimulus, in which the adhesive resin layer includes a polyvalent carboxylic acid ester-based plasticizer and an adhesive resin, and a content of the polyvalent carboxylic acid ester-based plasticizer in the adhesive resin layer is more than or equal to 0.7 parts by mass and less than or equal to 50 parts by mass with respect to 100 parts by mass of the adhesive resin included in the adhesive resin layer.
1. A method of manufacturing an electronic apparatus, the method comprising at least:
a step (1) of preparing a structural body provided with an adhesive film, an electronic component attached to an adhesive resin layer (A) of the adhesive film, and a support substrate attached to an adhesive resin layer (B) of the adhesive film;
a step (2) of sealing the electronic component using a sealing material;
a step (3) of peeling the support substrate from the structural body by decreasing adhesive strength of the adhesive resin layer (B) by applying an external stimulus; and
a step (4) of peeling the adhesive film from the electronic component,
wherein the adhesive film comprises:
a base material layer;
the adhesive resin layer (A) which is provided on a first surface side of the base material layer and which is for temporarily fixing the electronic component; and
the adhesive resin layer (B) which is provided on a second surface side of the base material layer and of which adhesive strength decreases according to an external stimulus,
wherein the adhesive resin layer (A) includes a polyvalent carboxylic acid ester-based plasticizer (X) and an adhesive resin (Y), and
a content of the polyvalent carboxylic acid ester-based plasticizer (X) in the adhesive resin layer (A) is more than or equal to 0.7 parts by mass and less than or equal to 50 parts by mass with respect to 100 parts by mass of the adhesive resin (Y) included in the adhesive resin layer (A).
2. The method of manufacturing an electronic apparatus according to claim 1 ,
wherein the sealing material is an epoxy resin-based sealing material.
3. The method of manufacturing an electronic apparatus according to claim 1 ,
wherein the sealing material includes an amine-based curing agent.
4. The method of manufacturing an electronic apparatus according to claim 1 ,
wherein the sealing material is granular, sheet-like, or liquid.
5. The method of manufacturing an electronic apparatus according to claim 1 ,
wherein, in step (2), the sealing of the electronic component is performed by compression molding.