Receiving device and method for production
View Patent ↗A receiving device for a system for inductive power transfer has a housing with a cover part and a base part as housing parts. The housing includes an inside volume for accommodating at least one winding structure. At least one of the housing parts has at least one heat sink on an outer side. A method for producing the receiving device is also disclosed.
1. A receiving device for a system for inductive power transfer, the receiving device comprising:
a housing comprising a cover part and a base part as housing parts, the housing including an inside volume for accommodating at least one winding structure,
wherein at least one of the housing parts comprises at least one heat sink on an outer side,
wherein the receiving device comprises at least one heat transfer element, thermal energy being transferrable by the at least one heat transfer element from a first predetermined spatial region in the inside volume to an interior section of a housing wall,
wherein the first predetermined spatial region is a lateral edge region of the housing,
wherein the interior section of the housing wall is disposed in a central region of the housing defined between two lateral edge regions of the housing,
wherein the receiving device comprises at least one magnetically conductive element, the magnetically conductive element being disposed in the inside volume and in the central region of the housing, the magnetically conductive element being seated against the interior section of the housing wall or being thermally connected to the interior section, and
wherein the receiving device comprises at least one printed circuit board and at least one electrical or electronic element being disposed on the at least one printed circuit board, the printed circuit board or the at least one electrical or electronic element being disposed in the first predetermined spatial region.
2. The receiving device according to claim 1 , wherein the at least one heat sink comprises at least one cooling fin or a cooling pin.
3. The receiving device according to claim 1 , wherein at least one thermally conductive element is disposed between the magnetically conductive element and the interior section.
4. The receiving device according to claim 3 , wherein the at least one thermally conductive element is made of silicone.
5. The receiving device according to claim 3 , wherein the at least one thermally conductive element is an adhesive element.
6. The receiving device according to claim 1 , wherein the at least one heat transfer element is a heat pipe.
7. The receiving device according to claim 6 , wherein the heat pipe is disposed in the inside volume such that a gradient of an ambient temperature of the heat pipe along a path from the first predetermined spatial region to the interior section is negative.
8. The receiving device according to claim 1 , wherein at least one of the printed circuit board and the electrical or electronic element are thermally connected to the at least one heat transfer element.
9. The receiving device according to claim 8 , wherein at least one of the printed circuit board and the electrical or electronic element are thermally connected to the heat transfer element via at least one further thermally conductive element, the further thermally conductive element not being electrically conductive.
10. A method for producing a receiving device for a system for inductive power transfer, the method comprising:
providing a base part and a cover part as housing parts of a housing of the receiving device,
wherein at least one of the housing parts comprises or forms at least one heat sink on an outer side,
wherein the receiving device comprises at least one heat transfer element, thermal energy being transferrable by the at least one heat transfer element from a first predetermined spatial region in an inside volume of the housing to an interior section of a housing wall,
wherein the first predetermined spatial region is a lateral edge region of the housing, and
wherein the interior section of the housing wall is disposed in a central region of the housing defined between two lateral edge regions of the housing,
wherein the receiving device comprises at least one magnetically conductive element, the magnetically conductive element being disposed in the inside volume and in the central region of the housing, the magnetically conductive element being seated against the interior section of the housing wall or being thermally connected to the interior section, and
wherein the receiving device comprises at least one printed circuit board and at least one electrical or electronic element being disposed on the at least one printed circuit board, the printed circuit board or the at least one electrical or electronic element being disposed in the first predetermined spatial region.