Printed lead
A method ( 100 ) of manufacturing a lead for an implantable medical device. The method includes: depositing ( 110 ) a base layer ( 3 ) of biocompatible, electrically non-conductive material; depositing ( 120 ) one or more complementary layers ( 5 ) of biocompatible, electrically non-conductive material to the base layer ( 3 ), wherein the base layer ( 3 ) and complementary layer ( 5 ) form at least one slot ( 7 ); and depositing ( 130 ) biocompatible, electrically conductive material ( 9 ) into the slot ( 7 ). There is also disclosed a lead for an implantable medical device and an apparatus ( 41 ) to manufacture the lead.
1. A method of additive manufacturing a lead for an implantable medical device comprising:
depositing a base layer of biocompatible, electrically non-conductive material;
depositing, using fused deposition modelling, one or more complementary layers of biocompatible, electrically non-conductive material to the base layer, wherein the base layer and complementary layer form at least one slot, wherein depositing one or more complementary layers comprises depositing a pattern, wherein the pattern includes the slot for a biocompatible, electrically conductive material to be received in a corresponding pattern;
depositing the biocompatible, electrically conductive material into the slot; and
stretching the base layer and complementary layer to cause the at least one slot to shrink such that the biocompatible, electrically non-conductive material forms around the biocompatible, electrically conductive material;
wherein the biocompatible, electrically conductive material in the corresponding pattern forms one or more of a connector, therapeutic contact area, and/or antenna for an electrode assembly.
2. A method of manufacturing a lead according to claim 1 further comprising:
depositing one or more additional layers of biocompatible, electrically non-conductive material to the one or more complementary layers, wherein the additional layers narrow or close the at least one slot.
3. A method of manufacturing a lead according to claim 1 further comprising:
depositing one or more further layers of biocompatible, electrically non-conductive material to the complementary layers, wherein the further layers form at least one further slot; and
depositing further biocompatible, electrically conductive material into the further slot.
4. A method of manufacturing a lead according to claim 1 , wherein depositing layers of biocompatible, electrically non-conductive material comprises:
applying a layer of light curable adhesive; and
projecting light to cure the layer of light curable adhesive.
5. A method of manufacturing a lead according to claim 1 wherein depositing the biocompatible, electrically conductive material comprises:
positioning a capillary at the slot; and
tracing the capillary along at least part of the slot whilst feeding a filament of biocompatible, electrically conductive material through the capillary and into the slot.
6. A method of manufacturing a lead according to claim 5 further comprising:
tracing a head along the slot, wherein the head presses the filament into the slot.
7. A method of manufacturing a lead according to claim 5 , wherein the method comprises:
depositing material to form a mount; and
fixing at least part of the filament of biocompatible, electrically conductive material to the mount.
8. A method of manufacturing a lead according to claim 1 , wherein the method comprises:
heating the base layer and complementary layer to cause thermal reflow of the biocompatible, electrically non-conductive material of the base layer and complementary layer.
9. A method of manufacturing a lead according to claim 8 , wherein heating the base layer and complementary layer is subsequent to stretching the base layer and complementary layer to cause the at least one slot to shrink.
10. A method of manufacturing a lead according to claim 9 , wherein the method comprises cooling the one or more of the base layer and complementary layer subsequent to heating the base layer and complementary layer to solidify the one or more of the base layer and complementary layer.