Glass LED assembly
The present disclosure includes an LED lamp assembly comprising a glass envelope, an LED platform supported by a stem arrangement disposed within the envelope, a base hermetically sealed to the envelope, a gas disposed within the envelope providing thermal conductivity between the LED platform and the envelope, and a getter disposed within the envelope for absorbing volatile organic compounds. The lamp may maintain a ratio of helium to oxygen that achieves both an acceptable thermal conductivity and an acceptable lumen output over the life of the LED lamp.
1. An LED lamp assembly, comprising:
a glass envelope;
an LED platform supported by a stem arrangement disposed within the envelope;
a base hermetically sealed to the envelope;
a gas disposed within the envelope providing thermal conductivity between the LED platform and the envelope; and
a getter disposed within the envelope for absorbing volatile organic compounds and comprising an oxygen-generating material for generating oxygen.
2. The LED lamp assembly of claim 1 , wherein the LED platform comprises a metal core printed circuit board formed into a shape with multiple sides with LED light sources mounted on exterior surfaces of the multiple sides.
3. The LED lamp assembly of claim 2 , wherein the getter is mounted on at least one of the exterior surfaces of the multiple sides using one or more surface mounting pads.
4. The LED lamp assembly of claim 2 , wherein the getter is mounted on at least one of the exterior surfaces of the multiple sides by one or more flanges inserted into corresponding slots of the exterior surfaces.
5. The LED lamp assembly of claim 2 , wherein the getter is implemented as a deposit of the oxygen generating material in a recess on at least one of the exterior surfaces.
6. The LED lamp assembly of claim 1 , wherein the getter is mounted on the stem arrangement disposed within the envelope.
7. The LED lamp assembly of claim 1 , wherein the LED platform comprises an LED filament arrangement and the getter is mounted on the stem arrangement and disposed within the LED filament arrangement.
8. The LED lamp assembly of claim 1 , wherein the getter is applied as a coating on the stem arrangement.
9. The LED lamp assembly of claim 1 , wherein:
the gas disposed within the envelope comprises a selected ratio of helium to oxygen that achieves the thermal conductivity and provides a predetermined lumen output over a predetermined time period; and
the getter generates oxygen to maintain the selected ratio.
10. The LED lamp assembly of claim 9 , wherein: the getter is temperature activated; and selected dimensions of the LED platform provide a heat dissipation that maintains a temperature of the getter within a range that provides the selected ratio of helium to oxygen.
11. The LED lamp assembly of claim 9 , wherein selected dimensions of the LED platform provide a convective heat transfer within the envelope to maintain a consistent temperature throughout the interior of the envelope.
12. The LED lamp assembly of claim 9 , wherein the gas disposed within the envelope comprises a ratio of between 70% helium to 30% oxygen.
13. The LED lamp assembly of claim 9 , wherein the gas disposed within the envelope comprises a ratio of 99.75% helium to 0.25% oxygen.
14. The LED lamp assembly of claim 9 , wherein the gas disposed within the envelope comprises a range of ratios of between 70% helium to 30% oxygen and 95% helium to 5% oxygen.
15. An LED lamp assembly, comprising:
a glass envelope;
an LED platform supported by a stem arrangement disposed within the envelope;
a base hermetically sealed to the envelope;
a gas mixture disposed within the envelope having a helium-oxygen ratio for providing thermal conductivity between the LED platform and the envelope and for absorbing volatile organic compounds outgassed by components of the LED platform; and
a getter comprising an oxygen generating material disposed within the envelope for maintaining the helium-oxygen ratio.
16. The LED lamp assembly of claim 15 , wherein the getter is mounted to a metal core printed circuit board of the LED platform, the metal core printed circuit board comprising a shape with multiple sides and LED light sources mounted on exterior surfaces of the multiple sides.
17. The LED lamp assembly of claim 15 , wherein the getter is mounted on the stem arrangement disposed within the envelope and is at least partially enclosed by the LED platform.
18. The LED lamp assembly of claim 15 , wherein the getter is applied as a coating on the stem arrangement and is at least partially surrounded by the LED platform.