IP Library Granted Patent US 11,122,717
Granted Patent B2
US 11,122,717 · App. 16/493,163 · Granted Sep 14, 2021

Electronic control device

Inventors: Yoko Ohkubo (Ibaraki, JP); Hideyuki Sakamoto (Ibaraki, JP); Yusaku Katsube (Tokyo, JP)
Assignee: HITACHI AUTOMOTIVE SYSTEMS, LTD.
H05K9/0049H05K1/0216H05K1/181H05K5/0017H05K5/0026H05K5/0247H05K5/04B60R16/0239H05K2201/10371
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Quick Facts
Patent No.
US 11,122,717
App. No.
16/493,163
Granted
Sep 14, 2021
Kind
B2
Abstract

To obtain, in an on-board control device, a shield effect against noise radiated from an electronic component. The present invention includes: an electronic component 103 ; a metal housing 101 which covers at least a part of the electronic component 103 ; a metal portion 105 which is provided so that the electronic component 103 is disposed between the metal portion 105 and the metal housing 101 ; and a shield structure which shields radiation noise from the electronic component 103 by electrostatic capacitive coupling formed between the metal portion 105 and the metal housing 101.

Claims (32)

1. An electronic control device comprising:

an electronic component;

a metal housing which covers at least a part of the electronic component;

a metal portion which is provided so that the electronic component is disposed between the metal portion and the metal housing;

a shield structure which shields radiation noise from the electronic component by electrostatic capacitive coupling formed between the metal portion and the metal housing, wherein the metal portion is provided inside a substrate having the electronic component mounted thereon; and

a contact portion between the substrate and the metal housing, the contact portion being sandwiched therebetween and contacting both the substrate and the metal housing, the contact portion being covered by resist and preventing electrical connection between the substrate and the metal housing, wherein the contact portion extends only in an outer periphery of the substrate, and extends along an entirety of the outer periphery of the substrate.

2. The electronic control device according to claim 1 ,

wherein the metal portion and the metal housing face one another via an insulator of the substrate having the electronic component mounted thereon.

3. The electronic control device according to claim 1 ,

wherein the metal portion is disposed at the outer periphery of the substrate having the electronic component mounted thereon, and the metal portion faces the metal housing throughout the outer periphery of the substrate.

4. The electronic control device according to claim 1 ,

wherein the metal portion and the metal housing are coupled by electrostatic capacitance dependent upon a width and an outer peripheral length over which the metal portion and the metal housing face one another to form a shield space covering the radiation noise.

5. The electronic control device according to claim 4 ,

wherein the metal portion and the metal housing are such that the shield space is closed.

6. The electronic control device according to claim 1 ,

wherein the metal portion is a copper foil pattern provided inside the substrate, and is connected to a ground or a power source, or is a ground or a power source.

7. The electronic control device according to claim 6 ,

wherein the copper foil pattern is formed in an inner layer of the substrate.

8. The electronic control device according to claim 6 ,

wherein the copper foil pattern is disposed at the outer periphery of the substrate.

9. The electronic control device according to claim 1 ,

wherein a source of the radiation noise is mounted on a surface opposite from a resin connector mounted on the substrate.

10. The electronic control device according to claim 1 ,

wherein a source of the radiation noise is one of a control processor, a memory, a termination resistor of a clock line, a communication circuit, or a power supply circuit.

11. An electronic control device comprising:

a substrate on which a plurality of electronic components are mounted;

a metal housing having a housing space for housing the plurality of electronic components,

wherein a mounting portion on which an outer peripheral edge portion of the substrate is mounted is formed on an entire circumference of the metal housing so as to surround an outer periphery of the housing space, and

the substrate has a metal portion that covers the housing space and is capacitively coupled to the mounting portion of the metal housing; and

a contact portion between the substrate and the metal housing, the contact portion being sandwiched therebetween and contacting both the substrate and the metal housing, the contact portion being covered by resist and preventing electrical connection between the substrate and the metal housing, wherein the contact portion extends only in an outer periphery of the substrate, and extends along an entirety of the outer periphery of the substrate.

12. The electronic control device according to claim 11 , further comprising:

a connector configured to communicate signals with an outside of the metal housing, the connector mounted on a surface of the substrate opposite to the housing space.

Assignments (2)
CHANGE OF NAME Recorded Sep 2, 2021
From: HITACHI AUTOMOTIVE SYSTEMS, LTD.
To: HITACHI ASTEMO, LTD.
Reel/Frame 057655/0824 →
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Sep 11, 2019
From: OHKUBO, YOKO; SAKAMOTO, HIDEYUKI; KATSUBE, YUSAKU
To: HITACHI AUTOMOTIVE SYSTEMS, LTD.
Reel/Frame 050343/0810 →
Priority Claims (1)
JP JP2017-066635 · Mar 30, 2017 · national
Continuity (1)
Related Publication 20200060050A1 · Feb 20, 2020