Information handling system low form factor interface thermal management
Information handling system thermal rejection of thermal energy generated by one or more components, such as a central processing unit and graphics processing unit, is enhanced by disposing boron arsenide between the one or more components and a heat transfer structure that directs thermal energy from the one or more components to a heat rejection region, such as cooling fan exhaust. For instance, the boron arsenide is a layer formed with chemical vapor deposition on a copper heat pipe or a layer of thermal grease infused with the boron arsenide.
1. An information handling system comprising:
a component coupled to a motherboard and interfaced with a power source to cooperate in processing information, the component generating thermal energy in response to application of power from the power source;
a heat pipe proximate the component and extending to a thermal rejection region, the heat pipe configured to transfer the thermal energy from the component to the thermal rejection region; and
a thermal interface material disposed between the component and the heat pipe, the thermal interface material including at least boron arsenide;
wherein the component comprises a central processing unit having a die disposed in a package and the boron arsenide is disposed between the die and the package.
2. The information handling system of claim 1 wherein the boron arsenide comprises a layer deposited on the heat pipe and aligned with the component.
3. The information handling system of claim 2 wherein the boron arsenide comprises a filler material attached to the component.
4. The information handling system of claim 3 wherein the filler material comprises silver.
5. The information handling system of claim 3 wherein the filler material comprises zinc.
6. The information handling system of claim 2 wherein the heat pipe comprises copper and the boron arsenide is deposited on the copper with chemical vapor deposition.
7. The information handling system of claim 1 wherein the boron arsenide is further disposed on a side of the package external to the die.
8. The information handling system of claim 1 wherein the component comprises a graphics processing unit.
9. A method for transferring thermal energy from an information handling system component, the method comprising:
coupling the component to a motherboard;
coupling a heat transfer structure to the component; and
disposing boron arsenide between the component and the heat transfer structure;
wherein:
the component comprises a processor having a die contained in a package;
the heat transfer structure comprises the package; and
the disposing boron arsenide further comprises disposing the boron arsenide between the package and the die.
10. The method of claim 9 wherein:
the heat transfer structure comprises a copper heat pipe; and
the disposing boron arsenide further comprises chemical vapor deposition of the boron arsenide on the copper heat sink.
11. The method of claim 9 wherein:
the component comprises a graphics processing unit; and
the disposing boron arsenide further comprises including the boron arsenide in a filler material disposed between the graphics processing unit and the heat transfer structure.
12. The method of claim 11 wherein:
the heat transfer structure comprises a heat sink; and
the filler material comprises zinc thermal grease.
13. The method of claim 9 further comprising:
the component comprises a central processing unit; and
the disposing boron arsenide further comprises including the boron arsenide in thermal grease applied between the central processing unit and the heat transfer structure.
14. The method of claim 13 wherein the thermal grease comprises aluminum.
15. The method of claim 13 wherein the heat transfer structure comprises a heat sink.
16. An information handling system thermal management device comprising:
a heat pipe having a first end configured to couple to a processor and a second end extending to a thermal energy rejection region; and
a boron arsenide layer coupled to the heat pipe at the first end and aligned to dispose between the heat pipe and processor; and
a processor coupled to the heat pipe at the boron arsenide layer, the processor having a package, the package having a heat spreader and a die, a layer of boron arsenide disposed between the heat spreader and the die.
17. The information handling system thermal management device of claim 16 wherein the boron arsenide layer comprises a layer deposited on the heat pipe with chemical vapor deposition.
18. The information handling system thermal management device of claim 16 wherein the boron arsenide layer comprises a thermal grease infused with boron arsenide.