Display device

1. An electronic device comprising:

a flexible substrate;

a first insulating film provided on the flexible substrate;

a semiconductor layer provided on the first insulating film;

a second insulating film provided on the semiconductor layer;

a gate electrode provided on the second insulating film;

a third insulating film provided on the gate electrode;

a signal wiring provided on the third insulating film and electrically connected with the semiconductor layer;

a first organic film provided on the signal wiring;

a connection wiring provided on the first organic film and electrically connected with the signal wiring through a first contact hole in the first organic film;

a second organic film provided on the connection wiring and the first organic film; and

a pad electrode provided on the second organic film and electrically connected with the connection wiring through a second contact hole in the second organic film,

wherein

the connection wiring is in contact with the first organic film and the second organic film,

the semiconductor layer and the signal wiring are located in a first region, in a plan view,

the connection wiring and the pad electrode are located in a second region which is adjacent to the first region, in a plan view,

the second region includes a first portion adjacent to the first region, a second portion adjacent to the first portion, and a third portion adjacent to the second portion,

the second portion is located between the first portion and the third portion, in a plan view,

the first contact hole is located in the first portion,

the second contact hole is located in the third portion,

the first insulating film, the second insulating film, and the third insulating film are not provided in the second portion,

the first organic film is in contact with a surface of the flexible substrate in the second portion, and

a thickness of the first organic film located in the second portion is larger than a thickness of the first organic film located in the first portion.

2. The electronic device of claim 1 , wherein

the flexible substrate is bent at the second portion in which the connection wiring is located between the first organic film and the second organic film.

3. The electronic device of claim 1 , wherein

the connection wiring is formed continuously as one unitary wiring from the first contact hole to the pad electrode.

4. The electronic device of claim 1 , wherein

the connection wiring is out of contact with the first insulating film.

5. The electronic device of claim 1 , wherein

at least one of the first contact hole and the second contact hole is arranged at a plurality of positions in a zigzag state in planar view.

6. The electronic device of claim 1 , wherein

the flexible substrate is formed of polyimide.

7. The electronic device of claim 1 , wherein

the first insulating film is formed continuously from the first region to the first portion.

8. The electronic device of claim 1 , wherein

the signal wiring is formed continuously from the first region to the first portion.

9. An electronic device comprising:

a flexible substrate;

a first insulating film provided on the flexible substrate;

a switching element provided on the first insulating film;

a second insulating film provided on a semiconductor layer of the switching element;

a third insulating film provided on a gate electrode of the switching element;

a wiring electrically connected with the switching element;

a first organic film provided on the third insulating film;

a second organic film provided on the first organic film; and

a pad electrode electrically connected with the wiring,

wherein

the flexible substrate includes a portion that is bent,

in the portion, the wiring is located between the first organic film and the second organic film and is in contact with the first organic film and the second organic film,

the first insulating film, the second insulating film, and the third insulating film are not provided in the portion,

the first organic film is in contact with a surface of the flexible substrate in the portion, and

a thickness of the first organic film located in the portion is larger than a thickness of the first organic film located in a portion other than the portion.

10. The electronic device of claim 9 , wherein

the wiring is out of contact with the first insulating film.

11. The electronic device of claim 9 , wherein

the flexible substrate is formed of polyimide.

12. The electronic device of claim 9 , wherein

the wiring includes a signal wiring and a connection wiring,

the signal wiring is provided on the third insulating film, and

the connection wiring is provided on the first organic film.

13. The electronic device of claim 12 , wherein

the signal wiring and the connection wiring are connected with each other through a first contact portion in the first organic film.

14. The electronic device of claim 13 , wherein

the first contact portion is not provided in the portion.

15. The electronic device of claim 9 , wherein

the wiring includes a signal wiring and a connection wiring,

the signal wiring is provided on the third insulating film,

the connection wiring is provided on the first organic film, and

the pad electrode is provided on the second organic film.

16. The electronic device of claim 15 , wherein

the signal wiring and the connection wiring are connected with each other through a first contact portion in the first organic film, and

the connection wiring and the pad electrode are connected with each other through a second contact portion in the second organic film.

17. The electronic device of claim 16 , wherein

the first contact portion and the second contact portion are not provided in the portion.

18. The electronic device of claim 16 , wherein

the portion is between the first contact portion and the second contact portion.