Group III nitride semiconductor light emitting diode, and method for producing same
The object of the present invention is to provide a Group III nitride semiconductor light emitting diode having improved light extraction efficiency. A Group III nitride semiconductor light emitting diode according to the present disclosure includes an RAMO 4 layer including a single crystal represented by the general formula RAMO 4 (wherein R represents one or more trivalent elements selected from the group consisting of Sc, In, Y and lanthanoid elements, A represents one or more trivalent elements selected from the group consisting of Fe (III), Ga and Al, and M represents one or more divalent elements selected from the group consisting of Mg, Mn, Fe (II), Co, Cu, Zn and Cd); and a layered product stacked on the RAMO 4 layer. The layered product includes at least a light emitting layer including a Group III nitride semiconductor. A degree of flatness of a surface, of the RAMO 4 layer, opposite to the layered product is lower than a degree of flatness of a surface, of the RAMO 4 layer, adjacent to the layered product.
1. A flip-chip Group III nitride semiconductor light emitting diode, comprising:
an RAMO 4 layer including a single crystal represented by the general formula RAMO 4 , wherein R represents one or more trivalent elements selected from the group consisting of Sc, In, Y and lanthanoid elements, A represents one or more trivalent elements selected from the group consisting of Fe (III), Ga and Al, and M represents one or more divalent elements selected from the group consisting of Mg, Mn, Fe (II), Co, Cu, Zn and Cd;
a layered product stacked on the RAMO 4 layer;
an n-type electrode, and
a p-type electrode, wherein
the layered product includes at least a light emitting layer including a Group III nitride semiconductor,
the layered product further comprises an n-type Group III nitride semiconductor layer disposed on one side of the light emitting layer, and a p-type Group III nitride semiconductor layer disposed on another side of the light emitting layer,
the RAMO 4 layer is disposed adjacent to the n-type Group III nitride semiconductor layer,
a degree of flatness of a surface, of the RAMO 4 layer, opposite to the layered product is lower than a degree of flatness of a surface, of the RAMO 4 layer, adjacent to the layered product,
the RAMO 4 layer includes one or more opening portions, and the layered product is exposed at the opening portion,
the n-type Group III nitride semiconductor layer has a recess at the one or more opening portions of the RAMO 4 layer,
the n-type electrode is electrically connected to the n-type Group III nitride semiconductor layer of the layered product, the p-type electrode is electrically connected to the p-type Group III nitride semiconductor layer of the layered product, and the n-type electrode and the p-type electrode are disposed on the same side of the layered product opposite to the RAMO 4 layer,
a thickness of the n-type Group III nitride semiconductor layer is 50 m or more, and
a thickness of the RAMO 4 layer is 10 m or less.
2. The Group III nitride semiconductor light emitting diode according to claim 1 , wherein the RAMO 4 layer is a layer including ScAlMgO 4 .