Thermoelectric cooler (TEC) having top and bottom plates with asymmetric thermal conductivity and an optical subassembly implementing the same
In general, the present disclosure is directed to a thermoelectric cooler (TEC) that includes a top plate or bottom plate being formed of a high thermal conductivity material, and the other of the top plate and bottom plate being formed of a low thermal conductivity material, with the high thermal conductivity material having a thermal conductivity at least twice, and preferably five times, that of the thermal conductivity of the low thermal conductivity material. This disparity in thermal conductivity between the top plate and bottom plate materials may be referred to herein as asymmetric thermal performance.
1. A temperature control device, the temperature control device comprising:
a first plate comprising a first material and at least one surface for coupling to a heatsink;
a second plate comprising a second material and having at least one mounting surface for coupling to an optical component;
a plurality of semiconductor elements disposed between the first and second plate to provide a thermal conduction path between the at least one mounting surface and the heatsink; and
wherein a thermal conductivity of the first material of the first plate or the second material of the second plate is at least twice that of the thermal conductivity of the other of the first material of the first plate or second material of the second plate.
2. The temperature control device of claim 1 , wherein the first material of the first plate has a thermal conductivity that is at least two times greater than that of the second material of the second plate.
3. The temperature control device of claim 1 , wherein the first material of the first plate has a thermal conductivity that is at least two times less than that of the second material of the second plate.
4. The temperature control device of claim 1 , wherein the second plate is formed of ceramic having at least 80 wt % Aluminum Nitride.
5. The temperature control device of claim 1 , wherein the first plate is formed of a ceramic having at least 80 wt % Aluminum Nitride.
6. The temperature control device of claim 1 , wherein the thermal conductivity of the first plate is at least five times that of the thermal conductivity of the second plate.
7. The temperature control device of claim 1 , wherein the thermal conductivity of the second plate is at least five times that of the thermal conductivity of the first plate.
8. The temperature control device of claim 1 , wherein the plurality of semiconductor elements are Peltier elements.
9. The temperature control device of claim 1 , further comprising a laser assembly, wherein the laser assembly includes a laser diode, and wherein the laser diode is mounted to and supported by the at least one mounting surface of the second plate to thermally couple the laser diode with the thermal conduction path.
10. An optical transmitter subassembly (TOSA) module, the TOSA module comprising:
a TOSA housing defining a cavity;
a temperature control device disposed in the cavity, the temperature control device comprising:
a first plate comprising a first material and at least one surface for thermally coupling to the TOSA housing;
a second plate comprising a second material and having at least one mounting surface for coupling to an optical component;
a plurality of semiconductor elements disposed between the first and second plate to provide a thermal conduction path between the at least one mounting surface and the TOSA housing; and
wherein a thermal conductivity of the first material of the first plate or the second material of the second plate is at least twice that of the thermal conductivity of the other of the first material of the first plate or second material of the second plate;
a laser diode to emit an associated channel wavelength, the laser diode being supported by and mounted to the at least one mounting surface and in thermal communication with the thermal conduction path.
11. The TOSA module of claim 10 , wherein the first material of the first plate has a thermal conductivity that is at least two times greater than a thermal conductivity of the second material of the second plate.
12. The TOSA module of claim 10 , wherein the first material of the first plate has a thermal conductivity that is at least two times less a thermal conductivity of the second material of the second plate.
13. The TOSA module of claim 10 , wherein the second plate is formed of ceramic having at least 80 wt % Aluminum Nitride.
14. The TOSA module of claim 10 , wherein the first plate is formed of a ceramic having at least 80 wt % Aluminum Nitride.
15. The TOSA module of claim 10 , wherein the thermal conductivity of the first plate is at least five times that of the thermal conductivity of the second plate.
16. The TOSA module of claim 10 , wherein the first plate has a thermal expansion coefficient that is substantially equal to the thermal expansion coefficient of the TOSA housing.