IP Library Granted Patent US 11,001,696
Granted Patent B2
US 11,001,696 · App. 16/511,481 · Granted May 11, 2021

UV-resistant superhydrophobic coating compositions

Inventor: Yuhsin Hawig (Carrollton, GA)
Assignee: Southwire Company, LLC
C08K3/30C08K3/22C08K3/36C09D127/12C09D127/18C09D163/00H01B1/023H01B1/026H01B3/308H01B3/40H01B3/445C08K9/06C08K2003/2296C08K2003/3009C08L2205/025C08L2205/03
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Quick Facts
Patent No.
US 11,001,696
App. No.
16/511,481
Granted
May 11, 2021
Kind
B2
Abstract

A coating composition for a substrate includes a polymer binder, one or more hydrophobic silicon dioxide compositions, and one or more UV protection agents. The polymer binder can include a fluoropolymer or an epoxy polymer resin. The coating composition can also include molybdenum disulfide.

Claims (16)

1. A method of providing a coating composition to a substrate surface of a conductor, the method comprising:

applying a liquid carrier comprising a mixture comprising a polymer binder, one or more silicon dioxide compositions, molybdenum disulfide and one or more UV protection agents to the substrate surface of the conductor to form the coating composition on the substrate surface of the conductor, wherein the substrate surface comprises a portion of an exterior surface of the conductor; and

drying the substrate surface of the conductor to remove the liquid carrier so as to form the coating composition comprising the mixture adhered to the substrate surface of the conductor;

wherein the polymer binder comprises a fluoropolymer or an epoxy polymer resin; and

wherein the coating composition comprises at least about 50% by weight of the polymer binder, from about 0.5% to about 15% by weight of the one or more silicon dioxide compositions, from about 0.1% to about 15% by weight of the molybdenum disulfide, and from about 0.1% to about 10% by weight of the one or more UV protection agents.

2. The method of claim 1 , wherein the polymer binder comprises one or more epoxy polymer resins, and the method further comprises: curing the one or more epoxy polymer resins within the liquid carrier applied to the substrate surface.

3. The method of claim 1 , wherein applying the mixture to the substrate surface further comprises:

applying the mixture as a dry powder to the substrate surface; and

heating the substrate surface to form the coating composition comprising the mixture adhered to the substrate surface.

4. The method of claim 1 , wherein applying the mixture to the substrate surface occurs without any abrasion performed on the substrate surface prior to applying the mixture.

5. A bare overhead conductor formed according to the method of claim 1 .

6. A method of providing a coating composition to a substrate surface of a conductor, the method comprising:

applying a liquid carrier comprising a mixture comprising at least about 50% by weight of a polymer binder, from about 0.5% to about 15% by weight of one or more silicon dioxide compositions, from about 0.1% to about 15% by weight of molybdenum disulfide and from about 0.1% to about 10% by weight of one or more UV protection agents to the substrate surface of the conductor to form the coating composition on the substrate surface of the conductor; and

drying the substrate surface of the conductor to remove the liquid carrier so as to form the coating composition comprising the mixture adhered to the substrate surface of the conductor;

wherein the polymer binder comprises one or more fluoropolymers, and the coating composition is formed with at least about 50% by weight of the one or more fluoropolymers.

7. A substrate including a surface coated with a coating composition according to the method of claim 6 .

Assignments (3)
RELEASE OF SECURITY INTEREST Recorded Jul 31, 2025
From: WELLS FARGO BANK, NATIONAL ASSOCIATION
To: SOUTHWIRE COMPANY, LLC; COLEMAN CABLE, LLC; TECHNOLOGY RESEARCH, LLC; SUMNER MANUFACTURING COMPANY, LLC; MADISON ELECTRIC PRODUCTS, LLC; NOVINIUM, LLC; NOVINIUM HOLDINGS, INC.; WATTEREDGE, LLC; TAPPAN WIRE & CABLE, LLC; UNITED COPPER INDUSTRIES, LLC; TOPAZ LIGHTING COMPANY LLC; OBI PARTNERS, LLC; WIIP, INC.
Reel/Frame 072299/0141 →
AMENDMENT TO GRANT OF SECURITY INTEREST Recorded Sep 20, 2021
From: COLEMAN CABLE, LLC; SUMNER MANUFACTURING COMPANY, LLC; SOUTHWIRE COMPANY, LLC
To: WELLS FARGO BANK, NATIONAL ASSOCIATION
Reel/Frame 057552/0299 →
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Mar 5, 2020
From: HAWIG, YUHSIN
To: SOUTHWIRE COMPANY, LLC
Reel/Frame 052094/0591 →