IP Library Patent Application 16512178
Patent Application
App. No. 16/512,178

Ceramic Dots Process

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Quick Facts
Patent No.
US None
App. No.
16/512,178
Abstract

A method to fuse ceramic to a metallic substrate is provided. The method includes dispensing a ceramic material onto the metallic substrate and firing of the ceramic material to the metallic substrate at a predetermined temperature. The firing of the ceramic material promotes adhesion between the ceramic material and the metallic substrate.

Claims (22)

1 . A method to fuse ceramic to a metallic substrate, the method comprising:

dispensing a ceramic material onto the metallic substrate; and

firing of the ceramic material to the metallic substrate at a temperature that promotes adhesion between the ceramic material and the metallic substrate.

2 . The method of claim 1 , wherein the metallic substrate is a stainless steel alloy.

3 . The method of claim 2 , wherein the peak firing temperature is between 800 degrees Celsius and 1100 degrees Celsius.

4 . The method of claim 2 , wherein the peak firing temperature is 965 degrees Celsius.

5 . The method of claim 1 , wherein the firing of the ceramic material is conducted in an inert atmosphere.

6 . The method of claim 5 , wherein the inert atmosphere includes Argon.

7 . The method of claim 5 , wherein the inert atmosphere includes Nitrogen.

8 . The method of claim 1 , wherein firing of the ceramic material is conducted in a reducing atmosphere.

9 . The method of claim 8 , wherein the reducing atmosphere includes ammonia.

10 . The method of claim 8 , wherein the reducing atmosphere includes an active reducing agent that causes a depletion of oxygen.

11 . The method of claim 8 , where the reducing atmosphere includes forming gas.

12 . The method of claim 8 , wherein the reducing atmosphere includes hydrogen.

13 . The method of claim 8 , wherein the reducing atmosphere includes a mixture of gases including hydrogen and one or more noble gases.

14 . The method of claim 1 , wherein the metallic substrate is a stainless steel substrate, and cooling the stainless steel substrate to a negative 73 degrees Celsius and heating the stainless steel substrate to 510 degrees Celsius.

15 . The method of claim 1 , wherein the ceramic material includes ceramic paste material.

16 . The method of claim 1 , wherein dispensing the ceramic material includes using a jet dispensing process that dispenses the ceramic material in a pattern of ceramic dots.

17 . The method of claim 16 , wherein the jet dispensing process enables customization of size and height of each of the ceramic dots.

18 . The method of claim 1 , wherein dispensing the ceramic material includes using a time and pressure needle dispensing process that dispense the ceramic material in a pattern of ceramic dots.

19 . The method of claim 18 , wherein the time and pressure needle dispensing process provides a metered amount of material dispensed by controlling time and pressure.

20 . The method of claim 19 , wherein the time and pressure needle dispensing process includes positioning a needle over each ceramic dot for a prescribed time period to allow for a consistent tail break.

Assignments (10)
TERMINATION AND RELEASE OF SECURITY AGREEMENTS Recorded Jun 18, 2024
From: BARINGS FINANCE LLC
To: RESONETICS SMART MATERIALS INC.; MOUND LASER & PHOTONICS CENTER, INC.; RESONETICS, LLC
Reel/Frame 067778/0281 →
NOTICE OF SUCCESSION OF AGENCY FOR SECURITY AGREEMENT RECORDED 4/30/21 AT REEL/FRAME 56104/0703 Recorded Jul 3, 2023
From: CREDIT SUISSE AG, CAYMAN ISLANDS BRANCH
To: GOLDMAN SACHS BANK USA
Reel/Frame 064236/0331 →
SECOND LIEN SECURITY AGREEMENT Recorded May 3, 2021
From: RESONETICS, LLC; MOUND LASER & PHOTONICS CENTER, INC.; TRU TECH SYSTEMS, INC.
To: BARINGS FINANCE LLC
Reel/Frame 056121/0144 →
FIRST LIEN SECURITY AGREEMENT Recorded Apr 30, 2021
From: TRU TECH SYSTEMS, INC.; RESONETICS, LLC; MOUND LASER & PHOTONICS CENTER, INC.
To: CREDIT SUISSE AG, CAYMAN ISLANDS BRANCH
Reel/Frame 056104/0703 →
RELEASE OF SECURITY INTEREST Recorded Apr 29, 2021
From: BMO HARRIS BANK N.A.
To: MOUND LASER & PHOTONICS CENTER, INC.
Reel/Frame 056084/0463 →
RELEASE OF SECURITY INTEREST Recorded Apr 29, 2021
From: THE NORTHWESTERN MUTUAL LIFE INSURANCE COMPANY
To: MOUND LASER & PHOTONICS CENTER, INC.
Reel/Frame 056086/0338 →
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Dec 17, 2020
From: HUTCHINSON TECHNOLOGY INCORPORATED
To: MOUND LASER & PHOTONICS CENTER, INC.
Reel/Frame 054680/0672 →
SECURITY INTEREST Recorded Nov 3, 2020
From: MOUND LASER & PHOTONICS CENTER, INC.
To: THE NORTHWESTERN MUTUAL LIFE INSURANCE COMPANY, AS COLLATERAL AGENT
Reel/Frame 054251/0319 →
SECURITY INTEREST Recorded Nov 2, 2020
From: MOUND LASER & PHOTONICS CENTER, INC.
To: BMO HARRIS BANK N.A., AS COLLATERAL AGENT
Reel/Frame 054242/0095 →
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Oct 8, 2019
From: PESAVENTO, PAUL V.; LADWIG, PETER F.; DAVIS, MICHAEL W.
To: HUTCHINSON TECHNOLOGY INCORPORATED
Reel/Frame 050657/0310 →