Memory-based distributed processor architecture
Distributed processors and methods for compiling code for execution by distributed processors are disclosed. In one implementation, a distributed processor may include a substrate; a memory array disposed on the substrate; and a processing array disposed on the substrate. The memory array may include a plurality of discrete memory banks, and the processing array may include a plurality of processor subunits, each one of the processor subunits being associated with a corresponding, dedicated one of the plurality of discrete memory banks. The distributed processor may further include a first plurality of buses, each connecting one of the plurality of processor subunits to its corresponding, dedicated memory bank, and a second plurality of buses, each connecting one of the plurality of processor subunits to another of the plurality of processor subunits.
1. A memory chip, comprising:
a plurality of memory banks, each memory bank having a bank row decoder, a bank column decoder, and a plurality of memory sub-banks, each memory sub-bank having a sub-bank row decoder and a sub-bank column decoder for allowing reads and writes to locations on the memory sub-bank, each memory sub-bank comprising:
a plurality of memory mats, each memory mat having a plurality of memory cells, wherein the sub-bank row decoders and the sub-bank column decoders are configured to receive read and write requests from at least one of the bank row decoder and the bank column decoder.
2. The memory chip of claim 1 , wherein each memory sub-bank further has a sub-bank controller configured to determine whether to processor read requests and write requests from a controller of the memory bank.
3. The memory chip of claim 2 , wherein the controller of the memory is synchronized to a system clock.
4. The memory chip of claim 2 , wherein the controllers of the memory sub-banks are not synchronized to a system clock.
5. The memory chip of claim 1 , wherein each sub-bank further has a processor subunit using the sub-bank as a dedicated memory.
6. The memory chip of claim 5 , wherein each processor subunit is configured to access a sub-bank dedicated to the processor subunit using the row decoder and the column decoder of the sub-bank without using the bank row decoder and the bank column decoder.
7. The memory chip of claim 5 , wherein the processor subunit comprises a configurable processor subunit or an accelerator.
8. A memory chip, comprising:
a plurality of memory banks, each memory bank having a bank controller and a plurality of memory sub-banks, each memory sub-bank having a sub-bank row decoder and a sub-bank column decoder for allowing reads and writes to locations on the memory sub-bank, each memory sub-bank comprising:
a plurality of memory mats, each memory mat having a plurality of memory cells, wherein the sub-bank row decoders and the sub-bank column decoders are configured to receive read and write requests from the bank controller and process read and write requests received from the bank controller.
9. The memory chip of claim 8 , wherein each memory sub-bank further has a sub-bank controller configured to determine whether to processor read requests and write requests from the bank controller.
10. The memory chip of claim 9 , wherein the bank controller is synchronized to a system clock.
11. The memory chip of claim 9 , wherein the controllers of the memory sub-banks are not synchronized to a system clock.
12. The memory chip of claim 8 , wherein each sub-bank further has a processor subunit using the sub-bank as a dedicated memory.
13. The memory chip of claim 12 , wherein each processor subunit is configured to access a sub-bank dedicated to the processor subunit using the row decoder and the column decoder of the sub-bank without using the bank controller.
14. A memory chip, comprising:
a plurality of memory banks, each memory bank having a bank controller for processing reads and writes to locations on the memory bank, each memory bank comprising:
a plurality of memory mats, each memory mat having a plurality of memory cells and having a mat row decoder and a mat column decoder, wherein the mat row decoders and the mat column decoders are configured to process read and write requests from a sub-bank controller, wherein the read and write requests are generated by the sub-bank controller independent from the bank controller.
15. The memory chip of claim 14 , wherein each memory mat further has a comparator configured to determine whether to processor read requests and write requests from the sub-bank controller based on the command address from the bank controller.
16. The memory chip of claim 14 , wherein each memory mat has an assigned address range that is determined by one or more fuses.
17. The memory chip of claim 16 , wherein the one or more fuses are configured to disable a memory mat that is faulty.
18. The memory chip of claim 14 , wherein each sub-bank further has a processor subunit using the sub-bank as a dedicated memory.
19. A memory chip, comprising:
a plurality of memory banks, each memory bank having a bank controller, a row decoder, and a column decoder for allowing reads and writes to locations on the memory bank; and
a plurality of buses connecting each controller of the plurality of bank controllers to at least one other controller of the plurality of bank controllers; and
wherein each controller is configured to process data incoming from other controllers before passing the data to the memory bank having the controller.
20. The memory chip of claim 19 , wherein the plurality of buses are configured to be accessed without interruption of data transfers on main buses of the memory banks.
21. A memory chip, comprising:
a plurality of memory banks, each memory bank having a bank controller, a row decoder, and a column decoder for allowing reads and writes to locations on the memory bank; and
a plurality of buses connecting each controller of the plurality of bank controllers to at least one other controller of the plurality of bank controllers, wherein each controller is connected to a plurality of other controllers and is configurable for selection of one other of the other controllers for sending or receiving of data.
22. The memory chip of claim 19 , wherein each memory bank comprises a dynamic random access memory bank.
23. The memory chip of claim 19 , wherein each controller is configurable and is configured to determine addresses for reading and writing in the memory bank having the controller.
24. The memory chip of claim 21 , wherein each controller is configured to process data incoming from other controllers before passing the data to the memory bank having the controller.
25. The memory chip of claim 19 , wherein each controller is connected to another spatially adjacent controller.
26. The memory chip of claim 14 , wherein the sub-bank controller is configured to return an error message upon receiving a control signal from the bank controller while the read and write requests are being processed.