Performing an operation on a memory cell of a memory system at a frequency based on temperature
A temperature associated with the memory component is determined. A frequency to perform an operation on a memory cell associated with the memory component is determined based on the temperature associated with the memory component. The operation is performed on the memory cell at the determined frequency to transition the memory cell from a state associated with an increased error rate for data stored at the memory cell to another state associated with a decreased error rate for the data stored at the memory cell.
1. A system comprising:
a memory component; and
a processing device, operatively coupled with the memory component, to:
determine a temperature associated with the memory component;
determine a frequency to perform an operation on a memory cell associated with the memory component based on the temperature associated with the memory component; and
perform the operation on the memory cell at the determined frequency to transition the memory cell from a physical state associated with an increased error rate for data stored at the memory cell to another physical state associated with a decreased error rate for the data stored at the memory cell.
2. The system of claim 1 , wherein the another physical state associated with the decreased error rate for the data stored at the memory cell corresponds to a distribution of electrons at the memory cell, and the physical state associated with the increased error rate for the data stored at the memory cell corresponds to a different distribution of electrons at the memory cell.
3. The system of claim 1 , wherein the operation corresponds to an application of a voltage to a word line of the memory cell without returning the data stored at the memory cell when the voltage is applied to the word line.
4. The system of claim 1 , wherein the operation corresponds to a read operation of the memory cell.
5. The system of claim 1 , wherein the determined frequency is increased for a lower determined temperature than when the memory component is associated with a higher determined temperature.
6. The system of claim 1 , wherein the processing device is further to:
determine a number of times that the operation to transition the memory cell has been performed;
determine whether the number of times that the operation has been performed exceeds a threshold; and
in response to determining that the number of times that the operation has been performed exceeds the threshold, determine to not perform a subsequent operation on the memory cell to transition the memory cell from the physical state associated with the increased error rate for the data stored at the memory cell to the another physical state associated with the decreased error rate for the data stored at the memory cell.
7. The system of claim 6 , wherein the processing device is further to:
determine an amount of time that has elapsed since the operation has been performed exceeds a second threshold; and
in response to the amount of time that has elapsed since the operation has been performed exceeds the second threshold, perform the subsequent operation on the memory cell to transition the memory cell from the physical state associated with the increased error rate for the data stored at the memory cell to the another physical state associated with the decreased error rate for the data stored at the memory cell.
8. A method comprising:
determining a temperature associated with a memory component;
determining a frequency to perform an operation on a memory cell associated with the memory component based on the temperature associated with the memory component; and
performing, by a processing device, the operation on the memory cell at the determined frequency to keep the memory cell in a physical state associated with a decreased error rate for the data stored at the memory cell.
9. The method of claim 8 , wherein the physical state associated with the decreased error rate for the data stored at the memory cell corresponds to a distribution of electrons at the memory cell.
10. The method of claim 8 , wherein the operation corresponds to an application of a voltage to a word line of the memory cell without returning the data stored at the memory cell when the voltage is applied to the word line.
11. The method of claim 8 , wherein the operation corresponds to a read operation of the memory cell.
12. The method of claim 8 , wherein the determined frequency is increased for a lower determined temperature than when the memory component is associated with a higher determined temperature.
13. The method of claim 8 , further comprising:
determining a number of times that the operation to keep the memory cell in the physical state associated with the decreased error rate for the data stored at the memory cell has been performed;
determining whether the number of times that the operation has been performed exceeds a threshold; and
in response to determining that the number of times that the operation has been performed exceeds the threshold, determining to not perform a subsequent operation on the memory cell to keep the memory cell in the physical state associated with the decreased error rate for the data stored at the memory cell.
14. The method of claim 13 , further comprising:
determining an erase operation has been performed on the memory cell; and
in response to determining the erase operation has been performed on the memory cell, performing the subsequent operation on the memory cell to keep the memory cell in the physical state associated with the decreased error rate for the data stored at the memory cell.
15. A non-transitory computer-readable storage medium comprising instructions that, when executed by a processing device, cause the processing device to:
determine a temperature associated with a memory component;
determine a frequency to perform an operation on a memory cell associated with the memory component based on the temperature associated with the memory component; and
perform the operation on the memory cell at the determined frequency to transition the memory cell from a physical state associated with an increased error rate for data stored at the memory cell to another physical state associated with a decreased error rate for the data stored at the memory cell.
16. The non-transitory computer-readable storage medium of claim 15 , wherein the another physical state associated with the decreased error rate for the data stored at the memory cell corresponds to a distribution of electrons at the memory cell, and the physical state associated with the increased error rate for the data stored at the memory cell corresponds to a different distribution of electrons at the memory cell.
17. The non-transitory computer-readable storage medium of claim 15 , wherein the operation corresponds to an application of a voltage to a word line of the memory cell without returning the data stored at the memory cell when the voltage is applied to the word line.
18. The non-transitory computer-readable storage medium of claim 15 , wherein the operation corresponds to a read operation of the memory cell.
19. The non-transitory computer-readable storage medium of claim 15 , wherein the determined frequency is increased for a lower determined temperature than when the memory component is associated with a higher determined temperature.
20. The non-transitory computer-readable storage medium of claim 15 , wherein the processing device is further to:
determine a number of times that the operation to transition the memory cell has been performed;
determine whether the number of times that the operation has been performed exceeds a threshold; and
in response to determining that the number of times that the operation has been performed exceeds the threshold, determine to not perform a subsequent operation on the memory cell to transition the memory cell from the physical state associated with the increased error rate for the data stored at the memory cell to the another physical state associated with the decreased error rate for the data stored at the memory cell.