High Tg epoxy formulation with good thermal properties
Varnish compositions and prepregs and laminates made therefrom wherein the varnish compositions include at least one first epoxy resin and at least one second epoxy resin that includes a bisphenol-A novolac epoxy resin and a harder wherein the at least one first epoxy resin and the at least one second bisphenol-A novolac epoxy resin are present in the varnish at a weight ratio ranging from about 1:1 to about 1:3.
1. A varnish composition comprising:
from about 20 wt % to about 28.6 wt % on an epoxy resin weight basis of a multifunctional epoxy resin, wherein the multi-functional resin is not an eight-functional bisphenol-A novolac epoxy resin;
from about 36 wt % to about 53.3 wt % on an epoxy resin weight basis of an eight-functional bisphenol-A novolac epoxy resin;
from about 20 wt % to about 44 wt % on an epoxy resin weight basis of a bifunctional epoxy resin; and
a hardener, wherein the multi-functional epoxy resin and the eight functional bisphenol-A novolac epoxy resin are present in the varnish at a weight ratio ranging from about 1:1.8 to about 1:2.0.
2. A resin coated copper sheet comprising a planar copper sheet coated on at least one planar surface with the varnish of claim 1 .
3. The varnish of claim 1 wherein the hardener is an aromatic amine.
4. The varnish of claim 3 wherein the aromatic amine hardener is 4,4′-diaminodiphenylsulfone.
5. The varnish of claim 3 wherein the aromatic amine hardener is 3,3′-diaminodiphenylsulfone.
6. The varnish of claim 1 further including at least one flame retardant.
7. The varnish of claim 6 wherein the at least one flame retardant is present in the varnish in an amount ranging from about amount ranging from about 5 wt % to about 50 wt % on a total laminate weight basis.
8. The varnish of claim 6 wherein the at least one flame retardant is present in the varnish in an amount ranging from about 10 wt % to about 30 wt % on a total laminate weight basis.
9. The varnish of claim 6 wherein the at least one flame retardant is decabromodiphenylethane.
10. The varnish of claim 1 wherein the hardener is present in an amount ranging from about 2.0 to about 25 wt % on a total laminate weight basis.
11. A prepreg comprising a b-staged varnish composition including:
from about 20 wt % to about 28.6 wt % on an epoxy resin weight basis of a multifunctional epoxy resin, wherein the multi-functional resin is not an eight-functional bisphenol-A novolac epoxy resin;
from about 36 wt % to about 53.3 wt % on an epoxy resin weight basis of an eight-functional bisphenol-A novolac epoxy resin;
from about 20 wt % to about 44 wt % on an epoxy resin weight basis of a bifunctional epoxy resin; and
a hardener, wherein the multi-functional epoxy resin and the eight functional bisphenol-A novolac epoxy resin are present in the varnish at a weight ratio ranging from about 1:1.8 to about 1:2.0.
12. The prepreg of claim 11 that when c-staged has a DMA Tg in excess of 280° C. and a T288 time in excess of 20 minutes.
13. A printed circuit board including at least one layer that is a c-staged prepreg of claim 11 .