Eight spring dual substrate MEMS plate switch and method of manufacture

1. An electrostatic MEMS device, comprising:

a first movable plate suspended adjacent to a first substrate and coupled to the first substrate by four pairs of spring beams, wherein the first plate has a square shape with corners and four perpendicular edges, and wherein the each pair has two spring beam members and wherein the two members are substantially collinear and are connected to each corner;

at least one electrical contact formed on a second substrate, wherein the first plate is configured to move toward the at least one electrical contact; and

a seal which couples the first substrate to the second substrate, and seals the MEMS switch, wherein each pair of spring beams is defined by a primary L-shaped void and a secondary void disposed adjacent and parallel to the primary L-shaped void, at least along a portion of the L-shaped void.

2. The electrostatic MEMS device of claim 1 , wherein each of the pairs of spring beams are attached to the substrate by an anchor point at about the midpoint between the two members of the pair of spring beams.

3. The electrostatic MEMS device of claim 1 , wherein each spring beam disposed along one side of the first movable plate shares the primary L-shaped void with another spring beam disposed on another side of the first movable plate, wherein the one side and the another side are orthogonal to one another.

4. The electrostatic MEMS device of claim 1 , wherein each of the spring beams is configured to flex during electrostatic actuation of the MEMS device, thereby allowing the first movable plate to move towards the at least one electrical contact when the electrostatic MEMS device is actuated, and provide a restoring force when the actuation is ended.

5. The electrostatic MEMS device of claim 1 , wherein in addition to the primary L-shaped and secondary voids is a tertiary void, contiguous with the secondary void, and which forms an auxiliary flexion structure, wherein the auxiliary flexion structure contributes more flexibility to the movement of the first movable plate.

6. The electrostatic MEMS device of claim 5 , wherein the auxiliary flexion structure is substantially parallel to the pair of spring beams along an edge of the square, along at least a portion of a length of the pair of spring beams.

7. The electrostatic MEMS device of claim 5 , wherein the tertiary void is also L-shaped, and includes a 90 degree bend, such that the tertiary void is substantially parallel to the secondary void over a portion of its length, and perpendicular to the secondary void over another portion of its length.

8. The electrostatic MEMS device of claim 1 , wherein the first substrate is a silicon-on-insulator substrate including a device layer, a handle layer and a dielectric layer between the device layer and the handle layer, and the second substrate is at least one of a silicon substrate and a silicon-on-insulator substrate.

9. The electrostatic MEMS device of claim 8 , further comprising:

electrical vias formed through a thickness of the second substrate; and

an adjacent electrostatic electrode formed on the second substrate.

10. The electrostatic MEMS device of claim 8 , wherein the actuation force arises between the first movable plate and the adjacent electrostatic electrode, when a voltage is applied between the first movable plate and the adjacent electrostatic electrode.

11. The electrostatic MEMS device of claim 1 , wherein the seal comprises:

a gold/indium alloy which bonds the first substrate to the second substrate with a substantially hermetic seal around the MEMS device.

12. A method for manufacturing an electrostatic MEMS device, comprising: forming a first movable plate suspended adjacent to a first substrate and coupled to the first substrate by four pairs of spring beams, wherein the first plate has a square shape with corners and four perpendicular edges, and wherein the each pair of spring beams has two spring beam members which are substantially collinear and are connected to each corner; forming at least one electrical contact on a second substrate, wherein the first plate is configured to move toward the at least one electrical contact; and coupling the first substrate to the second substrate with a seal that seals the MEMS device; wherein each pair of spring beams is defined by a primary L-shaped void and a secondary void disposed adjacent and parallel to the primary L-shaped void, at least along a portion of the L-shaped void.

13. The method of claim 12 , wherein each of the pairs of spring beams are attached to the substrate by an anchor point at about the midpoint between the two members of the pair of spring beams.

14. The method of claim 12 , wherein each pair of spring beams is formed by a primary L-shaped void and a secondary void disposed adjacent to the L-shaped void, at least along a portion of the L-shaped void.

15. The method of claim 12 , wherein each spring beam disposed along one side of the first movable plate shares a primary L-shaped void with another spring beam disposed on another side of the first movable plate, wherein the one side and the another side are orthogonal to one another.

16. The method of claim 12 , wherein each of the spring beams is configured to flex during electrostatic actuation of the MEMS device.

17. The method of claim 12 , wherein in addition to the primary L-shaped and secondary voids is a tertiary void, contiguous with the secondary void, and which forms an auxiliary flexion structure, wherein the auxiliary flexion structure contributes more flexibility to each of the spring beams.

18. The method of claim 12 , wherein the auxiliary flexion structure is defined by an additional L-shaped void formed in the first substrate, adjacent to the first and second voids.