IP Library Granted Patent US 11,122,718
Granted Patent B2
US 11,122,718 · App. 16/516,433 · Granted Sep 14, 2021

System and method for device level electromagnetic interference management

Inventors: Steven Embleton (Round Rock, TX); Ben John Sy (Austin, TX); Eric Michael Tunks (Austin, TX)
Assignee: Dell Products L.P.
H05K9/0062H05K7/1492H05K7/20
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Quick Facts
Patent No.
US 11,122,718
App. No.
16/516,433
Granted
Sep 14, 2021
Kind
B2
Abstract

A data processing device includes an internal volume that is electromagnetic interference (EMI) isolated for housing EMI emitting devices, the internal volume is isolated by at least 80 decibels. The data processing device further includes a thermal management system adapted to control a flow of gas through the internal volume. The data processing device further includes a chassis, adapted to mount to a frame. The chassis includes the internal volume and the thermal management system. The thermal management system is disposed outside of the internal volume.

Claims (46)

1. A data processing device, comprising:

an internal volume that is electromagnetic interference (EMI) isolated for housing EMI emitting devices, wherein the internal volume is isolated by at least 80 decibels;

a thermal management system adapted to control a flow of gas through the internal volume; and

a chassis, adapted to mount to a frame, comprising the internal volume and the thermal management system,

wherein the thermal management system is disposed outside of the internal volume.

2. The data processing device of claim 1 , further comprising

a communications system adapted to provide communications services to the EMI emitting devices,

wherein the communications system is disposed outside the internal volume.

3. The data processing device of claim 2 , wherein the communication system comprises:

a mid-plane interconnecting a portion of the EMI emitting devices and a transceiver of the communication system.

4. The data processing device of claim 2 , wherein the communication system further comprises:

a back-plane that defines a portion of a side of the internal volume.

5. The data processing device of claim 4 , wherein the back-plane comprises feedthroughs corresponding to physical connections between the EMI emitting devices and the communications system.

6. The data processing device of claim 5 , wherein the feedthroughs comprise shielded extrusions having a shape corresponding to a shape of an interconnect of the EMI emitting devices.

7. The data processing device of claim 1 , further comprising:

a power system adapted to power a portion of the EMI emitting devices.

8. The data processing device of claim 7 , wherein the power system is disposed outside of the internal volume.

9. The data processing device of claim 1 , wherein the thermal management system comprises:

a vent that defines a portion of a side of the internal volume; and

a flow control device that controls a flowrate of the flow of gas.

10. The data processing device of claim 9 , wherein the thermal management system controls the flowrate based on thermal state information obtained from the electromagnetic interference emitting devices.

11. A system for providing electromagnetic interference (EMI) suppression for data processing devices, comprising:

a frame adapted to receive a first data processing device of the data processing devices and a second data processing device of the data processing devices;

the data processing device comprising:

a first internal volume for housing a first set of EMI emitting devices that is EMI isolated by at least 80 decibels, and

a first support module; and

a second data processing device of the data processing device, the second data processing device comprising:

a second internal volume for housing a second set of EMI emitting devices that is EMI isolated, and

a second support module.

12. The system of claim 11 , wherein the first support module is not EMI isolated from the second support module.

13. The system of claim 11 , wherein the first support module is EMI isolated from the second set of EMI emitting devices via the second internal volume.

14. The system of claim 11 , wherein the first support module is EMI isolated from the first set of EMI emitting devices via the first internal volume.

15. The system of claim 11 , wherein the second support module is EMI isolated from the first set of EMI emitting devices via the first internal volume.

16. The system of claim 11 , wherein the second support module is EMI isolated from the second set of EMI emitting devices via the second internal volume.

17. A method for managing electromagnetic interference (EMI), comprising:

disposing an EMI emitting device that emits the EMI in an internal volume, that is EMI isolated by at least 80 decibels, of a data processing device;

while the EMI emitting device is disposed in the internal volume:

providing power to the EMI emitting device via a support module, of the data processing device, that is not EMI isolated;

providing communication services to the EMI emitting device via the support module; and

providing thermal management services to the EMI emitting device via the support module.

18. The method of claim 17 , wherein providing the thermal management services to the EMI emitting device comprises:

generating a gas flow through the internal volume using a flow control device disposed outside of the internal volume.

19. The method of claim 18 , wherein the gas flow through the internal volume is generated by generating a first gas flow outside of the internal volume and directing the generated first gas flow through a first vent that defines a first side of the internal volume and through a second vent that defines a second side of the internal volume.

20. The method of claim 17 , wherein providing the communication services to the EMI emitting device comprises:

sending network data units through an interconnect to the EMI emitting device,

wherein the interconnected is attached to the EMI emitting device via a feedthrough that traverses a backplane that defines a side of the internal volume.

Assignments (9)
RELEASE OF SECURITY INTEREST IN PATENTS PREVIOUSLY RECORDED AT REEL/FRAME (053546/0001) Recorded Jun 23, 2022
From: THE BANK OF NEW YORK MELLON TRUST COMPANY, N.A., AS NOTES COLLATERAL AGENT
To: DELL MARKETING L.P. (ON BEHALF OF ITSELF AND AS SUCCESSOR-IN-INTEREST TO CREDANT TECHNOLOGIES, INC.); DELL INTERNATIONAL L.L.C.; DELL PRODUCTS L.P.; DELL USA L.P.; EMC CORPORATION; DELL MARKETING CORPORATION (SUCCESSOR-IN-INTEREST TO FORCE10 NETWORKS, INC. AND WYSE TECHNOLOGY L.L.C.); EMC IP HOLDING COMPANY LLC
Reel/Frame 071642/0001 →
RELEASE OF SECURITY INTEREST IN PATENTS PREVIOUSLY RECORDED AT REEL/FRAME (053311/0169) Recorded Jun 23, 2022
From: THE BANK OF NEW YORK MELLON TRUST COMPANY, N.A., AS NOTES COLLATERAL AGENT
To: DELL PRODUCTS L.P.; EMC CORPORATION; EMC IP HOLDING COMPANY LLC
Reel/Frame 060438/0742 →
RELEASE OF SECURITY INTEREST IN PATENTS PREVIOUSLY RECORDED AT REEL/FRAME (050724/0571) Recorded Jun 23, 2022
From: THE BANK OF NEW YORK MELLON TRUST COMPANY, N.A., AS NOTES COLLATERAL AGENT
To: DELL PRODUCTS L.P.; EMC CORPORATION; EMC IP HOLDING COMPANY LLC
Reel/Frame 060436/0088 →
RELEASE OF SECURITY INTEREST AT REEL 050406 FRAME 421 Recorded Nov 2, 2021
From: CREDIT SUISSE AG, CAYMAN ISLANDS BRANCH
To: DELL PRODUCTS L.P.; EMC CORPORATION; EMC IP HOLDING COMPANY LLC
Reel/Frame 058213/0825 →
SECURITY INTEREST Recorded Jun 5, 2020
From: DELL PRODUCTS L.P.; EMC CORPORATION; EMC IP HOLDING COMPANY LLC
To: THE BANK OF NEW YORK MELLON TRUST COMPANY, N.A., AS COLLATERAL AGENT
Reel/Frame 053311/0169 →
SECURITY AGREEMENT Recorded Apr 22, 2020
From: CREDANT TECHNOLOGIES INC.; DELL INTERNATIONAL L.L.C.; DELL MARKETING L.P.; DELL PRODUCTS L.P.; DELL USA L.P.; EMC CORPORATION; FORCE10 NETWORKS, INC.; WYSE TECHNOLOGY L.L.C.; EMC IP HOLDING COMPANY LLC
To: THE BANK OF NEW YORK MELLON TRUST COMPANY, N.A.
Reel/Frame 053546/0001 →
PATENT SECURITY AGREEMENT (NOTES) Recorded Oct 15, 2019
From: DELL PRODUCTS L.P.; EMC CORPORATION; EMC IP HOLDING COMPANY LLC
To: THE BANK OF NEW YORK MELLON TRUST COMPANY, N.A., AS COLLATERAL AGENT
Reel/Frame 050724/0571 →
SECURITY AGREEMENT Recorded Sep 17, 2019
From: DELL PRODUCTS L.P.; EMC CORPORATION; EMC IP HOLDING COMPANY LLC
To: CREDIT SUISSE AG, CAYMAN ISLANDS BRANCH
Reel/Frame 050406/0421 →
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Jul 26, 2019
From: EMBLETON, STEVEN; SY, BEN JOHN; TUNKS, ERIC MICHAEL
To: DELL PRODUCTS L.P.
Reel/Frame 049867/0254 →