IP Library Granted Patent US 10,951,748
Granted Patent B2
US 10,951,748 · App. 16/517,662 · Granted Mar 16, 2021

Electronic device for use in a teleconference

Inventor: Tatsuya Ushioda (Yokohama, JP)
Assignee: LENOVO (SINGAPORE) PTE. LTD.
H04M1/6033H04M1/03H04M1/62H04R1/025H04M1/0297H04M1/035H04R1/406H04R3/005
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Quick Facts
Patent No.
US 10,951,748
App. No.
16/517,662
Granted
Mar 16, 2021
Kind
B2
Abstract

An electronic device includes a chassis which has mutually partitioned first chamber, second chamber and third chamber, an electronic substrate which is housed in the first chamber, loudspeaker modules which are housed in the second chamber and the microphones which are housed in the third chamber.

Claims (29)

1. An electronic device comprising:

a chassis which has mutually partitioned chambers, including a first chamber, a second chamber and a third chamber;

an electronic substrate housed in the first chamber;

a loudspeaker housed in the second chamber; and

a microphone housed in the third chamber, wherein:

the chassis includes a first chassis in which the first chamber and the second chamber are disposed, and a second chassis attached to an upper surface of the first chassis and in which the third chamber is disposed,

an inner space of the first chassis is partitioned into two upper and lower stages with a frame member, and thereby the second chamber is above the first chamber, and

the loudspeaker is on an upper surface of the frame member.

2. The electronic device according to claim 1 , further comprising:

a cooling module housed in the first chamber and disposed above the electronic substrate, wherein:

the cooling module has a fan which sucks air from outside of the first chamber and exhausts the air to the outside of the first chamber, and has a fin disposed in an air flow path which is created by the fan and absorbs heat generated from a heating element mounted on the electronic substrate.

3. The electronic device according to claim 2 , wherein:

the first chassis has a disc-shaped bottom section and a peripheral surface section disposed on the bottom section, and has a conical outer peripheral surface having an outer diameter thereof that is gradually reduced in an upward direction, and

the second chassis is in a disc shape and is attached to an upper surface of the peripheral surface section.

4. The electronic device according to claim 3 , wherein:

an input operation section is in the second chassis.

5. The electronic device according to claim 3 , wherein:

the frame member has a protruding part which extends along a front-rear direction of the first chassis and is expanded upward, and has one pair of plane parts which is on both sides of the protruding part in a right-left direction which is orthogonal to a direction that the protruding part extends,

the loudspeaker is on each of one pair of the plane parts and

the cooling module is at least partially housed in a space which is formed on a lower surface side of the protruding part and makes air flow along the front-rear direction.

6. The electronic device according to claim 5 , wherein:

a suction port, through which air is sucked into the first chamber, is on one side of the bottom section in the front-rear direction, and an exhaust port, through which the air is exhausted from the first chamber, is on the other side of the bottom section in the front-rear direction.

7. The electronic device according to claim 5 , wherein:

a connection terminal to which a cable, which electrically connects the electronic substrate with an external device is to be connected, is on the bottom section and

the connection terminal is at a position where the connection terminal overlaps the air flow path created by the fan of the cooling module.

8. The electronic device according to claim 5 , wherein:

the loudspeaker on the plane part, which is located on left of the protruding part, faces an inner surface of the peripheral surface section with a gap being interposed therebetween by being arranged to direct toward diagonally upper left in the right-left direction,

the loudspeaker on the plane part which is located on right of the protruding part, faces the inner surface of the peripheral surface section with a gap being interposed therebetween by being arranged to direct toward diagonally upper right in the right-left direction, and

holes are in the peripheral surface section at least at positions where the holes face the loudspeakers.

Assignments (3)
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Feb 20, 2025
From: LENOVO PC INTERNATIONAL LIMITED
To: LENOVO SWITZERLAND INTERNATIONAL GMBH
Reel/Frame 070269/0092 →
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Feb 19, 2025
From: LENOVO (SINGAPORE) PTE LTD.
To: LENOVO PC INTERNATIONAL LIMITED
Reel/Frame 070268/0984 →
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Jul 22, 2019
From: USHIODA, TATSUYA
To: LENOVO (SINGAPORE) PTE. LTD.
Reel/Frame 049810/0289 →
Priority Claims (1)
JP JP2019-079464 · Apr 18, 2019 · national
Continuity (1)
Related Publication 20200336813A1 · Oct 22, 2020